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SPC56AP60L5CEFBY

STMicroelectronics

SPC56AP60L5CEFBY by STMicroelectronics

STMicroelectronics SPC56AP60L5CEFBY is a 32-bit microcontroller with 3.6V max supply voltage, 40MHz clock frequency, and 106 I/O lines. Ideal for applications requiring ADC and DMA channels, it features a low-profile flatpack package with gull wing terminals in a square shape.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,551 parts In-Stock

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4,551

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Vyrian

USA . 4,214 parts In-Stock

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4,214

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Anansix

USA . 2,803 parts In-Stock

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2,803

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Distributors (Availability)

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Vigor

Singapore . 7,408 parts In-Stock

1+ parts

$8.610

100+ parts

-

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7,408

$8.610

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AZTECH Wire

Italy . 100 parts In-Stock

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$14.450

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100

$14.450

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IDEA Electronic Components Group

UK . 1,887 parts In-Stock

1+ parts

$25.570

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$23.013

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1,887

$25.570

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$23.013

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Microchip USA

USA . 2,194 parts In-Stock

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$26.835

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2,194

$26.835

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MKK Technologies

India . 1,482 parts In-Stock

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$48.082

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1,482

$48.082

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DigiPath Technology Company

USA . 1,482 parts In-Stock

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$48.082

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1,482

$48.082

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QUARKTWIN TECHNOLOGY LTD

USA . 8,860 parts In-Stock

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8,860

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Parana Technologies

USA . 1,705 parts In-Stock

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$30.572

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1,705

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$30.572

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Corphita

USA . 957 parts In-Stock

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957

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Overview

Unlock the full potential of your next project with the SPC56AP60L5CEFBY microcontroller by STMicroelectronics. With a reputation for excellence in the industry, STMicroelectronics delivers unparalleled quality and reliability. This microcontroller is ideal for a wide range of applications, offering advanced features such as ADC and DMA channels, PWM capabilities, and a high clock frequency of 40 MHz. Experience seamless integration and superior performance with the SPC56AP60L5CEFBY, providing value and innovation to customers looking to elevate their designs.

Feature Benefit Bullets

Surface Mount: YES

Easy to mount directly onto a circuit board, saving space and facilitating automated manufacturing processes.

Maximum Supply Voltage: 3.6 V

Suitable for a wide range of applications while providing protection against voltage spikes.

Address Bus Width: 32

Allows for efficient memory addressing and data transfer within the microcontroller.

Package Shape: SQUARE

Compact shape that optimizes space on the circuit board and facilitates heat dissipation.

Bit Size: 32

High processing power and data handling capabilities, suitable for complex operations.

No. of Terminals: 144

Allows for a wide range of input/output connections and peripherals to be integrated.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Provides flexibility in mounting options and compatibility with various manufacturing processes.

Minimum Supply Voltage: 1.8 V

Allows for low power operation, contributing to energy efficiency and extended battery life.

ADC Channels: YES

Enables analog-to-digital conversion for interfacing with sensors and other analog components.

DMA Channels: YES

Facilitates direct memory access for efficient data transfer without CPU intervention.

Terminal Position: QUAD

Optimal terminal arrangement for easy and secure connections within the circuit design.

Width: 20 mm

Compact size allows for integration into space-constrained designs.

External Data Bus Width: 32

High-speed data transfer between the microcontroller and external components.

Maximum Clock Frequency: 40 MHz

High-speed processing capabilities for quick execution of instructions and tasks.

Length: 20 mm

Symmetrical shape for uniform layout design and efficient use of space.

Peripheral IC Type: MICROCONTROLLER, RISC

Based on Reduced Instruction Set Computing (RISC) architecture for streamlined and efficient processing.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology for low power consumption and high reliability.

Terminal Form: GULL WING

Secure and reliable terminal design for soldering onto the circuit board.

Nominal Supply Voltage: 3 V

Stable supply voltage for consistent and reliable operation of the microcontroller.

PWM Channels: YES

Pulse Width Modulation output channels for precise control of analog signals.

Terminal Pitch: 0.5 mm

Fine pitch for compact terminal spacing, enabling high-density circuit board designs.

Speed: 64 rpm

Operational speed specification for efficient processing and performance.

No. of I/O Lines: 106

Abundance of input/output lines for versatile connectivity and control options.

Technical Specifications

Microcontrollers SPC56AP60L5CEFBY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

32

Length:

20 mm

No. of I/O Lines:

106

No. of Terminals:

144

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

64 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Trade Compliance

SPC56AP60L5CEFBY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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