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SPC584B70E5EMC0X

STMicroelectronics

SPC584B70E5EMC0X by STMicroelectronics

SPC584B70E5EMC0X microcontroller from STMicroelectronics features a 32-bit E200Z4 CPU with a max clock frequency of 40 MHz, integrated cache, and AEC-Q100 screening. It operates b/w -40 °C to 105 °C and supports various connectivity options like CAN and Ethernet. Ideal for automotive applications, it offers low power modes and extensive peripheral support.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,942 parts In-Stock

1+ parts

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7,942

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Anansix

USA . 2,346 parts In-Stock

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2,346

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Digiode

USA . 1,417 parts In-Stock

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1,417

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 312 parts In-Stock

1+ parts

$12.260

100+ parts

-

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312

$12.260

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Microchip USA

USA . 3,088 parts In-Stock

1+ parts

$44.837

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3,088

$44.837

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IDEA Electronic Components Group

UK . 1,471 parts In-Stock

1+ parts

$48.208

100+ parts

-

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$43.387

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1,471

$48.208

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$43.387

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MKK Technologies

India . 1,671 parts In-Stock

1+ parts

$90.652

100+ parts

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1,671

$90.652

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DigiPath Technology Company

USA . 1,671 parts In-Stock

1+ parts

$90.652

100+ parts

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1,671

$90.652

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Corphita

USA . 608 parts In-Stock

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608

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Parana Technologies

USA . 206 parts In-Stock

1+ parts

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$57.640

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206

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$57.640

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Overview

Unlock unparalleled performance with the SPC584B70E5EMC0X microcontroller from STMicroelectronics. Renowned for their commitment to quality, STMicroelectronics delivers a robust solution ideal for automotive and industrial applications. With high efficiency, low power consumption, and an extensive array of connectivity options, this microcontroller empowers your designs with reliability and flexibility. Experience innovation that drives your projects forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers durability and resistance to environmental factors, making the microcontroller reliable in various applications.

Integrated Cache: YES

The presence of integrated cache enhances performance by speeding up data access, making it suitable for applications requiring quick response times.

Surface Mount: YES

Surface mount technology allows for compact designs and easier assembly, making it ideal for space-constrained applications.

Maximum Supply Voltage: 1.26 V

The low maximum supply voltage supports energy-efficient designs, vital for battery-operated devices.

On Chip Data RAM Width: 8

An 8-bit RAM width allows for efficient data processing in a variety of applications.

Screening Level: AEC-Q100

AEC-Q100 certification ensures quality and reliability in automotive applications, making this microcontroller suitable for automotive use.

Package Shape: SQUARE

The square shape provides ease of integration into PCB designs, allowing for flexible layout options.

Bit Size: 32

A 32-bit architecture enhances performance and allows for more complex computations, making it suitable for demanding applications.

No. of Terminals: 144

Having 144 terminals offers extensive connectivity options, making it versatile for various applications.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

The flatpack and thin profile design help in effective heat dissipation and high-density configurations, ideal for intricate designs.

Minimum Supply Voltage: 1.14 V

Low minimum supply voltage extends the microcontroller's usability in low-power applications, improving battery life.

Maximum Operating Temperature: 105 °C

A high maximum operating temperature ensures reliable performance in high-temperature environments.

CPU Family: E200Z4

The E200Z4 CPU family is designed for high performance, making the microcontroller ideal for complex processing tasks.

Minimum Operating Temperature: -40 °C

This temperature range allows the microcontroller to operate in extreme conditions, beneficial for industrial applications.

ADC Channels: YES

Integrated ADC channels enable it to handle analog inputs effectively, useful for sensor applications.

DMA Channels: YES

Direct Memory Access channels enhance data transfer efficiency, freeing up CPU resources for other tasks.

Terminal Position: QUAD

Quad terminal positioning provides flexibility in PCB design and facilitates soldering.

ROM Words: 2,097,152

A large ROM space allows substantial program storage, accommodating complex applications.

Maximum Seated Height: 1.2 mm

A low seated height aids in creating compact device designs, ideal for portable electronics.

Width: 20 mm

Standard width fits well in various applications and designs, allowing easy integration.

Data EEPROM Size: 64K

Sufficient EEPROM storage enables data retention even after power loss, essential for applications that require memory retention.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging, reducing development time and costs.

Peripherals: DMA(64), RTC, TIMER(8), WDT(2)

An extensive peripheral setup allows for complex functionalities and interfacing with other components.

Maximum Clock Frequency: 40 MHz

A high clock frequency allows for faster operations, enabling real-time processing in critical applications.

Length: 20 mm

Standard length allows for integration into many existing systems and designs.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient instruction execution, improving overall performance.

RAM Bytes: 131072

A significant amount of RAM supports complex calculations and data handling requirements.

Technology: CMOS

CMOS technology allows for lower power consumption, making the microcontroller energy-efficient.

Terminal Form: GULL WING

Gull wing terminals offer reliable soldering and are easier to handle during assembly.

Analog To Digital Converters: 3-Ch 12-Bit, 1-Ch 10-Bit

Multiple high-resolution ADCs enable better signal processing from analog sources, benefiting sensor applications.

Maximum Supply Current: 55 mA

A relatively low maximum supply current allows for energy-efficient designs, crucial for battery-powered systems.

Nominal Supply Voltage: 1.2 V

A low nominal supply voltage supports low-power designs without compromising performance.

No. of DMA Channels: 64

Having 64 DMA channels allows for high throughput in data transfer, reducing CPU bottlenecks.

No. of Serial I/Os: 23

A variety of serial I/O options facilitates communication with other devices, enhancing connectivity.

PWM Channels: YES

Integrated PWM channels are critical for applications requiring precise control of motors and other actuators.

Connectivity: CAN(8), DSPI(7), ETHERNET, I2C, LIN(14)

Rich connectivity options enable integration in various communication protocols, improving adaptability in diverse applications.

ROM Programmability: FLASH

Flash programmability offers flexibility in updating the firmware, essential for adapting to evolving requirements.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for high-density packing of components, optimizing PCB real estate.

Format: FLOATING POINT

Floating point format supports complex mathematical computations, benefiting high-performance applications.

Speed: 120 rpm

The capability for 120 rpm operation makes the microcontroller suitable for motion control applications.

Low Power Mode: YES

Low power mode extends battery life and is critical for applications that require long-duration operation.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows for efficient data handling in various applications.

Technical Specifications

Microcontrollers SPC584B70E5EMC0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of Serial I/Os:

23

No. of Terminals:

144

No. of Timers:

1

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

HQFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

131072

ROM Words:

2097152

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

120 rpm

Maximum Supply Current:

55 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(8), DSPI(7), ETHERNET, I2C, LIN(14)

Peripherals:

DMA(64), RTC, TIMER(8), WDT(2)

Analog To Digital Convertors:

3-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC584B70E5EMC0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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