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SPC56AP60L3BEABY

STMicroelectronics

SPC56AP60L3BEABY by STMicroelectronics

SPC56AP60L3BEABY by STMicroelectronics is a 32-bit microcontroller with 32-bit external data bus width and max clock frequency of 40 MHz. It features ADC and DMA channels, suitable for applications requiring high-speed processing and precise analog-to-digital conversion. Ideal for automotive electronics, industrial control systems, and consumer electronics due to its advanced capabilities in a compact package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,204 parts In-Stock

1+ parts

-

100+ parts

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5,204

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Digiode

USA . 4,337 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,337

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Anansix

USA . 1,131 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,131

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,524 parts In-Stock

1+ parts

$6.550

100+ parts

-

1k+ parts

-

10k+ parts

-

2,524

$6.550

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-

-

AZTECH Wire

Italy . 417 parts In-Stock

1+ parts

$12.230

100+ parts

-

1k+ parts

-

10k+ parts

-

417

$12.230

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-

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Microchip USA

USA . 2,305 parts In-Stock

1+ parts

$22.371

100+ parts

-

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2,305

$22.371

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-

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IDEA Electronic Components Group

UK . 12 parts In-Stock

1+ parts

$25.513

100+ parts

-

1k+ parts

$22.962

10k+ parts

-

12

$25.513

-

$22.962

-

MKK Technologies

India . 600 parts In-Stock

1+ parts

$47.976

100+ parts

-

1k+ parts

-

10k+ parts

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600

$47.976

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DigiPath Technology Company

USA . 600 parts In-Stock

1+ parts

$47.976

100+ parts

-

1k+ parts

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10k+ parts

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600

$47.976

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Corphita

USA . 4,345 parts In-Stock

1+ parts

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4,345

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QUARKTWIN TECHNOLOGY LTD

USA . 4,088 parts In-Stock

1+ parts

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4,088

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Parana Technologies

USA . 1,885 parts In-Stock

1+ parts

-

100+ parts

$30.505

1k+ parts

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10k+ parts

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1,885

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$30.505

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Overview

Discover the power and precision of the SPC56AP60L3BEABY microcontroller by STMicroelectronics. Crafted with the utmost quality and expertise, this innovative device is designed to elevate your projects with seamless performance and reliability. From automotive to industrial applications, this microcontroller is the perfect solution for high-speed processing and efficient data management. Trust in STMicroelectronics to deliver cutting-edge technology that exceeds expectations, providing you with unparalleled value and endless possibilities. Elevate your designs with the SPC56AP60L3BEABY microcontroller today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for compact size and easy automated assembly, making this microcontroller ideal for space-constrained applications.

Maximum Supply Voltage: 3.6 V

Wide voltage range provides flexibility in power supply options and compatibility with various peripherals and components.

Address Bus Width: 32

Large address bus width allows for efficient memory addressing and handling of large data sets.

Package Shape: SQUARE

Square package shape simplifies PCB layout and ensures efficient use of board space.

Bit Size: 32

32-bit processing capability enables high-performance computing and data processing tasks.

No. of Terminals: 100

Large number of terminals enables connectivity to a variety of external devices and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack low profile fine pitch package style provides high-density integration and ease of mounting on the PCB.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage helps in reducing power consumption and extends battery life in portable devices.

ADC Channels: YES

Integrated ADC channels allow for analog signal conversion, making this microcontroller suitable for sensor interfaces and data acquisition applications.

DMA Channels: YES

Direct Memory Access (DMA) channels enhance data transfer speed and efficiency, optimizing overall system performance.

Terminal Position: QUAD

Quad terminal position facilitates easier soldering and connection to the PCB, ensuring reliable electrical contact.

Width: 14 mm

Compact width dimension enables space-efficient design and integration into small form factor devices.

External Data Bus Width: 32

Wide external data bus width enhances data transfer speed and capability, improving overall system performance.

Maximum Clock Frequency: 40 MHz

High maximum clock frequency allows for fast processing speed and real-time performance in demanding applications.

Length: 14 mm

Short length dimension contributes to overall compactness and space-saving design of the microcontroller.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers efficient and optimized processing of instructions, suitable for embedded system applications.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and compatibility with various digital circuits, making this microcontroller power-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form enables easy surface mounting and ensures strong mechanical connections, enhancing overall reliability.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage ensures consistent performance and reliable operation of the microcontroller.

PWM Channels: YES

Presence of PWM channels enables precise control of analog signals and generation of PWM waveforms, essential for motor control and other applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting and space-efficient PCB design, suitable for compact devices and applications.

Speed: 64 rpm

Speed specification provides information about the rotational speed or processing speed of the microcontroller, indicating its performance capability.

No. of I/O Lines: 65

Sufficient number of I/O lines enable versatile connectivity options for interfacing with external devices and peripherals, enhancing system flexibility and functionality.

Technical Specifications

Microcontrollers SPC56AP60L3BEABY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

32

Length:

14 mm

No. of I/O Lines:

65

No. of Terminals:

100

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

64 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SPC56AP60L3BEABY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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