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SPC56AP60L3CEFBY

STMicroelectronics

SPC56AP60L3CEFBY by STMicroelectronics

STMicroelectronics SPC56AP60L3CEFBY microcontroller features 32-bit address and external data bus width, with 40 MHz max clock frequency. Suitable for applications requiring ADC and DMA channels, it operates at a speed of 64 rpm with a supply voltage range of 1.8V to 3.6V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,101 parts In-Stock

1+ parts

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8,101

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Digiode

USA . 3,784 parts In-Stock

1+ parts

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3,784

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Anansix

USA . 1,406 parts In-Stock

1+ parts

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1,406

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 1,939 parts In-Stock

1+ parts

$11.117

100+ parts

-

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1,939

$11.117

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AZTECH Wire

Italy . 120 parts In-Stock

1+ parts

$14.250

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120

$14.250

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IDEA Electronic Components Group

UK . 1,806 parts In-Stock

1+ parts

$63.801

100+ parts

-

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$57.421

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1,806

$63.801

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$57.421

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MKK Technologies

India . 392 parts In-Stock

1+ parts

$119.974

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392

$119.974

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DigiPath Technology Company

USA . 392 parts In-Stock

1+ parts

$119.974

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392

$119.974

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Corphita

USA . 2,907 parts In-Stock

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2,907

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Vigor

Singapore . 1,299 parts In-Stock

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1,299

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Parana Technologies

USA . 221 parts In-Stock

1+ parts

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100+ parts

$76.284

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221

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$76.284

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Overview

Unleash the power of innovation with the SPC56AP60L3CEFBY microcontroller by STMicroelectronics. As a trusted industry leader, STMicroelectronics delivers unparalleled quality and reliability in their products. This microcontroller is perfect for a wide range of applications, offering customers exceptional value and benefits. From its high-performance capabilities to its versatility, this product provides a seamless solution for all your embedded system needs. Experience the difference with the SPC56AP60L3CEFBY and take your projects to the next level.

Feature Benefit Bullets

Surface Mount: YES

Enables easy and convenient mounting on circuit boards, saving space and allowing for efficient assembly.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of power sources to be used with the microcontroller, increasing flexibility in design.

Address Bus Width: 32

Provides a large address space for memory and peripherals, allowing for more complex applications to be implemented.

Package Shape: SQUARE

Square shape makes it easy to handle and place on PCBs, facilitating efficient circuit layout.

Bit Size: 32

Offers a high level of processing power and data handling capability, suitable for demanding tasks.

No. of Terminals: 100

Provides ample connectivity options for peripherals and external devices, enhancing the microcontroller's versatility.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers improved thermal performance, reduced signal interference, and ease of manufacturing.

Minimum Supply Voltage: 1.8 V

Allows for operation on lower voltage sources, helping to reduce power consumption and extend battery life.

ADC Channels: YES

Integrated Analog-to-Digital Converter channels enable the microcontroller to interface with analog sensors and signals.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency and offload the CPU for more critical tasks.

Terminal Position: QUAD

Quad terminal position facilitates soldering and ensures secure mounting on the PCB, enhancing reliability.

Width: 14 mm

Compact width allows for space-efficient placement on the circuit board, ideal for designs with size constraints.

External Data Bus Width: 32

Matches the internal data bus width to provide seamless data transfer between external memory and peripherals.

Maximum Clock Frequency: 40 MHz

High clock frequency enables fast processing speed, making the microcontroller suitable for real-time applications.

Length: 14 mm

Compact length facilitates efficient PCB layout and saves space in small form factor designs.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture delivers high performance with reduced instruction set complexity, ideal for embedded applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various voltage levels.

Terminal Form: GULL WING

Gull wing terminals provide strong mechanical support and allow for secure solder connections, ensuring reliability in operation.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage ensures consistent and reliable operation of the microcontroller for robust performance.

PWM Channels: YES

Pulse Width Modulation channels enable precise control of analog signals, essential for applications like motor control and lighting.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting on the PCB, saving space and enabling complex designs.

Speed: 64 rpm

Operating speed of 64 rpm ensures swift execution of instructions and efficient handling of data processing tasks.

No. of I/O Lines: 65

Sufficient I/O lines provide versatile connectivity options for interfacing with sensors, actuators, and external devices.

Technical Specifications

Microcontrollers SPC56AP60L3CEFBY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

32

Length:

14 mm

No. of I/O Lines:

65

No. of Terminals:

100

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

64 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SPC56AP60L3CEFBY Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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