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SPC584C70E3GMC1X

STMicroelectronics

SPC584C70E3GMC1X by STMicroelectronics

SPC584C70E3GMC1X by STMicroelectronics is a 32-bit microcontroller with a max supply voltage of 1.26V and operates in extreme temperatures from -40 °C to 105 °C. It features integrated cache, DMA channels, and supports various connectivity options like Ethernet and SPI. Ideal for automotive applications, it ensures reliability with AEC-Q100 screening.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,027 parts In-Stock

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4,027

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Vyrian

USA . 2,315 parts In-Stock

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2,315

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Anansix

USA . 1,152 parts In-Stock

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1,152

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Distributors (Availability)

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AZTECH Wire

Italy . 1,164 parts In-Stock

1+ parts

$10.850

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$10.850

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IDEA Electronic Components Group

UK . 19 parts In-Stock

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$44.009

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$39.608

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19

$44.009

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$39.608

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MKK Technologies

India . 1,088 parts In-Stock

1+ parts

$82.756

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1,088

$82.756

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DigiPath Technology Company

USA . 1,088 parts In-Stock

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$82.756

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1,088

$82.756

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Corphita

USA . 4,276 parts In-Stock

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4,276

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Parana Technologies

USA . 867 parts In-Stock

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$52.620

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867

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$52.620

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Overview

Unlock exceptional performance with the SPC584C70E3GMC1X microcontroller from STMicroelectronics, a leader in innovative solutions. Designed for automotive applications, this advanced 32-bit MCU delivers reliability and efficiency, ensuring your projects meet demanding standards. With robust connectivity options and integrated peripherals, it empowers you to streamline designs while maximizing functionality, making it an invaluable asset for modern applications. Trust STMicroelectronics for quality that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance against environmental factors, making it suitable for various applications.

Integrated Cache: YES

The presence of integrated cache improves performance by allowing quicker data access, enhancing overall efficiency in processing.

Surface Mount: YES

Surface mount technology allows for a compact design, contributing to space efficiency on circuit boards.

Maximum Supply Voltage: 1.26 V

A low maximum supply voltage helps reduce power consumption, making it ideal for battery-operated devices.

On Chip Data RAM Width: 8

An 8-bit data RAM width facilitates easier handling of data and enhances compatibility with various systems.

Screening Level: AEC-Q100

Designed to meet automotive standards, this screening level ensures reliability and performance in automotive applications.

Package Shape: SQUARE

A square package shape allows for efficient layout design, optimizing space on PCBs for complex applications.

Bit Size: 32

A 32-bit architecture supports high-performance computing and large memory addressing, making it suitable for advanced applications.

No. of Terminals: 100

With 100 terminals, this microcontroller supports complex connectivity requirements, accommodating a variety of peripherals.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

This package style allows for enhanced heat dissipation and fitting into tight spaces, improving performance in demanding conditions.

Minimum Supply Voltage: 1.14 V

A low minimum supply voltage further enhances power efficiency, contributing to longer battery life in portable devices.

Maximum Operating Temperature: 105 °C

Ability to operate at higher temperatures makes this microcontroller suitable for use in harsh environments.

CPU Family: E200Z4

The E200Z4 family offers optimized performance for embedded applications, ensuring reliability and efficiency.

Minimum Operating Temperature: -40 °C

Operation in extreme temperatures makes this microcontroller versatile for outdoor or extreme condition applications.

ADC Channels: YES

The availability of ADC channels enables effective sensing and data conversion, crucial for analog input applications.

DMA Channels: YES

Direct Memory Access (DMA) capability allows efficient data transfer without CPU intervention, freeing it for other tasks.

Terminal Position: QUAD

Quad terminal positioning enhances soldering reliability and improves assembly techniques for manufacturers.

ROM Words: 2097152

A large ROM capacity supports extensive program storage, accommodating complex applications and firmware updates.

Maximum Seated Height: 1.2 mm

A low seated height contributes to a compact footprint, making it suitable for space-constrained designs.

Width: 14 mm

Compact width allows for high-density placements on PCBs, which is critical in small form factor applications.

Data EEPROM Size: 128K

With 128K EEPROM, this microcontroller can store critical configuration data and user settings effectively.

Boundary Scan: YES

Boundary scan capability enhances debugging and testing processes, reducing development time and improving reliability.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

A rich set of peripherals allows for versatile functionality in embedded systems, expanding application possibilities.

Maximum Clock Frequency: 40 MHz

A high clock frequency ensures swift processing capabilities, suitable for real-time applications.

Length: 14 mm

The length contributes to the efficient use of space, allowing for greater design flexibility.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizing a RISC architecture promotes efficient instruction processing and enhances performance for embedded applications.

No. of Timers: 12

The ability to manage multiple timers allows for complex timing functionalities, essential for various controls and processes.

RAM Bytes: 393216

A significant amount of RAM supports complex computation and multitasking, critical for demanding applications.

Technology: CMOS

CMOS technology ensures low power consumption along with high-speed operation, making it suitable for mobile applications.

Terminal Form: GULL WING

Gull-wing leads provide excellent thermal and electrical performance and are easier to solder onto PCBs.

Analog To Digital Converters: 4-Ch 12-Bit, 1-Ch 10-Bit

Multiple high-resolution ADCs allow for precise analog signal processing, which is critical for sensors and data acquisition.

Maximum Supply Current: 50 mA

A low maximum supply current contributes to energy efficiency, making it an excellent choice for battery-powered devices.

Nominal Supply Voltage: 1.2 V

A nominal supply voltage of 1.2 V is standard for low-power applications, assisting in reducing overall system power requirements.

No. of DMA Channels: 64

A high number of DMA channels facilitates efficient data transmission and processing, enhancing multitasking ability.

No. of Serial I/Os: 18

Support for multiple serial I/O channels allows versatile communication interfaces, enhancing connectivity options.

PWM Channels: YES

PWM capability supports motor control and other applications requiring precise duty cycle modulation.

Connectivity: ETHERNET, FLEXRAY(2), I2C, SPI(8), UART(18)

Extensive connectivity options provide flexibility and integration with various platforms and devices for communication.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates, ensuring that the device can be adapted to changing requirements.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for higher density layouts without compromising on signal integrity.

Format: FLOATING POINT

Floating point format supports advanced mathematical computations, making it suitable for complex algorithms.

Speed: 180 rpm

Capable of operating at 180 rpm enhances performance in applications requiring precise rotational control.

Low Power Mode: YES

Low power mode capability is essential for extending battery life in mobile applications, enhancing usability.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows for compatibility with various programming environments and builds.

Technical Specifications

Microcontrollers SPC584C70E3GMC1X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

18

No. of Terminals:

100

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

RAM Bytes:

393216

ROM Words:

2097152

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

180 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

ETHERNET, FLEXRAY(2), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC584C70E3GMC1X Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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