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SPC56EC74L8C9E0X

STMicroelectronics

SPC56EC74L8C9E0X by STMicroelectronics

SPC56EC74L8C9E0X by STMicroelectronics is a 32-bit microcontroller with 208 terminals, operating at up to 40 MHz. Ideal for automotive applications, it features 33 ADC channels, 32 DMA channels, and peripherals like RTC and WDT. With low power mode and CAN connectivity, it offers high performance in a compact package.

Median Price

$15.600

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 13 parts In-Stock

1+ parts

$15.600

100+ parts

-

1k+ parts

-

10k+ parts

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13

$15.600

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-

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Vyrian

USA . 4,760 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,760

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-

-

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Digiode

USA . 298 parts In-Stock

1+ parts

-

100+ parts

-

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298

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-

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Anansix

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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250

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 756 parts In-Stock

1+ parts

$14.340

100+ parts

-

1k+ parts

-

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756

$14.340

-

-

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Vigor

Singapore . 3,371 parts In-Stock

1+ parts

$18.660

100+ parts

-

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3,371

$18.660

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IDEA Electronic Components Group

UK . 849 parts In-Stock

1+ parts

$28.399

100+ parts

-

1k+ parts

$25.559

10k+ parts

-

849

$28.399

-

$25.559

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Microchip USA

USA . 2,067 parts In-Stock

1+ parts

$52.016

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2,067

$52.016

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-

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MKK Technologies

India . 1,586 parts In-Stock

1+ parts

$53.402

100+ parts

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1,586

$53.402

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DigiPath Technology Company

USA . 1,586 parts In-Stock

1+ parts

$53.402

100+ parts

-

1k+ parts

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1,586

$53.402

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Component Stockers USA

USA . 278 parts In-Stock

1+ parts

$300.540

100+ parts

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278

$300.540

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Corphita

USA . 1,976 parts In-Stock

1+ parts

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1,976

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Parana Technologies

USA . 422 parts In-Stock

1+ parts

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100+ parts

$33.955

1k+ parts

-

10k+ parts

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422

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$33.955

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Overview

Elevate your projects with the SPC56EC74L8C9E0X microcontroller from STMicroelectronics - a game-changer in the automotive industry. With cutting-edge technology and a trusted manufacturer behind it, this microcontroller offers unparalleled performance and reliability. Whether you're working on automotive control systems, motor control applications, or industrial automation, this device's advanced features, low power mode, and high-speed connectivity options make it the ideal choice for your next project. Experience the difference with the SPC56EC74L8C9E0X microcontroller and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring its longevity in various environments.

Maximum Supply Voltage: 3.6 V

Allows for stable operation within a safe voltage range, protecting the microcontroller from potential damage.

CPU Family: E200Z4

Part of the E200Z4 CPU family, known for its performance and efficiency in handling complex tasks.

Maximum Clock Frequency: 40 MHz

Offers high processing speed, making the microcontroller suitable for applications requiring quick data processing.

RAM Bytes: 262144

Generous amount of RAM for data storage and processing, allowing for efficient multitasking and handling of large datasets.

Connectivity: CAN(6), ETHERNET, I2C, SCI(10), SPI(8)

Provides a wide range of connectivity options, making it versatile for interfacing with various external devices and networks.

Technical Specifications

Microcontrollers SPC56EC74L8C9E0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 5V NOMINAL SUPPLY, ALSO HAVING SHARED 19-CHANNELS OF ADC

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G208

Length:

28 mm

Low Power Mode:

YES

No. of DMA Channels:

32

No. of External Interrupts:

24

No. of I/O Lines:

177

No. of Terminals:

208

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP208,1.2SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

262144

ROM Words:

3145728

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

120 rpm

Maximum Supply Current:

300 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

28 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(6), ETHERNET, I2C, SCI(10), SPI(8)

Peripherals:

DMA(32), RTC, TIMER(12), WDT

Analog To Digital Convertors:

33-Ch 10-Bit; 10-Ch 12-Bit

Trade Compliance

SPC56EC74L8C9E0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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