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SPC584B60E5CD00X

STMicroelectronics

SPC584B60E5CD00X by STMicroelectronics

SPC584B60E5CD00X by STMicroelectronics is a 32-bit microcontroller designed for efficient performance with a max clock frequency of 40 MHz. It features ADC and DMA channels, operating b/w 1.14V to 1.26V, ideal for advanced embedded applications. Its compact flatpack design ensures easy integration in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 11,443 parts In-Stock

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11,443

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Anansix

USA . 1,016 parts In-Stock

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1,016

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Digiode

USA . 898 parts In-Stock

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898

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 242 parts In-Stock

1+ parts

$19.500

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242

$19.500

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Microchip USA

USA . 3,389 parts In-Stock

1+ parts

$36.943

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3,389

$36.943

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IDEA Electronic Components Group

UK . 51 parts In-Stock

1+ parts

$37.442

100+ parts

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$33.698

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51

$37.442

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$33.698

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MKK Technologies

India . 1,816 parts In-Stock

1+ parts

$70.408

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1,816

$70.408

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DigiPath Technology Company

USA . 1,816 parts In-Stock

1+ parts

$70.408

100+ parts

-

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1,816

$70.408

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Component Stockers USA

USA . 147 parts In-Stock

1+ parts

$188.100

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147

$188.100

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Corphita

USA . 1,481 parts In-Stock

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1,481

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Parana Technologies

USA . 979 parts In-Stock

1+ parts

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100+ parts

$44.768

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979

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$44.768

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Overview

Unlock the potential of your next project with the SPC584B60E5CD00X microcontroller from STMicroelectronics. Renowned for their innovation and reliability, STMicroelectronics delivers a powerful 32-bit solution designed for high-performance applications. With features like multiple ADC and PWM channels, this microcontroller ensures seamless operation in diverse settings, from automotive to industrial automation. Elevate your designs with unmatched quality and efficiency that only ST can provide!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact installation, saving space on the PCB and enabling more efficient use of available area.

Maximum Supply Voltage: 1.26 V

A higher maximum supply voltage offers flexibility in power supply options, making it adaptable to various projects.

Package Shape: SQUARE

The square package shape allows for uniform distribution of heat and easier mounting on PCBs, facilitating better thermal management.

Bit Size: 32

The 32-bit architecture enables efficient processing and allows for more complex computations, enhancing performance in demanding applications.

No. of Terminals: 144

With 144 terminals, this microcontroller supports a wide range of connections, providing versatility for various interfacing options.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

This package style allows for effective heat dissipation and space-saving design, making it ideal for high-density applications.

Minimum Supply Voltage: 1.14 V

A lower minimum supply voltage ensures compatibility with battery-powered designs, extending device life and efficiency.

ADC Channels: YES

The inclusion of ADC channels allows for direct analog signal processing, making it suitable for sensors and real-time monitoring applications.

DMA Channels: YES

DMA channels enhance data transfer efficiency, reducing CPU load and improving overall performance in data-heavy applications.

Terminal Position: QUAD

The quad terminal position simplifies routing on PCBs, improving layout design and reducing complexity in circuit designs.

Width: 20 mm

The 20 mm width is a balanced dimension that suits various PCB designs while maintaining performance and connectivity.

Maximum Clock Frequency: 40 MHz

With a maximum clock frequency of 40 MHz, this microcontroller can handle intensive tasks and operate efficiently in real-time applications.

Length: 20 mm

The compact 20 mm length helps facilitate space-saving designs while maintaining functionality in various applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture optimizes instruction execution, providing higher performance per watt and making it energy efficient.

Terminal Form: GULL WING

Gull wing terminals ensure reliable soldering and ease of PCB assembly, enhancing the durability of connections in electronic circuits.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2 V is ideal for low-power applications, aiding in energy efficiency and prolonging battery life.

PWM Channels: YES

PWM channels support versatile control of motors and outputs, making it suitable for automation and robotics applications.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for high-density connections, which is essential for compact electronic designs with multiple interfaces.

Speed: 80 rpm

The ability to achieve 80 rpm indicates good performance in motor control applications, making it suitable for automation and robotics tasks.

Technical Specifications

Microcontrollers SPC584B60E5CD00X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

20 mm

No. of Terminals:

144

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Speed:

80 rpm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

SPC584B60E5CD00X Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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