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SPC56AP60L3CEFBR

STMicroelectronics

SPC56AP60L3CEFBR by STMicroelectronics

SPC56AP60L3CEFBR by STMicroelectronics is a 32-bit microcontroller with 32-bit external data bus width and 40 MHz max clock frequency. It features ADC and DMA channels, suitable for applications requiring high-speed processing like automotive control systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,007 parts In-Stock

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3,007

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Anansix

USA . 2,242 parts In-Stock

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2,242

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Digiode

USA . 788 parts In-Stock

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788

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Distributors (Availability)

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AZTECH Wire

Italy . 233 parts In-Stock

1+ parts

$11.420

100+ parts

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233

$11.420

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Microchip USA

USA . 2,044 parts In-Stock

1+ parts

$11.468

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2,044

$11.468

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IDEA Electronic Components Group

UK . 1,140 parts In-Stock

1+ parts

$57.650

100+ parts

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$51.885

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1,140

$57.650

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$51.885

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Component Stockers USA

USA . 337 parts In-Stock

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$99.990

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337

$99.990

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MKK Technologies

India . 815 parts In-Stock

1+ parts

$108.407

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815

$108.407

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DigiPath Technology Company

USA . 815 parts In-Stock

1+ parts

$108.407

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815

$108.407

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Vigor

Singapore . 1,261 parts In-Stock

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1,261

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Parana Technologies

USA . 570 parts In-Stock

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$68.929

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570

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$68.929

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Corphita

USA . 242 parts In-Stock

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242

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Overview

Experience the unmatched quality and cutting-edge technology of STMicroelectronics with the SPC56AP60L3CEFBR microcontroller. Designed for a wide range of applications, this powerful device offers unparalleled performance and reliability. With features such as ADC and DMA channels, PWM functionality, and a maximum clock frequency of 40 MHz, this microcontroller provides exceptional value to customers seeking high-speed processing capabilities in a compact package. Trust STMicroelectronics to deliver the innovation you need for your next project.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making this microcontroller suitable for mass production.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6V provides flexibility in powering the microcontroller and allows for compatibility with a wide range of peripherals.

Address Bus Width: 32

A wide address bus width of 32 bits enables the microcontroller to access a large memory address space, making it suitable for applications requiring extensive data storage.

Package Shape: SQUARE

The square package shape offers efficient use of PCB real estate and enables a compact design for space-constrained applications.

Bit Size: 32

A 32-bit architecture allows for processing of large data sets and complex algorithms, making the microcontroller suitable for high-performance applications.

No. of Terminals: 100

With 100 terminals, this microcontroller offers a wide range of connectivity options for interfacing with external devices and components, enhancing its versatility.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

The package style of flatpack, low profile, and fine pitch enables high-density mounting on the PCB, saving space and allowing for compact designs in modern electronics.

Minimum Supply Voltage: 1.8 V

Support for a minimum supply voltage of 1.8V allows for low-power operation, making this microcontroller suitable for battery-powered devices and energy-efficient applications.

ADC Channels: YES

Built-in ADC channels enable the microcontroller to interface with analog sensors and signals, expanding its capabilities for data acquisition and processing.

DMA Channels: YES

DMA channels support direct memory access for efficient data transfer between peripherals and memory, reducing CPU workload and improving overall system performance.

Terminal Position: QUAD

Quad terminal positioning allows for easy soldering and reliable connections on the PCB, enhancing the durability and stability of the microcontroller in harsh operating environments.

Width: 14 mm

A compact width of 14mm makes this microcontroller suitable for applications with limited physical space, offering flexibility in design and integration.

External Data Bus Width: 32

A wide external data bus width of 32 bits enables high-speed data transfer between the microcontroller and external memory or peripherals, improving overall system performance.

Maximum Clock Frequency: 40 MHz

Support for a maximum clock frequency of 40MHz allows for fast data processing and real-time operation, making this microcontroller suitable for applications requiring high-speed performance.

Length: 14 mm

A length of 14mm complements the compact width, allowing for a small footprint and efficient use of space in electronic designs.

Peripheral IC Type: MICROCONTROLLER, RISC

This microcontroller is based on a RISC architecture, offering high processing efficiency, low power consumption, and fast execution of instructions, making it ideal for embedded systems and IoT applications.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and compatibility with a wide range of voltage levels, making this microcontroller suitable for energy-efficient and versatile applications.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and secure mechanical connections on the PCB, ensuring reliability and stability in demanding operating conditions.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3V provides a stable power source for the microcontroller, ensuring consistent performance and reliability in various operating conditions.

PWM Channels: YES

Support for PWM channels enables the microcontroller to generate precise analog output signals, making it suitable for applications such as motor control, LED dimming, and audio processing.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5mm allows for high-density mounting and reliable connections on the PCB, facilitating efficient assembly and space-saving design.

Speed: 64 rpm

With a speed rating of 64 rpm, this microcontroller can provide fast data processing and real-time control for a wide range of applications, including motor control and industrial automation.

No. of I/O Lines: 65

With 65 I/O lines, this microcontroller offers ample connectivity options for interfacing with external devices and peripherals, enhancing its flexibility and versatility in diverse applications.

Technical Specifications

Microcontrollers SPC56AP60L3CEFBR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

32

Length:

14 mm

No. of I/O Lines:

65

No. of Terminals:

100

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

64 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SPC56AP60L3CEFBR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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