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SPC56EL60L5CCOSY

STMicroelectronics

SPC56EL60L5CCOSY by STMicroelectronics

STMicroelectronics SPC56EL60L5CCOSY microcontroller features 32-bit address bus, 3.3V power supply, and 40MHz clock frequency. Ideal for automotive applications due to its low profile package style and high operating temperature range of -40 to 125 °C. Includes ADC and DMA channels for versatile peripheral interfacing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,101 parts In-Stock

1+ parts

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7,101

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Digiode

USA . 2,839 parts In-Stock

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2,839

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Anansix

USA . 1,567 parts In-Stock

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1,567

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,439 parts In-Stock

1+ parts

$12.800

100+ parts

-

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1,439

$12.800

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AZTECH Wire

Italy . 588 parts In-Stock

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$16.840

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588

$16.840

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IDEA Electronic Components Group

UK . 1,644 parts In-Stock

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$34.743

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$31.269

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1,644

$34.743

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$31.269

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Microchip USA

USA . 2,998 parts In-Stock

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$43.692

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2,998

$43.692

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MKK Technologies

India . 48 parts In-Stock

1+ parts

$65.332

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48

$65.332

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DigiPath Technology Company

USA . 48 parts In-Stock

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$65.332

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48

$65.332

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Corphita

USA . 2,163 parts In-Stock

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2,163

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Parana Technologies

USA . 1,349 parts In-Stock

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$41.540

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1,349

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$41.540

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Overview

Experience the power of innovation with the SPC56EL60L5CCOSY microcontroller by STMicroelectronics. As a trusted leader in the industry, STMicroelectronics delivers quality products that exceed expectations. Ideal for automotive applications, this microcontroller offers high performance and reliability, ensuring seamless operation. With its advanced features and cutting-edge technology, the SPC56EL60L5CCOSY provides unmatched value and benefits to customers looking for top-notch solutions. Trust STMicroelectronics to elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability to the microcontroller package.

Maximum Supply Voltage: 3.63 V

The high maximum supply voltage allows for flexibility in power input, increasing versatility in different applications.

Package Shape: SQUARE

The square package shape makes it easier for mounting and integration into various electronic devices.

Bit Size: 32

32-bit processing allows for faster and more efficient data handling and calculations.

No. of Terminals: 144

Having 144 terminals provides ample connectivity options for peripherals and external components.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature makes this microcontroller suitable for automotive and industrial applications where heat resistance is crucial.

ROM Words: 1048576

With a large ROM capacity, the microcontroller can store a significant amount of program data and instructions.

RAM Bytes: 131072

The ample RAM capacity allows for efficient data storage and processing during operation.

Maximum Clock Frequency: 40 MHz

The high clock frequency enables fast data processing and response times in real-time applications.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product combines processing power with input/output capabilities, making it suitable for a wide range of embedded system applications.

Technical Specifications

Microcontrollers SPC56EL60L5CCOSY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

CPU Family:

SPC56

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

64

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of I/O Lines:

16

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

131072

ROM Words:

1048576

ROM Programmability:

FLASH

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

279 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Trade Compliance

SPC56EL60L5CCOSY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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