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SPC56EL70L5CBFSY

STMicroelectronics

SPC56EL70L5CBFSY by STMicroelectronics

SPC56EL70L5CBFSY by STMicroelectronics is a 32-bit microcontroller with 144 terminals, 16-bit address bus, and 40 MHz clock frequency. Ideal for applications requiring high-speed processing and multiple ADC/DMA channels like automotive control systems and industrial automation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 10,665 parts In-Stock

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10,665

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Bristol Electronics

USA . 9,720 parts In-Stock

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9,720

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Digiode

USA . 3,517 parts In-Stock

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3,517

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Anansix

USA . 1,889 parts In-Stock

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1,889

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Distributors (Availability)

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AZTECH Wire

Italy . 757 parts In-Stock

1+ parts

$17.000

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757

$17.000

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Vigor

Singapore . 1,326 parts In-Stock

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$17.670

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1,326

$17.670

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IDEA Electronic Components Group

UK . 1,676 parts In-Stock

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$77.926

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$70.133

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1,676

$77.926

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$70.133

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MKK Technologies

India . 775 parts In-Stock

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$146.534

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775

$146.534

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DigiPath Technology Company

USA . 775 parts In-Stock

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$146.534

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775

$146.534

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QUARKTWIN TECHNOLOGY LTD

USA . 26,462 parts In-Stock

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26,462

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Corphita

USA . 3,277 parts In-Stock

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3,277

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Microchip USA

USA . 2,926 parts In-Stock

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2,926

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Parana Technologies

USA . 1,030 parts In-Stock

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$93.172

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1,030

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$93.172

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Overview

Unleash the power of innovation with the SPC56EL70L5CBFSY microcontroller by STMicroelectronics. Designed with precision and cutting-edge technology, this microcontroller offers unmatched performance and reliability for your applications. With features like ADC channels, DMA channels, PWM channels, and a maximum clock frequency of 40 MHz, this product is ideal for a wide range of projects. Trust in STMicroelectronics to deliver quality products that exceed expectations and bring your ideas to life. Elevate your designs with the SPC56EL70L5CBFSY microcontroller today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, making this microcontroller a popular choice for mass production.

Maximum Supply Voltage: 3.63 V

Having a high maximum supply voltage allows for flexibility in powering the microcontroller and associated components.

Package Shape: SQUARE

The square package shape offers good balance between compactness and ease of PCB layout.

Bit Size: 32

A 32-bit microcontroller can handle larger data sizes and perform calculations more efficiently compared to lower bit sizes.

No. of Terminals: 144

Having a high number of terminals provides ample connectivity options for interfacing with external devices and peripherals.

Minimum Supply Voltage: 3.3 V

The low minimum supply voltage ensures compatibility with a wide range of power sources while maintaining stable operation.

ADC Channels: YES

The presence of ADC channels allows the microcontroller to accurately sample analog signals, making it suitable for sensor interfacing applications.

DMA Channels: YES

DMA channels enable efficient data transfer between memory and peripherals, enhancing overall system performance.

ROM Words: 524288

With a large ROM capacity, the microcontroller can store more program instructions and data, enabling complex applications to be implemented.

Maximum Clock Frequency: 40 MHz

A high maximum clock frequency allows for fast execution of instructions, making the microcontroller suitable for real-time processing tasks.

Technology: CMOS

CMOS technology offers a good balance between power consumption and performance, making the microcontroller energy-efficient.

No. of I/O Lines: 115

A high number of I/O lines provide versatility in connecting to external devices and peripherals, enhancing the microcontroller's overall functionality.

Technical Specifications

Microcontrollers SPC56EL70L5CBFSY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

8

Length:

19.8 mm

No. of I/O Lines:

115

No. of Terminals:

144

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Words:

524288

Speed:

120 rpm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

19.8 mm

Peripheral IC Type:

Trade Compliance

SPC56EL70L5CBFSY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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