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SPC56EL60L5CBOSY

STMicroelectronics

SPC56EL60L5CBOSY by STMicroelectronics

STMicroelectronics SPC56EL60L5CBOSY microcontroller features 32-bit address bus, 3.3V power supply, and 40MHz clock frequency. Ideal for automotive applications due to its CMOS technology, FLASH ROM programmability, and 64-bit external data bus width.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,824 parts In-Stock

1+ parts

-

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4,824

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Vyrian

USA . 2,607 parts In-Stock

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2,607

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Anansix

USA . 2,564 parts In-Stock

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2,564

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,089 parts In-Stock

1+ parts

$8.380

100+ parts

-

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1,089

$8.380

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Vigor

Singapore . 2,027 parts In-Stock

1+ parts

$14.060

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-

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2,027

$14.060

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Microchip USA

USA . 2,783 parts In-Stock

1+ parts

$44.950

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2,783

$44.950

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IDEA Electronic Components Group

UK . 1,444 parts In-Stock

1+ parts

$66.217

100+ parts

-

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$59.595

10k+ parts

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1,444

$66.217

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$59.595

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MKK Technologies

India . 41 parts In-Stock

1+ parts

$124.517

100+ parts

-

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41

$124.517

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DigiPath Technology Company

USA . 41 parts In-Stock

1+ parts

$124.517

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41

$124.517

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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Corphita

USA . 1,898 parts In-Stock

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1,898

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Parana Technologies

USA . 15 parts In-Stock

1+ parts

-

100+ parts

$79.172

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15

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$79.172

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Overview

Experience the exceptional quality and reliability of the SPC56EL60L5CBOSY microcontroller by STMicroelectronics, a leading manufacturer known for cutting-edge technology. Ideal for automotive applications, this powerful microcontroller offers unparalleled performance and efficiency with its advanced features. With its innovative design and precision engineering, this product ensures seamless operation and maximum durability. Trust STMicroelectronics to deliver top-notch solutions that exceed expectations and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the microcontroller, making it a reliable choice for various applications.

Maximum Supply Voltage: 3.63 V

With a maximum supply voltage of 3.63V, this microcontroller can handle higher voltage levels, providing flexibility in power supply options.

Address Bus Width: 32

A wide address bus width of 32 bits allows for efficient memory addressing and data transfer, enhancing the overall performance of the microcontroller.

Bit Size: 32

The 32-bit architecture enables the microcontroller to process data in larger chunks, increasing efficiency and speed in operations.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C makes this microcontroller suitable for use in automotive and industrial environments where temperature fluctuations are common.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller with various peripheral ICs integrated, this product offers a compact solution for controlling and interfacing with other devices in embedded systems.

ROM Words: 1048576

With a large ROM size of 1048576 words, this microcontroller can store a significant amount of program instructions, enabling the implementation of complex applications.

Maximum Clock Frequency: 40 MHz

A high maximum clock frequency of 40MHz allows for fast execution of instructions, making this microcontroller suitable for applications that require real-time processing.

Technical Specifications

Microcontrollers SPC56EL60L5CBOSY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

CPU Family:

SPC56

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

64

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of I/O Lines:

16

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

131072

ROM Words:

1048576

ROM Programmability:

FLASH

Speed:

120 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

311.6 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Trade Compliance

SPC56EL60L5CBOSY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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