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SPC584C70E1F0C1X

STMicroelectronics

SPC584C70E1F0C1X by STMicroelectronics

SPC584C70E1F0C1X microcontroller by STMicroelectronics features a 32-bit E200Z4 CPU, operates at 1.14-1.26V, and supports up to 40 MHz clock speed. With integrated DMA and ADC channels, it's ideal for automotive applications requiring high performance and reliability. Its AEC-Q100 screening ensures durability in harsh environments.

Median Price

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Lifecycle Status

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3

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1k+

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Vyrian

USA . 8,954 parts In-Stock

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Anansix

USA . 797 parts In-Stock

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Digiode

USA . 477 parts In-Stock

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AZTECH Wire

Italy . 1,132 parts In-Stock

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$20.360

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IDEA Electronic Components Group

UK . 2,301 parts In-Stock

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$59.257

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MKK Technologies

India . 733 parts In-Stock

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$111.429

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DigiPath Technology Company

USA . 733 parts In-Stock

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$111.429

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$111.429

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Corphita

USA . 4,473 parts In-Stock

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Parana Technologies

USA . 894 parts In-Stock

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$70.851

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Overview

Unlock the potential of your designs with the SPC584C70E1F0C1X microcontroller from STMicroelectronics, a leader in innovative semiconductor solutions. With its robust performance and superior reliability, this versatile device excels in automotive applications and industrial automation. Experience enhanced efficiency, lower power consumption, and seamless connectivity while ensuring compliance with AEC-Q100 standards. Elevate your projects with quality you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material ensures reliability and longevity in various environments.

Integrated Cache: YES

Increased performance through reduced memory access times.

Surface Mount: YES

Compact design suitable for high-density applications.

Maximum Supply Voltage: 1.26 V

Low voltage operation contributes to energy efficiency.

On Chip Data RAM Width: 8

Enhances data handling capabilities, providing flexibility for varied applications.

Screening Level: AEC-Q100

Meets automotive standards, ensuring reliability in critical environments.

Package Shape: SQUARE

Optimized for space-saving designs and easier board layouts.

Bit Size: 32

Enables processing of larger data sets and more complex algorithms.

No. of Terminals: 64

Provides extensive connectivity options for versatile integration.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Supports advanced thermal management and space-efficient designs.

Minimum Supply Voltage: 1.14 V

Low operational voltage reduces power consumption without compromising performance.

Maximum Operating Temperature: 105 °C

Suitable for high-temperature applications, enhancing its operational range.

CPU Family: E200Z4

Designed for optimized performance in embedded systems.

Minimum Operating Temperature: -40 °C

Ensures functionality in extreme cold conditions, ideal for outdoor uses.

ADC Channels: YES

Facilitates direct analog signal processing, crucial for sensor integration.

DMA Channels: YES

Enables efficient data transfer, reducing CPU load and improving performance.

Terminal Position: QUAD

Enhances layout efficiency and simplifies soldering on PCBs.

ROM Words: 2097152

Ample program storage capacity for sophisticated applications.

Maximum Seated Height: 1.2 mm

Thin profile allows for more flexible design choices in compact devices.

Width: 10 mm

Standard width suitable for a wide range of applications and designs.

Data EEPROM Size: 128K

Provides sufficient non-volatile storage for configuration and data logging.

Boundary Scan: YES

Facilitates easier debugging and testing of circuit boards.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

A comprehensive suite of peripherals supports diverse applications.

Maximum Clock Frequency: 40 MHz

High clock speed enables faster processing and quick response times.

Length: 10 mm

Compact dimensional footprint aids in space-constrained applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Efficient architecture leading to lower power consumption and higher performance.

No. of Timers: 12

Supports extensive timing functions essential for real-time applications.

RAM Bytes: 393216

Generous RAM size allows for handling larger data sets and applications.

Technology: CMOS

Offers low power consumption and high-speed performance.

Terminal Form: GULL WING

Standard form factor that simplifies assembly and improves reliability.

Analog To Digital Converters: 4-Ch 12-Bit, 1-Ch 10-Bit

High-resolution ADCs enable precise analog data processing.

Maximum Supply Current: 50 mA

Efficient power management suitable for battery-powered applications.

Nominal Supply Voltage: 1.2 V

Optimized for energy-efficient designs without sacrificing performance.

No. of DMA Channels: 64

Supports high-speed data transfers, enhancing system performance.

No. of Serial I/Os: 26

Allows for extensive communication interfaces, fostering versatility.

PWM Channels: YES

Supports motor control and other applications requiring pulse width modulation.

Connectivity: CAN(8), I2C, SPI(8), UART(18)

Flexible communication options make it suitable for numerous interfacing requirements.

ROM Programmability: FLASH

Enables easy updates and rewrites of program memory.

Terminal Pitch: 0.5 mm

Fine pitch helps save space on PCBs and improves design flexibility.

Format: FLOATING POINT

Supports complex mathematical computations for advanced applications.

Speed: 160 rpm

Specifies operational capabilities optimal for specific applications.

Low Power Mode: YES

Extends battery life by reducing power consumption during idle periods.

On Chip Program ROM Width: 8

8-bit ROM width enhances compatibility with various programming environments.

Technical Specifications

Microcontrollers SPC584C70E1F0C1X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

26

No. of Terminals:

64

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

RAM Bytes:

393216

ROM Words:

2097152

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

160 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

CAN(8), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC584C70E1F0C1X Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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