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SPC584C70E1F0C0X

STMicroelectronics

SPC584C70E1F0C0X by STMicroelectronics

SPC584C70E1F0C0X by STMicroelectronics is a 32-bit microcontroller with a max supply voltage of 1.26V and operates in extreme temperatures from -40 °C to 105 °C. It features integrated cache, DMA channels, and supports various connectivity options like CAN and UART. Ideal for automotive applications, it ensures reliable performance with AEC-Q100 screening.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,925 parts In-Stock

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4,925

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Anansix

USA . 1,543 parts In-Stock

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1,543

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Digiode

USA . 374 parts In-Stock

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374

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Distributors (Availability)

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AZTECH Wire

Italy . 691 parts In-Stock

1+ parts

$21.220

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691

$21.220

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Microchip USA

USA . 2,992 parts In-Stock

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$36.406

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2,992

$36.406

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IDEA Electronic Components Group

UK . 720 parts In-Stock

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$46.052

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$41.447

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720

$46.052

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$41.447

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MKK Technologies

India . 1,446 parts In-Stock

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$86.599

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1,446

$86.599

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DigiPath Technology Company

USA . 1,446 parts In-Stock

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$86.599

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1,446

$86.599

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Corphita

USA . 3,606 parts In-Stock

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3,606

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Parana Technologies

USA . 770 parts In-Stock

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$55.063

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770

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$55.063

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Overview

Unlock unparalleled performance and efficiency with the SPC584C70E1F0C0X microcontroller from STMicroelectronics. Designed for automotive applications, this AEC-Q100 certified device boasts low power consumption and robust features ideal for real-time processing tasks. Experience seamless connectivity and advanced capabilities that meet the demands of modern electronics. Choose ST for quality you can trust—power your innovations with excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making it suitable for various applications.

Integrated Cache: YES

Integration of cache improves data access speed, enhancing overall performance and efficiency during operation.

Surface Mount: YES

Surface mount technology allows for compact design and easier integration into modern circuit boards.

Maximum Supply Voltage: 1.26 V

A low maximum supply voltage indicates better energy efficiency, which is essential for battery-powered applications.

On Chip Data RAM Width: 8

The 8-bit RAM width is efficient for handling smaller data operations, suitable for various control tasks.

Screening Level: AEC-Q100

Compliance with AEC-Q100 ensures this microcontroller meets automotive-grade reliability and performance standards.

Package Shape: SQUARE

A square package shape offers uniformity, benefiting layout and space usage on circuit boards.

Bit Size: 32

A 32-bit architecture allows for more extensive data handling and computation, enhancing performance for complex applications.

No. of Terminals: 64

With 64 terminals, this microcontroller provides ample connectivity options for interfacing with various peripherals.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

This versatile package style supports effective heat dissipation and is suitable for high-density applications.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage contributes to energy savings, prolonging device operation in battery-dependent environments.

Maximum Operating Temperature: 105 °C

The ability to operate at high temperatures increases reliability and broadens its application in demanding environments.

CPU Family: E200Z4

The E200Z4 family offers robust performance suitable for embedded applications requiring efficient computing.

Minimum Operating Temperature: -40 °C

Capability to function in extreme cold makes it perfect for outdoor or harsh industrial applications.

ADC Channels: YES

Having ADC channels allows for efficient processing of analog signals, beneficial for sensor-related applications.

DMA Channels: YES

DMA support improves data transfer efficiency between peripherals, reducing CPU load and enhancing overall performance.

Terminal Position: QUAD

Quad terminal positioning enhances accessibility and ease of routing in multi-layer PCB designs.

ROM Words: 2097152

A large ROM storage capacity accommodates complex software applications and extensive firmware needs.

Maximum Seated Height: 1.2 mm

The compact size is ideal for space-constrained applications without compromising on performance.

Width: 10 mm

A width of 10 mm facilitates easy integration into compact designs while maintaining functionality.

Data EEPROM Size: 128K

The substantial EEPROM size allows for storage of crucial data and settings, ensuring data persistence.

Boundary Scan: YES

Boundary scan capability aids in efficient debugging and testing of PCB designs, enhancing product reliability.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

An extensive array of integrated peripherals enhances the microcontroller's versatility for various applications.

Maximum Clock Frequency: 40 MHz

A high clock frequency facilitates rapid processing, enabling the microcontroller to handle demanding tasks quickly.

Length: 10 mm

A length of 10 mm complements the compact form factor, making it suitable for a wide range of applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient instruction processing, maximizing performance per watt consumed.

No. of Timers: 12

Multiple timers provide flexibility for diverse timing and control applications, catering to complex tasks.

RAM Bytes: 393216

The substantial RAM size facilitates effective handling of complex data structures and applications.

Technology: CMOS

CMOS technology offers lower power consumption while providing high performance and integration.

Terminal Form: GULL WING

Gull wing terminals enhance solderability and mechanical stability, ensuring robust connections on PCBs.

Analog To Digital Converters: 4-Ch 12-Bit, 1-Ch 10-Bit

Multiple high-resolution ADC channels facilitate precise data acquisition from analog sources.

Maximum Supply Current: 50 mA

A maximum supply current of 50 mA ensures sufficient power for various operations while maintaining efficiency.

Nominal Supply Voltage: 1.2 V

An optimal nominal supply voltage indicates safe operational levels for consistent performance.

No. of DMA Channels: 64

A high number of DMA channels simplifies complex data handling, effectively reducing CPU workload.

No. of Serial I/Os: 26

Having 26 serial I/O lines enables easy and versatile communication with a variety of external devices.

PWM Channels: YES

PWM support allows for advanced control of motors and other actuators, enhancing versatility in applications.

Connectivity: CAN(8), I2C, SPI(8), UART(18)

Diverse communication protocols ensure compatibility with numerous devices, enhancing connectivity in embedded systems.

ROM Programmability: FLASH

Flash programmability allows for easy updates and flexibility in application development and deployment.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch supports high-density layouts, suitable for modern electronic designs.

Format: FLOATING POINT

Floating-point format is advantageous for handling complex mathematical computations in real-time applications.

Speed: 160 rpm

An operational speed of 160 rpm indicates suitability for efficient processing in real-time applications.

Low Power Mode: YES

Low power mode capability extends battery life in portable applications, ideal for power-sensitive environments.

On Chip Program ROM Width: 8

The 8-bit program ROM width optimizes memory efficiency for simple applications, keeping design costs low.

Technical Specifications

Microcontrollers SPC584C70E1F0C0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

26

No. of Terminals:

64

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

RAM Bytes:

393216

ROM Words:

2097152

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

160 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

CAN(8), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC584C70E1F0C0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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