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SPC584C70E5QM01X

STMicroelectronics

SPC584C70E5QM01X by STMicroelectronics

SPC584C70E5QM01X by STMicroelectronics is a 32-bit microcontroller with a max supply voltage of 1.26V and operates in extreme temperatures from -40 °C to 125 °C. It features integrated cache, DMA channels, and supports various connectivity options like Ethernet and UART. Ideal for automotive applications, it ensures reliable performance with AEC-Q100 screening.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 10,026 parts In-Stock

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10,026

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Digiode

USA . 3,048 parts In-Stock

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3,048

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Anansix

USA . 2,234 parts In-Stock

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2,234

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 212 parts In-Stock

1+ parts

$19.130

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-

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212

$19.130

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IDEA Electronic Components Group

UK . 1,242 parts In-Stock

1+ parts

$25.984

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-

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$23.385

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1,242

$25.984

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$23.385

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Microchip USA

USA . 2,650 parts In-Stock

1+ parts

$39.301

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2,650

$39.301

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MKK Technologies

India . 2,003 parts In-Stock

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$48.860

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2,003

$48.860

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DigiPath Technology Company

USA . 2,003 parts In-Stock

1+ parts

$48.860

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2,003

$48.860

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Component Stockers USA

USA . 372 parts In-Stock

1+ parts

$154.010

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372

$154.010

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Corphita

USA . 2,386 parts In-Stock

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2,386

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Parana Technologies

USA . 1,607 parts In-Stock

1+ parts

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$31.067

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1,607

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$31.067

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Overview

Unlock unparalleled performance with the SPC584C70E5QM01X microcontroller from STMicroelectronics, a trusted leader in innovative technology. Designed for automotive and industrial applications, this high-quality solution ensures reliability even in extreme conditions. With advanced features like integrated cache and multiple connectivity options, it empowers your projects while optimizing power consumption. Elevate your designs with STMicroelectronics’ commitment to quality and excellence, making every application smarter and more efficient.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection from environmental factors, making it suitable for various applications.

Integrated Cache: YES

An integrated cache improves data access speed, enhancing overall performance in processing tasks.

Surface Mount: YES

Surface mount technology allows for a compact design and easy integration into modern electronic circuits.

Maximum Supply Voltage: 1.26 V

Low maximum supply voltage minimizes energy consumption, making it ideal for battery-powered applications.

On Chip Data RAM Width: 8

An 8-bit data width aids in efficient data handling, suitable for various microcontroller applications.

Screening Level: AEC-Q100

Compliance with AEC-Q100 screening level ensures reliability in automotive applications, meeting stringent automotive standards.

Package Shape: SQUARE

A square package shape optimizes PCB space usage, allowing for compact circuit designs.

Bit Size: 32

A 32-bit architecture enables advanced computing capabilities, suitable for complex algorithms and applications.

No. of Terminals: 144

A high number of terminals provides extensive connectivity options for peripheral devices.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

This package style allows for efficient heat dissipation and accommodates tight spaces on PCBs.

Minimum Supply Voltage: 1.14 V

A low minimum supply voltage ensures consistent operation in power-constrained applications.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature allows this microcontroller to perform in demanding thermal environments.

CPU Family: E200Z4

The E200Z4 CPU family offers advanced processing capabilities for a wide range of applications.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely low temperatures, this microcontroller is suitable for harsh environments.

ADC Channels: YES

On-chip ADC channels facilitate real-time data acquisition, making it suitable for sensor applications.

DMA Channels: YES

DMA channels enhance data transfer efficiency, allowing for improved system performance.

Terminal Position: QUAD

Quad terminal positioning enables versatile mounting arrangements on PCBs.

ROM Words: 2097152

A large ROM size allows for extensive program storage capabilities, supporting complex applications.

Maximum Seated Height: 1.2 mm

A low seated height ensures compatibility with low-profile designs and compact packaging.

Width: 20 mm

A standardized width allows for easy integration into existing PCB layouts.

Data EEPROM Size: 128K

A substantial EEPROM size supports data retention needs in a variety of applications.

Boundary Scan: YES

Boundary scan capability aids in testing and debugging, enhancing manufacturing efficiency.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

A rich set of integrated peripherals supports complex system designs, reducing the need for external components.

Maximum Clock Frequency: 40 MHz

A high clock frequency allows for fast processing speeds, enhancing performance for demanding applications.

Length: 20 mm

Standardized length simplifies the design process and eases integration into various applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture promotes efficient processing, reducing cycle times and improving performance.

No. of Timers: 12

Multiple timers offer extensive functionality for various timing requirements in applications.

RAM Bytes: 393216

A large RAM capacity supports complex processing tasks, allowing for smoother multitasking.

Technology: CMOS

CMOS technology enhances power efficiency and performance, making the microcontroller suitable for low-power applications.

Terminal Form: GULL WING

Gull wing terminals ensure reliable soldering and easy handling during assembly.

Analog To Digital Converters: 4-Ch 12-Bit, 1-Ch 10-Bit

High-resolution ADCs facilitate accurate signal processing, ideal for embedded applications.

Maximum Supply Current: 50 mA

A low supply current helps conserve power, which is critical in battery-operated devices.

Nominal Supply Voltage: 1.2 V

A nominal supply voltage supports energy efficiency, making it ideal for portable devices.

No. of DMA Channels: 64

A high number of DMA channels provides robust data handling capabilities, improving overall system performance.

No. of Serial I/Os: 18

Plenty of serial I/Os enable versatile connectivity options for various peripherals.

PWM Channels: YES

The inclusion of PWM channels supports precise control over motors and other actuators.

Connectivity: ETHERNET, FLEXRAY(2), I2C, SPI(8), UART(18)

Extensive connectivity options allow for integration into complex networked systems.

ROM Programmability: FLASH

Flash programmability increases flexibility for updates and modifications during the product lifecycle.

Terminal Pitch: 0.5 mm

A small terminal pitch enables more compact designs, accommodating high-density layouts.

Format: FLOATING POINT

Floating point support enhances numerical computation, beneficial for applications requiring precise calculations.

Speed: 180 rpm

High speed capabilities benefit applications that require quick response times and high performance.

Low Power Mode: YES

Low power mode functionality extends battery life in portable applications, making it energy-efficient.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows for compatibility with various code architectures, ensuring flexibility in programming.

Technical Specifications

Microcontrollers SPC584C70E5QM01X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

18

No. of Terminals:

144

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP144,.87SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

RAM Bytes:

393216

ROM Words:

2097152

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

180 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

ETHERNET, FLEXRAY(2), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC584C70E5QM01X Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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