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SPC584B70E7NMC0X

STMicroelectronics

SPC584B70E7NMC0X by STMicroelectronics

SPC584B70E7NMC0X by STMicroelectronics is a 32-bit microcontroller designed for low-power applications, operating b/w 1.14V and 1.26V. It features 176 terminals, supports ADC and DMA channels, and has a max clock frequency of 40 MHz. Ideal for embedded systems requiring efficient processing and control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,770 parts In-Stock

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5,770

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Digiode

USA . 4,277 parts In-Stock

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4,277

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Anansix

USA . 2,040 parts In-Stock

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2,040

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 729 parts In-Stock

1+ parts

$17.020

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729

$17.020

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IDEA Electronic Components Group

UK . 2,002 parts In-Stock

1+ parts

$19.802

100+ parts

-

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$17.822

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2,002

$19.802

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$17.822

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MKK Technologies

India . 806 parts In-Stock

1+ parts

$37.237

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806

$37.237

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DigiPath Technology Company

USA . 806 parts In-Stock

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$37.237

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806

$37.237

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Microchip USA

USA . 2,867 parts In-Stock

1+ parts

$52.178

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2,867

$52.178

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Corphita

USA . 4,098 parts In-Stock

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4,098

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Parana Technologies

USA . 17 parts In-Stock

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$23.676

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17

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$23.676

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Overview

Unleash innovation with the SPC584B70E7NMC0X microcontroller from STMicroelectronics, a trusted leader in cutting-edge technology. Designed for engineers seeking top-tier performance, this versatile 32-bit MCU excels in energy efficiency and reliability, perfect for applications ranging from industrial automation to smart devices. Elevate your projects with its advanced features, ensuring peak performance while reducing power consumption—empowering you to create groundbreaking solutions effortlessly.

Feature Benefit Bullets

Surface Mount: YES

The surface mount feature allows for compact design and integration into high-density PCBs, making it ideal for space-constrained applications.

Maximum Supply Voltage: 1.26 V

With a maximum supply voltage of 1.26 V, this microcontroller is suitable for low-power applications, helping to extend battery life.

Package Shape: SQUARE

The square package shape optimizes PCB space and simplifies layout, contributing to efficient thermal management and ease of use.

Bit Size: 32

A 32-bit architecture provides enhanced processing power and capabilities, enabling sophisticated algorithms and applications.

No. of Terminals: 176

With 176 terminals, this microcontroller offers ample connectivity options for various peripherals and interfaces, enhancing system flexibility.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

This versatile package style supports effective heat dissipation and minimizes height, making it well-suited for compact and demanding applications.

Minimum Supply Voltage: 1.14 V

The minimum supply voltage of 1.14 V ensures compatibility with a wide range of power sources, enhancing versatility in design.

ADC Channels: YES

Having ADC channels allows for direct analog signal processing, making it ideal for applications that require real-time data acquisition.

DMA Channels: YES

Availability of DMA channels facilitates efficient data transfer without CPU intervention, improving overall system performance.

Terminal Position: QUAD

The quad terminal position helps in efficient routing and connection to other components, enhancing the overall circuit design.

Width: 24 mm

A width of 24 mm balances size and performance, ensuring easy incorporation into a variety of devices and systems.

Maximum Clock Frequency: 40 MHz

A maximum clock frequency of 40 MHz enables fast processing speeds, making it suitable for time-sensitive applications.

Length: 24 mm

The 24 mm length complements the square shape, promoting uniform board design and simplifying manufacturing processes.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it provides higher efficiency and reduced instruction cycle times, benefiting performance-critical applications.

Terminal Form: GULL WING

The gull-wing terminal form enhances soldering reliability and provides easier inspection and assembly, ensuring robust connections.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2 V is indicative of low power consumption, allowing for energy-efficient designs.

PWM Channels: YES

With PWM channels available, this microcontroller supports precise control of motors and other devices, making it ideal for automation projects.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for a denser layout of components, which is beneficial for compact designs in modern electronics.

Speed: 120 rpm

The ability to operate at 120 rpm lends itself to various applications requiring controlled motor speed, making it versatile in robotics and automation.

Technical Specifications

Microcontrollers SPC584B70E7NMC0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

24 mm

No. of Terminals:

176

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Speed:

120 rpm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

24 mm

Peripheral IC Type:

Trade Compliance

SPC584B70E7NMC0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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