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SPC56EL70L5CBFSR

STMicroelectronics

SPC56EL70L5CBFSR by STMicroelectronics

STMicroelectronics SPC56EL70L5CBFSR microcontroller features 32-bit architecture, 3.3-3.63 V supply voltage range, and 40 MHz clock frequency. Ideal for applications requiring high-speed processing, such as automotive engine control units and industrial automation systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 10,771 parts In-Stock

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Anansix

USA . 2,097 parts In-Stock

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2,097

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Right Parts Inc.

USA . 276 parts In-Stock

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276

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Digiode

USA . 109 parts In-Stock

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109

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Distributors (Availability)

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AZTECH Wire

Italy . 688 parts In-Stock

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$20.020

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688

$20.020

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Ampacity Inc.

Singapore . 449 parts In-Stock

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$34.000

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449

$34.000

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IDEA Electronic Components Group

UK . 1,160 parts In-Stock

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$51.429

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$46.286

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$51.429

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$46.286

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Microchip USA

USA . 2,068 parts In-Stock

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$53.768

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2,068

$53.768

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MKK Technologies

India . 684 parts In-Stock

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$96.709

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DigiPath Technology Company

USA . 684 parts In-Stock

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$96.709

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684

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 4,267 parts In-Stock

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Parana Technologies

USA . 1,213 parts In-Stock

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$61.491

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Overview

Discover the SPC56EL70L5CBFSR microcontroller by STMicroelectronics, a top-tier manufacturer known for its high-quality products. This versatile device is perfect for a wide range of applications, offering advanced features like ADC and DMA channels. With a maximum clock frequency of 40 MHz and 32-bit size, this microcontroller provides unparalleled performance and reliability. Its compact design and low profile package make it ideal for space-constrained projects. Experience the value and benefits of this cutting-edge technology in your next project.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and convenient installation on circuit boards, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 3.63 V

Allows for a wide range of power supply options, ensuring compatibility with various voltage sources.

Address Bus Width: 16

Having a wider address bus allows for scalability and the ability to address larger memory spaces, increasing the versatility of the microcontroller.

Package Shape: SQUARE

The square package shape provides a compact form factor, making it easy to integrate into tight spaces and reducing overall board size.

Bit Size: 32

A 32-bit architecture offers improved performance and processing capabilities compared to lower bit sizes, making it suitable for handling complex tasks and applications.

No. of Terminals: 144

With a high number of terminals, the microcontroller can support a wide range of input and output connections, making it versatile and adaptable to various applications.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style allows for easy mounting and soldering, ensuring reliable connections and optimal performance.

Minimum Supply Voltage: 3.3 V

The low minimum supply voltage requirement helps in conserving power and increasing energy efficiency, making it suitable for battery-operated devices.

ADC Channels: YES

The presence of Analog-to-Digital Converter (ADC) channels enables the microcontroller to interface with analog sensors and signals, expanding its versatility for input processing.

DMA Channels: YES

Direct Memory Access (DMA) channels improve data transfer efficiency and reduce CPU workload, enhancing overall system performance and responsiveness.

Terminal Position: QUAD

The quad terminal position arrangement simplifies PCB layout and routing, enabling easy connection to external components and peripherals.

ROM Words: 524288

The large ROM capacity allows for storing a significant amount of program data and instructions, accommodating complex algorithms and applications.

Width: 19.8 mm

The compact width dimension enhances space efficiency and enables integration into small form factor devices, ideal for applications with size constraints.

External Data Bus Width: 8

An 8-bit external data bus width facilitates efficient communication with external memory and peripherals, enhancing data transfer speeds and system performance.

Maximum Clock Frequency: 40 MHz

A high maximum clock frequency allows for fast execution of instructions and operations, making the microcontroller suitable for demanding real-time applications.

Length: 19.8 mm

The compact length dimension complements the width dimension, contributing to a small overall footprint and enabling space-saving integration in compact designs.

Peripheral IC Type: MICROCONTROLLER, RISC

A Reduced Instruction Set Computing (RISC) architecture provides streamlined and efficient processing, improving performance and power efficiency.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption, high noise immunity, and compatibility with a wide range of voltage levels.

Terminal Form: GULL WING

The gull wing terminal form facilitates surface mounting and soldering processes, ensuring secure and reliable connections for stable operation.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3V ensures compatibility with common power sources, offering flexibility in designing and powering the device.

PWM Channels: YES

Pulse Width Modulation (PWM) channels enable precise control of outputs such as motor speed and LED brightness, enhancing the microcontroller's capability for controlling external devices.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm allows for high-density mounting, enabling compact and space-efficient PCB designs.

Speed: 120 rpm

With a speed of 120 rotations per minute, the microcontroller can effectively control and interface with rotating devices such as motors or actuators.

No. of I/O Lines: 115

A high number of input/output (I/O) lines provide ample connectivity options for interfacing with external devices and peripherals, enhancing the microcontroller's versatility and usability.

Technical Specifications

Microcontrollers SPC56EL70L5CBFSR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

8

Length:

19.8 mm

No. of I/O Lines:

115

No. of Terminals:

144

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Words:

524288

Speed:

120 rpm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

19.8 mm

Peripheral IC Type:

Trade Compliance

SPC56EL70L5CBFSR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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