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SPC56AP60L3BEFBR

STMicroelectronics

SPC56AP60L3BEFBR by STMicroelectronics

STMicroelectronics SPC56AP60L3BEFBR microcontroller features 32-bit address and external data bus width, with 40 MHz clock frequency. Ideal for applications requiring ADC and DMA channels, it operates at a voltage range of 1.8V to 3.6V in a compact square package style.

Median Price

$7.310

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$7.310

100+ parts

-

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150

$7.310

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Vyrian

USA . 4,407 parts In-Stock

1+ parts

-

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4,407

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Digiode

USA . 3,659 parts In-Stock

1+ parts

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3,659

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Anansix

USA . 2,370 parts In-Stock

1+ parts

-

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2,370

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Distributors (Availability)

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AZTECH Wire

Italy . 254 parts In-Stock

1+ parts

$5.320

100+ parts

-

1k+ parts

-

10k+ parts

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254

$5.320

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Vigor

Singapore . 4,408 parts In-Stock

1+ parts

$6.410

100+ parts

-

1k+ parts

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10k+ parts

-

4,408

$6.410

-

-

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Continental Prestige Electronics

USA . 4,368 parts In-Stock

1+ parts

$7.310

100+ parts

-

1k+ parts

-

10k+ parts

$7.163

4,368

$7.310

-

-

$7.163

Corohmni

South Africa . 36 parts In-Stock

1+ parts

$7.430

100+ parts

-

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36

$7.430

-

-

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Ampacity Inc.

Singapore . 337 parts In-Stock

1+ parts

$12.000

100+ parts

-

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-

337

$12.000

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Semicontronic

India . 1,559 parts In-Stock

1+ parts

$13.000

100+ parts

$12.675

1k+ parts

$12.610

10k+ parts

-

1,559

$13.000

$12.675

$12.610

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IDEA Electronic Components Group

UK . 1,594 parts In-Stock

1+ parts

$20.197

100+ parts

-

1k+ parts

$18.177

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1,594

$20.197

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$18.177

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Microchip USA

USA . 2,275 parts In-Stock

1+ parts

$20.467

100+ parts

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2,275

$20.467

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MKK Technologies

India . 2,205 parts In-Stock

1+ parts

$37.979

100+ parts

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2,205

$37.979

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DigiPath Technology Company

USA . 2,205 parts In-Stock

1+ parts

$37.979

100+ parts

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2,205

$37.979

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Aztec Data Supply Inc.

USA . 2,904 parts In-Stock

1+ parts

$45.825

100+ parts

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2,904

$45.825

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Argo Parts USA

USA . 2,328 parts In-Stock

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2,328

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Parana Technologies

USA . 2,293 parts In-Stock

1+ parts

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100+ parts

$24.148

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2,293

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$24.148

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A-Z Elektronik GmbH

Germany . 1,184 parts In-Stock

1+ parts

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1,184

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Corphita

USA . 340 parts In-Stock

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340

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Overview

Unleash the power of innovation with the SPC56AP60L3BEFBR microcontroller by STMicroelectronics, a cutting-edge technology leader. Designed for high performance and reliability, this versatile device is perfect for a wide range of applications. With its advanced features and top-notch quality, the SPC56AP60L3BEFBR offers customers unmatched value and benefits. Experience seamless operation and enhanced functionality with this exceptional product, setting new standards in the world of microcontrollers. Elevate your projects to the next level with the SPC56AP60L3BEFBR – the ultimate choice for discerning professionals seeking excellence.

Feature Benefit Bullets

Surface Mount: YES

Easy to mount on PCBs, saves space and reduces assembly time.

Maximum Supply Voltage: 3.6 V

Wide voltage range allows for versatility in power supply options.

Address Bus Width: 32

Allows for efficient memory address handling in data processing.

Package Shape: SQUARE

Square shape simplifies PCB layout and ensures easier integration.

Bit Size: 32

32-bit architecture enables high-speed processing and data handling capabilities.

No. of Terminals: 100

Sufficient number of terminals for connecting various external components.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

Offers multiple mounting options for flexibility in design.

Minimum Supply Voltage: 1.8 V

Low minimum voltage requirement for power-efficient operation.

ADC Channels: YES

Integrated analog-to-digital converters for accurate sensor data acquisition.

DMA Channels: YES

Direct Memory Access channels for efficient data transfer and processing.

Terminal Position: QUAD

Quad terminal configuration for easier soldering and connectivity.

Width: 14 mm

Compact width ideal for space-constrained designs.

External Data Bus Width: 32

32-bit external data bus provides high-speed data transfer capabilities.

Maximum Clock Frequency: 40 MHz

High clock frequency for rapid program execution and data processing.

Length: 14 mm

Compact length suitable for small form factor applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for enhanced performance and efficiency.

Technology: CMOS

CMOS technology for low power consumption and high-speed operation.

Terminal Form: GULL WING

Gull wing terminals for secure soldering and robust electrical connections.

Nominal Supply Voltage: 3 V

Standard nominal voltage for compatibility with common power sources.

PWM Channels: YES

Integrated Pulse Width Modulation channels for precise control of outputs.

Terminal Pitch: 0.5 mm

Fine terminal pitch for compact PCB layout and increased terminal density.

Speed: 64 rpm

Operating speed of 64 revolutions per minute for moderate performance applications.

No. of I/O Lines: 65

Sufficient number of input/output lines for versatile connectivity options.

Technical Specifications

Microcontrollers SPC56AP60L3BEFBR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

32

Length:

14 mm

No. of I/O Lines:

65

No. of Terminals:

100

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

64 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SPC56AP60L3BEFBR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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