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SPC56EL70L3CBFSR

STMicroelectronics

SPC56EL70L3CBFSR by STMicroelectronics

SPC56EL70L3CBFSR by STMicroelectronics is a 32-bit microcontroller with 16-bit address bus width, 524288 ROM words, and 40 MHz max clock frequency. It features ADC and DMA channels, suitable for applications requiring high-speed processing and precise analog-to-digital conversion. Ideal for automotive systems, industrial control, and IoT devices due to its low profile package style and versatile I/O capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,344 parts In-Stock

1+ parts

-

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5,344

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Digiode

USA . 3,744 parts In-Stock

1+ parts

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3,744

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Anansix

USA . 2,299 parts In-Stock

1+ parts

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2,299

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,192 parts In-Stock

1+ parts

$18.800

100+ parts

-

1k+ parts

-

10k+ parts

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1,192

$18.800

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Ampacity Inc.

Singapore . 616 parts In-Stock

1+ parts

$22.000

100+ parts

-

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616

$22.000

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IDEA Electronic Components Group

UK . 265 parts In-Stock

1+ parts

$72.951

100+ parts

-

1k+ parts

$65.656

10k+ parts

-

265

$72.951

-

$65.656

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MKK Technologies

India . 1,980 parts In-Stock

1+ parts

$137.180

100+ parts

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1,980

$137.180

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DigiPath Technology Company

USA . 1,980 parts In-Stock

1+ parts

$137.180

100+ parts

-

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1,980

$137.180

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QUARKTWIN TECHNOLOGY LTD

USA . 15,508 parts In-Stock

1+ parts

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15,508

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Microchip USA

USA . 2,724 parts In-Stock

1+ parts

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2,724

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Corphita

USA . 2,195 parts In-Stock

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2,195

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Parana Technologies

USA . 1,933 parts In-Stock

1+ parts

-

100+ parts

$87.224

1k+ parts

-

10k+ parts

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1,933

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$87.224

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Overview

Unlock the potential of your next project with the SPC56EL70L3CBFSR microcontroller by STMicroelectronics. Known for their high-quality products, STMicroelectronics delivers reliable solutions for a wide range of applications. This surface mount microcontroller offers customers the benefits of ADC and DMA channels, PWM capabilities, and a maximum clock frequency of 40 MHz. With its advanced technology and versatile features, the SPC56EL70L3CBFSR provides exceptional value and performance for your design needs.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and secure installation on a PCB, saving space and making production more efficient.

Bit Size: 32

Provides a high level of performance and processing power, suitable for advanced applications.

ROM Words: 524288

Ample memory space for storing program instructions and data.

Maximum Clock Frequency: 40 MHz

Enables fast and efficient operation, essential for real-time applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture allows for efficient execution of instructions, improving overall system performance.

Technology: CMOS

Uses low power and provides high noise immunity, enhancing overall reliability.

Technical Specifications

Microcontrollers SPC56EL70L3CBFSR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

8

Length:

14 mm

No. of I/O Lines:

83

No. of Terminals:

100

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Words:

524288

Speed:

120 rpm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SPC56EL70L3CBFSR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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