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SPC570S50E1DEFAY

STMicroelectronics

SPC570S50E1DEFAY by STMicroelectronics

SPC570S50E1DEFAY by STMicroelectronics is a 32-bit microcontroller designed for high-performance applications. It operates at a nominal voltage of 3.3V, features 64 terminals, and supports ADC and DMA channels. Ideal for automotive and industrial control systems, it offers a max clock frequency of 40 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,662 parts In-Stock

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9,662

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Digiode

USA . 3,342 parts In-Stock

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3,342

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Anansix

USA . 664 parts In-Stock

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664

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Distributors (Availability)

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Microchip USA

USA . 293 parts In-Stock

1+ parts

$10.613

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293

$10.613

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AZTECH Wire

Italy . 95 parts In-Stock

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$10.940

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95

$10.940

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IDEA Electronic Components Group

UK . 1,669 parts In-Stock

1+ parts

$78.401

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$70.561

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1,669

$78.401

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$70.561

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MKK Technologies

India . 1,892 parts In-Stock

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$147.429

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1,892

$147.429

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DigiPath Technology Company

USA . 1,892 parts In-Stock

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$147.429

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1,892

$147.429

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QUARKTWIN TECHNOLOGY LTD

USA . 29,551 parts In-Stock

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Corphita

USA . 1,905 parts In-Stock

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1,905

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Parana Technologies

USA . 1,782 parts In-Stock

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$93.741

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1,782

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$93.741

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Vigor

Singapore . 1,781 parts In-Stock

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1,781

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Overview

Unlock unparalleled performance with the SPC570S50E1DEFAY microcontroller from STMicroelectronics, a leader in innovation and quality. Designed for versatile applications, this compact powerhouse ensures efficient processing and robust functionality, making it ideal for automotive and industrial systems. Experience enhanced reliability and seamless integration, empowering your projects to reach new heights while benefiting from ST's commitment to excellence and cutting-edge technology.

Feature Benefit Bullets

Surface Mount: YES

This microcontroller is designed for surface mounting, making it ideal for compact and space-efficient circuit designs.

Maximum Supply Voltage: 3.63 V

With a maximum supply voltage of 3.63 V, this microcontroller can operate safely in varied supply conditions, enhancing its reliability in different applications.

Package Shape: SQUARE

The square package shape allows for efficient use of board space, making it suitable for high-density layouts.

Bit Size: 32

A 32-bit architecture provides significant processing power and flexibility, allowing for more complex applications and efficient data handling.

No. of Terminals: 64

With 64 terminals, this microcontroller offers a wide range of connectivity options, allowing for the integration of multiple peripherals and functionalities.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

The diverse package style enhances thermal performance and allows for easier integration into various layouts, meeting different design needs.

Minimum Supply Voltage: 2.97 V

A minimum supply voltage of 2.97 V ensures compatibility with a variety of power sources, making it versatile for different applications.

ADC Channels: YES

The inclusion of ADC channels enables the microcontroller to convert analog signals to digital, making it suitable for sensor interfacing.

DMA Channels: YES

With DMA channels available, this microcontroller can perform data transfers without CPU intervention, enhancing performance and efficiency in data-heavy tasks.

Terminal Position: QUAD

Quad terminal positioning simplifies PCB design and improves accessibility for connections, which is beneficial in complex designs.

Width: 10 mm

A compact width of 10 mm helps in reducing overall product size, making it ideal for portable applications.

Maximum Clock Frequency: 40 MHz

A maximum clock frequency of 40 MHz ensures quick processing, making this microcontroller suitable for performance-intensive applications.

Length: 10 mm

A length of 10 mm complements its width, allowing for a uniform and compact design that can fit in restricted spaces.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it offers high performance and low power consumption, making it effective for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide a reliable soldering connection, ensuring durability and stability in the microcontroller's performance.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3 V allows for efficient power consumption, making it suitable for energy-sensitive applications.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch facilitates high-density placements, which is essential for modern compact electronics.

Speed: 80 rpm

With a speed of 80 rpm, it accommodates various motor control applications, providing flexibility for different operational requirements.

Technical Specifications

Microcontrollers SPC570S50E1DEFAY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

10 mm

No. of Terminals:

64

PWM Channels:

NO

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

80 rpm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

SPC570S50E1DEFAY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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