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SPC56AP60L5BEFAR

STMicroelectronics

SPC56AP60L5BEFAR by STMicroelectronics

SPC56AP60L5BEFAR by STMicroelectronics is a 32-bit microcontroller with 32-bit external data bus width and max clock frequency of 40 MHz. It features ADC and DMA channels, suitable for applications requiring high-speed processing and precise analog-to-digital conversion. Ideal for automotive control systems due to its robust design and advanced peripheral integration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,772 parts In-Stock

1+ parts

-

100+ parts

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2,772

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Digiode

USA . 2,210 parts In-Stock

1+ parts

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1k+ parts

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2,210

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Anansix

USA . 1,827 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,827

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,103 parts In-Stock

1+ parts

$7.480

100+ parts

-

1k+ parts

-

10k+ parts

-

1,103

$7.480

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-

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AZTECH Wire

Italy . 105 parts In-Stock

1+ parts

$21.890

100+ parts

-

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-

10k+ parts

-

105

$21.890

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Microchip USA

USA . 2,023 parts In-Stock

1+ parts

$23.875

100+ parts

-

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2,023

$23.875

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IDEA Electronic Components Group

UK . 1,510 parts In-Stock

1+ parts

$41.071

100+ parts

-

1k+ parts

$36.964

10k+ parts

-

1,510

$41.071

-

$36.964

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MKK Technologies

India . 1,460 parts In-Stock

1+ parts

$77.231

100+ parts

-

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10k+ parts

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1,460

$77.231

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DigiPath Technology Company

USA . 1,460 parts In-Stock

1+ parts

$77.231

100+ parts

-

1k+ parts

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1,460

$77.231

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Corphita

USA . 4,881 parts In-Stock

1+ parts

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4,881

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Kepictronics

USA . 97 parts In-Stock

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97

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Parana Technologies

USA . 11 parts In-Stock

1+ parts

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100+ parts

$49.106

1k+ parts

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11

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$49.106

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Overview

Experience the unparalleled quality and reliability of STMicroelectronics with the SPC56AP60L5BEFAR microcontroller. Perfect for a wide range of applications, this advanced device offers customers seamless integration, superior performance, and innovative features to meet all your project needs. With its cutting-edge technology and versatile design, this microcontroller provides endless possibilities for innovation and success. Upgrade your projects today with the SPC56AP60L5BEFAR and discover the difference STMicroelectronics can make for you.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for compact and easy integration on PCBs, making the product space-efficient and suitable for small electronic devices.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5V, the microcontroller can handle higher voltage inputs, providing flexibility in power supply options.

Address Bus Width: 32

A wider address bus width of 32 allows for handling larger memory spaces and complex data processing tasks efficiently.

Package Shape: SQUARE

The square package shape simplifies the design layout and ensures uniform heat dissipation for improved performance.

Bit Size: 32

A 32-bit architecture offers enhanced computational power and precision in processing data, suitable for demanding applications.

No. of Terminals: 144

The high number of terminals provide ample I/O connectivity options, enabling versatile interfacing with external devices and peripherals.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style ensures a compact form factor and efficient thermal management, ideal for applications with space constraints.

Minimum Supply Voltage: 4.5 V

With a minimum supply voltage of 4.5V, the microcontroller can operate effectively even at lower power supply levels, enhancing energy efficiency.

ADC Channels: YES

The presence of ADC channels enables analog-to-digital conversion, facilitating interfacing with analog sensors and signals for data acquisition.

DMA Channels: YES

Integrated Direct Memory Access (DMA) channels enhance data transfer efficiency and offload the CPU, enabling faster and more efficient data processing.

Terminal Position: QUAD

The quad terminal position offers a balanced layout for easy PCB routing and efficient signal flow, contributing to overall system reliability.

Width: 20 mm

The compact 20mm width makes the microcontroller suitable for applications requiring a small footprint and space-saving design.

External Data Bus Width: 32

With a wider external data bus width of 32, the microcontroller can transfer data between peripherals and memory modules at high speeds, enhancing overall system performance.

Maximum Clock Frequency: 40 MHz

The high maximum clock frequency of 40MHz allows for rapid data processing and optimal performance in real-time applications.

Length: 20 mm

The 20mm length complements the compact width, making the microcontroller suitable for space-constrained applications without compromising on functionality.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller ensures efficient instruction execution and minimal cycle times, leading to enhanced processing speed and performance.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of operating voltages, making the product energy-efficient and versatile.

Terminal Form: GULL WING

The gull wing terminal form provides reliable soldering connections and enhances mechanical stability, ensuring robust performance in various environmental conditions.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures compatibility with standard power sources, simplifying integration and deployment in diverse electronic systems.

PWM Channels: YES

The availability of PWM channels enables precise control of analog signals, making the microcontroller suitable for applications requiring accurate voltage modulation and motor control.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm allows for high-density packaging and facilitates miniaturization of electronic devices, ideal for compact and handheld products.

Speed: 64 rpm

The operating speed of 64 revolutions per minute (rpm) indicates the rapid data processing capabilities of the microcontroller, ensuring efficient execution of tasks within specified timelines.

No. of I/O Lines: 106

The generous number of I/O lines provides ample flexibility for interfacing with external devices, sensors, and peripherals, enabling versatile functionality and connectivity options.

Technical Specifications

Microcontrollers SPC56AP60L5BEFAR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

32

Length:

20 mm

No. of I/O Lines:

106

No. of Terminals:

144

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

64 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Trade Compliance

SPC56AP60L5BEFAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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