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SPC56EL60L3CBFQY

STMicroelectronics

SPC56EL60L3CBFQY by STMicroelectronics

SPC56EL60L3CBFQY by STMicroelectronics is a 32-bit microcontroller with 64-bit external data bus width, operating at up to 40 MHz. Ideal for automotive applications, it features 131072 bytes of RAM, flash ROM programmability, and ADC/DMA channels for efficient data processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,658 parts In-Stock

1+ parts

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6,658

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Digiode

USA . 3,563 parts In-Stock

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3,563

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Anansix

USA . 1,905 parts In-Stock

1+ parts

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1,905

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,259 parts In-Stock

1+ parts

$12.460

100+ parts

-

1k+ parts

-

10k+ parts

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2,259

$12.460

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AZTECH Wire

Italy . 1,217 parts In-Stock

1+ parts

$18.670

100+ parts

-

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10k+ parts

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1,217

$18.670

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IDEA Electronic Components Group

UK . 1,325 parts In-Stock

1+ parts

$21.848

100+ parts

-

1k+ parts

$19.663

10k+ parts

-

1,325

$21.848

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$19.663

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MKK Technologies

India . 458 parts In-Stock

1+ parts

$41.084

100+ parts

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458

$41.084

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DigiPath Technology Company

USA . 458 parts In-Stock

1+ parts

$41.084

100+ parts

-

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10k+ parts

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458

$41.084

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Microchip USA

USA . 2,959 parts In-Stock

1+ parts

$42.347

100+ parts

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2,959

$42.347

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Corphita

USA . 1,400 parts In-Stock

1+ parts

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1,400

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Parana Technologies

USA . 1,083 parts In-Stock

1+ parts

-

100+ parts

$26.123

1k+ parts

-

10k+ parts

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1,083

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$26.123

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Overview

Experience the power of cutting-edge technology with the SPC56EL60L3CBFQY microcontroller from STMicroelectronics. As a leader in the industry, STMicroelectronics brings you a reliable and high-quality product that is perfect for a wide range of applications. With its exceptional performance and innovative features, this microcontroller offers unparalleled value and benefits to customers looking to streamline their projects and improve efficiency. Upgrade your systems with the SPC56EL60L3CBFQY and discover a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for applications where portability and reliability are important.

Surface Mount: YES

Surface mount technology allows for easy and compact integration onto circuit boards, saving space and enabling efficient assembly processes.

Maximum Supply Voltage: 3.63 V

The high maximum supply voltage tolerance of 3.63 V provides a wide operating range, making the product versatile and compatible with various power sources.

Address Bus Width: 32

With a 32-bit address bus width, the product can access a large memory space efficiently, enabling it to handle complex tasks and data-intensive operations.

Package Shape: SQUARE

The square package shape allows for uniform and compact design layout, facilitating space-saving integration into electronic devices.

Bit Size: 32

The 32-bit architecture provides high processing power and efficiency, allowing the product to execute tasks quickly and handle large amounts of data effectively.

Power Supplies (V): 3.3

The 3.3 V power supply ensures consistent and reliable performance, making the product suitable for applications requiring stable voltage operation.

No. of Terminals: 100

The ample number of terminals allows for versatile connectivity options and interfaces, enabling the product to interact with various external devices and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style enhances the product's space efficiency, making it suitable for compact and slim electronic designs.

Minimum Supply Voltage: 3 V

The low minimum supply voltage requirement of 3 V ensures energy efficiency and compatibility with a wide range of power sources, enhancing the product's flexibility.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature tolerance of 125 °C allows the product to withstand elevated temperatures, making it suitable for industrial and automotive applications.

CPU Family: SPC56

The SPC56 CPU family offers high-performance computing capabilities, enabling the product to handle complex algorithms and calculations efficiently.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature tolerance of -40 °C ensures reliable operation even in extreme cold conditions, making the product suitable for outdoor and harsh environments.

ADC Channels: YES

The presence of ADC channels allows the product to convert analog signals into digital data accurately, enabling precise measurements and sensor interfacing.

DMA Channels: YES

The availability of DMA channels enhances data transfer efficiency and offloads the CPU, allowing the product to perform multiple tasks simultaneously and optimize system performance.

Terminal Position: QUAD

The quad terminal position provides stable and secure connections, reducing the risk of signal interference or disconnection, ensuring reliable operation.

ROM Words: 1048576

The large ROM capacity of 1048576 words allows the product to store a vast amount of program instructions and data, enabling versatile and feature-rich applications.

Width: 14 mm

The compact width of 14 mm facilitates space-saving integration into electronic devices and PCB layouts, allowing for sleek and efficient product designs.

External Data Bus Width: 64

The 64-bit external data bus width enables high-speed data transfer and communication between the product and external memory devices, enhancing overall system performance.

Maximum Clock Frequency: 40 MHz

The high maximum clock frequency of 40 MHz allows the product to execute instructions quickly and efficiently, enabling fast real-time processing and responsive performance.

Length: 14 mm

The short length of 14 mm complements the compact width, making the product suitable for space-constrained applications and slim electronic designs.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures reliable operation in automotive environments, meeting strict temperature and durability requirements for automotive electronic systems.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, the product integrates CPU, memory, and peripherals on a single chip, providing a cost-effective and space-efficient solution for embedded systems and IoT applications.

RAM Bytes: 131072

The generous RAM capacity of 131072 bytes allows the product to store and access data quickly, enabling efficient multitasking, data processing, and real-time operations.

Technology: CMOS

The CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of voltages, making the product energy-efficient, reliable, and versatile.

Terminal Form: GULL WING

The gull wing terminal form provides secure and robust solder connections, enhancing the product's reliability, durability, and resistance to mechanical stress and vibration.

Maximum Supply Current: 311.6 mA

The maximum supply current of 311.6 mA indicates the product's power consumption profile, allowing for efficient power management and design optimization.

Nominal Supply Voltage: 3.3 V

The 3.3 V nominal supply voltage ensures stable and consistent power delivery, minimizing voltage fluctuations and ensuring reliable operation of the product.

PWM Channels: YES

The presence of PWM channels enables precise control over analog outputs, such as motor speed and LED brightness, enhancing the product's versatility in a wide range of applications.

ROM Programmability: FLASH

The ROM programmability using FLASH technology allows for easy and flexible firmware updates, debugging, and customization of the product, ensuring adaptability to changing requirements.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm enables high-density mounting and compact PCB design, optimizing space utilization and enabling miniaturization of electronic devices.

Speed: 120 rpm

The maximum speed of 120 revolutions per minute indicates the product's capability to respond quickly to inputs, process data efficiently, and perform tasks at a high operational speed.

No. of I/O Lines: 16

The 16 I/O lines provide versatile input/output options for connecting to external devices, sensors, and peripherals, enhancing the product's connectivity and interfacing capabilities.

Technical Specifications

Microcontrollers SPC56EL60L3CBFQY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

CPU Family:

SPC56

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

64

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

16

No. of Terminals:

100

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

131072

ROM Words:

1048576

ROM Programmability:

FLASH

Speed:

120 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

311.6 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SPC56EL60L3CBFQY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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