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SPC584C70E3F000X

STMicroelectronics

SPC584C70E3F000X by STMicroelectronics

SPC584C70E3F000X by STMicroelectronics is a 32-bit microcontroller with a max supply voltage of 1.26V and integrated cache, ideal for automotive applications. It features 64 DMA channels and operates in extreme temperatures from -40 °C to 105 °C. With advanced connectivity options like CAN and UART, it supports complex control systems efficiently.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 10,865 parts In-Stock

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10,865

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Digiode

USA . 1,592 parts In-Stock

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1,592

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Anansix

USA . 88 parts In-Stock

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88

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 3,285 parts In-Stock

1+ parts

$12.250

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3,285

$12.250

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Microchip USA

USA . 490 parts In-Stock

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$13.951

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490

$13.951

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AZTECH Wire

Italy . 853 parts In-Stock

1+ parts

$15.390

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853

$15.390

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IDEA Electronic Components Group

UK . 2,030 parts In-Stock

1+ parts

$20.590

100+ parts

-

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$18.531

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-

2,030

$20.590

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$18.531

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MKK Technologies

India . 1,097 parts In-Stock

1+ parts

$38.717

100+ parts

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1,097

$38.717

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DigiPath Technology Company

USA . 1,097 parts In-Stock

1+ parts

$38.717

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1,097

$38.717

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Component Stockers USA

USA . 673 parts In-Stock

1+ parts

$99.990

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673

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 11,508 parts In-Stock

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11,508

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Corphita

USA . 2,432 parts In-Stock

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2,432

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Futuretech Components

Singapore . 1,799 parts In-Stock

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1,799

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Parana Technologies

USA . 11 parts In-Stock

1+ parts

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$24.618

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11

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$24.618

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Overview

Unlock the potential of your designs with the SPC584C70E3F000X microcontroller from STMicroelectronics. Renowned for their commitment to quality and innovation, STMicroelectronics delivers a robust solution that excels in automotive applications. With exceptional performance at low power consumption and AEC-Q100 certification, this versatile microcontroller is perfect for enhancing efficiency in your projects while ensuring reliability and longevity. Experience unmatched value and elevate your applications today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making the microcontroller reliable for various applications.

Integrated Cache: YES

Having integrated cache enhances performance by speeding up data access, leading to improved processing efficiency.

Surface Mount: YES

Surface mount technology enables compact design and better space management on PCBs, ideal for modern electronic devices.

Maximum Supply Voltage: 1.26 V

This low maximum supply voltage indicates energy efficiency, which is crucial for battery-powered applications.

On Chip Data RAM Width: 8

The 8-bit RAM width is suitable for efficient data handling in embedded systems, providing a good balance of performance and resource usage.

Screening Level: AEC-Q100

AEC-Q100 compliance ensures that the microcontroller meets automotive standards, making it ideal for automotive applications.

Package Shape: SQUARE

The square package shape allows for efficient use of board space and easier thermal management.

Bit Size: 32

Being a 32-bit microcontroller allows for more complex computations and better processing capabilities compared to 8-bit or 16-bit alternatives.

No. of Terminals: 100

A higher number of terminals provides greater flexibility in connectivity options and interfacing with multiple peripherals.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

This package style supports efficient thermal management, ensuring the microcontroller operates effectively under various load conditions.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage helps extend battery life in portable applications, making it an energy-efficient choice.

Maximum Operating Temperature: 105 °C

Withstanding high temperatures makes this microcontroller suitable for harsh environments, ensuring reliability in various industrial applications.

CPU Family: E200Z4

The E200Z4 CPU family provides a robust architecture, enabling high-performance processing for multiple tasks.

Minimum Operating Temperature: -40 °C

The ability to operate at extremely low temperatures makes this microcontroller suitable for applications in extreme environments.

ADC Channels: YES

Inclusion of ADC channels allows for seamless integration with analog sensors, enhancing the microcontroller's versatility.

DMA Channels: YES

Direct Memory Access (DMA) channels improve data transfer efficiency, freeing up the CPU for other processing tasks.

Terminal Position: QUAD

Quad terminal position allows for better assembly techniques and enhances connectivity options on PCBs.

ROM Words: 2,097,152

Large ROM capacity ensures ample space for complex firmware, applications, or programs, meeting diverse project requirements.

Maximum Seated Height: 1.2 mm

A low profile enhances compatibility with compact designs, enabling integration into smaller devices.

Width: 14 mm

Compact width aids in placement flexibility on PCBs, allowing for denser designs.

Data EEPROM Size: 128K

A significant EEPROM size allows for extensive non-volatile data storage, making it suitable for applications requiring memory retention.

Boundary Scan: YES

Boundary scan capability facilitates easier debugging and testing, reducing overall development time.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

The inclusion of multiple peripherals enhances the microcontroller's functionality, perfect for diverse application needs.

Maximum Clock Frequency: 40 MHz

A maximum clock frequency of 40 MHz ensures fast processing speeds, aiding in real-time applications.

Length: 14 mm

Compact length contributes to space efficiency, beneficial for modern circuit board designs.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizing a RISC architecture enhances performance, enabling the execution of complex operations with lower power consumption.

No. of Timers: 12

Multiple timers allow for versatile timing operations in various applications, from motors to time-sensitive controls.

RAM Bytes: 393216

Ample RAM memory ensures that the microcontroller can efficiently handle larger data sets or multiple tasks simultaneously.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide easy soldering and excellent mechanical stability, enhancing reliability.

Analog To Digital Converters: 4-Ch 12-Bit, 1-Ch 10-Bit

The combination of multiple high-resolution ADCs facilitates precise data conversion from analog to digital, ideal for sensor interfaces.

Maximum Supply Current: 50 mA

Low supply current aids in power management, crucial for energy-sensitive applications.

Nominal Supply Voltage: 1.2 V

A nominal supply voltage of 1.2 V indicates that the microcontroller is designed for low-power operation, enhancing battery life.

No. of DMA Channels: 64

Having 64 DMA channels allows for extensive data manipulation without CPU involvement, increasing efficiency in data-intensive applications.

No. of Serial I/Os: 26

A high number of serial I/Os provides flexible options for interfacing with external devices, sensors, and communication protocols.

PWM Channels: YES

Inclusion of PWM channels allows for precise control of motors and other devices requiring variable-speed operation.

Connectivity: CAN(8), I2C, SPI(8), UART(18)

Multiple connectivity options ensure that the microcontroller can easily interface with a wide range of devices and protocols.

ROM Programmability: FLASH

Flash programmability allows for easy updates and reprogramming, making the microcontroller adaptable to changing requirements.

Terminal Pitch: 0.5 mm

A fine terminal pitch offers more pins in a smaller area, enabling more complex designs without increasing the PCB size.

Format: FLOATING POINT

The ability to handle floating-point operations enhances the microcontroller’s capability for complex calculations in applications such as digital signal processing.

Speed: 160 rpm

A speed specification of 160 rpm indicates suitability for applications requiring controlled motion or feedback mechanisms.

Low Power Mode: YES

Low power mode functionality is critical for energy conservation in portable applications, extending battery life significantly.

On Chip Program ROM Width: 8

An 8-bit program ROM width facilitates efficient execution of instructions, optimizing overall performance and resource utilization.

Technical Specifications

Microcontrollers SPC584C70E3F000X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

26

No. of Terminals:

100

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

393216

ROM Words:

2097152

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

160 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

CAN(8), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC584C70E3F000X Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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