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SPC570S50E3CEFAR

STMicroelectronics

SPC570S50E3CEFAR by STMicroelectronics

SPC570S50E3CEFAR by STMicroelectronics is a 32-bit microcontroller designed for automotive applications. It operates at a nominal voltage of 3.3V, features ADC and DMA channels, and supports a max clock frequency of 40 MHz. Its compact flatpack design ensures efficient integration in various systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,467 parts In-Stock

1+ parts

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4,467

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Digiode

USA . 2,849 parts In-Stock

1+ parts

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2,849

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Anansix

USA . 487 parts In-Stock

1+ parts

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487

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,586 parts In-Stock

1+ parts

$7.510

100+ parts

-

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-

10k+ parts

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1,586

$7.510

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Microchip USA

USA . 288 parts In-Stock

1+ parts

$13.481

100+ parts

-

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288

$13.481

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AZTECH Wire

Italy . 48 parts In-Stock

1+ parts

$21.000

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48

$21.000

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IDEA Electronic Components Group

UK . 1,266 parts In-Stock

1+ parts

$63.428

100+ parts

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$57.085

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1,266

$63.428

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$57.085

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Component Stockers USA

USA . 616 parts In-Stock

1+ parts

$102.660

100+ parts

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616

$102.660

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MKK Technologies

India . 1,389 parts In-Stock

1+ parts

$119.271

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1,389

$119.271

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DigiPath Technology Company

USA . 1,389 parts In-Stock

1+ parts

$119.271

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1,389

$119.271

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Parana Technologies

USA . 1,823 parts In-Stock

1+ parts

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100+ parts

$75.837

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1,823

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$75.837

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Corphita

USA . 1,762 parts In-Stock

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1,762

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Overview

Unlock the potential of your next project with the SPC570S50E3CEFAR from STMicroelectronics, a leader in innovative microcontroller solutions. This high-quality 32-bit microcontroller offers unmatched reliability and performance for automotive, industrial, and consumer applications. With features like advanced ADC and DMA channels, it ensures seamless data processing and efficient operation, empowering you to create cutting-edge designs that stand out in today’s competitive market. Experience superior functionality and proven excellence today!

Feature Benefit Bullets

Surface Mount: YES

Being surface mount allows for compact designs and easier integration into modern PCB layouts.

Maximum Supply Voltage: 3.63 V

The maximum supply voltage is suitable for a variety of applications without the risk of exceeding voltage thresholds.

Package Shape: SQUARE

A square package shape simplifies layout designs and allows for versatile placement on PCBs.

Bit Size: 32

The 32-bit architecture provides higher processing power and efficiency for complex applications.

No. of Terminals: 100

With 100 terminals, this microcontroller can support numerous peripheral devices and connections.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

This versatile package style accommodates various mounting options and is conducive to thermal management.

Minimum Supply Voltage: 2.97 V

A lower minimum supply voltage enhances power efficiency, making it suitable for battery-operated applications.

ADC Channels: YES

Availability of ADC channels allows for direct interfacing with analog sensors, expanding application flexibility.

DMA Channels: YES

DMA channels facilitate efficient data transfer and processing, leading to improved performance in real-time applications.

Terminal Position: QUAD

Quad terminal positioning enhances the ease of connectivity and soldering, ensuring a reliable connection.

Width: 14 mm

A compact width makes it suitable for space-constrained designs without compromising functionality.

Maximum Clock Frequency: 40 MHz

A clock frequency of 40 MHz ensures the microcontroller can handle demanding applications with speed.

Length: 14 mm

Similar to its width, a 14 mm length supports compact design layouts and easy integration into existing systems.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture optimizes performance and power efficiency, making it ideal for a wide range of applications.

Terminal Form: GULL WING

Gull wing terminals offer excellent soldering and mechanical properties, ensuring robust connections.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage aligns well with most modern digital circuits, promoting compatibility and reliability.

Terminal Pitch: 0.5 mm

A fine terminal pitch allows for higher density routing on PCBs, enabling more complex designs.

Speed: 80 rpm

A speed of 80 rpm is sufficient for many lower-speed applications, making it suitable for a variety of uses.

Technical Specifications

Microcontrollers SPC570S50E3CEFAR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

14 mm

No. of Terminals:

100

PWM Channels:

NO

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

80 rpm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SPC570S50E3CEFAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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