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SPC56AP60L3BEABR

STMicroelectronics

SPC56AP60L3BEABR by STMicroelectronics

STMicroelectronics SPC56AP60L3BEABR is a 32-bit microcontroller with 32-bit external data bus width and max clock frequency of 40 MHz. It features ADC and DMA channels, suitable for applications requiring high-speed processing such as automotive engine control units.

Median Price

$7.029

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 600 parts In-Stock

1+ parts

$7.029

100+ parts

-

1k+ parts

-

10k+ parts

-

600

$7.029

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-

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Vyrian

USA . 3,753 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,753

-

-

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Digiode

USA . 2,965 parts In-Stock

1+ parts

-

100+ parts

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2,965

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Anansix

USA . 2,308 parts In-Stock

1+ parts

-

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2,308

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,500 parts In-Stock

1+ parts

$6.160

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

$6.160

-

-

-

Continental Prestige Electronics

USA . 5,446 parts In-Stock

1+ parts

$7.029

100+ parts

-

1k+ parts

-

10k+ parts

$6.888

5,446

$7.029

-

-

$6.888

Netroflash

USA . 50 parts In-Stock

1+ parts

$7.029

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$7.029

-

-

-

AZTECH Wire

Italy . 749 parts In-Stock

1+ parts

$17.851

100+ parts

-

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-

10k+ parts

-

749

$17.851

-

-

-

Microchip USA

USA . 2,197 parts In-Stock

1+ parts

$19.681

100+ parts

-

1k+ parts

-

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2,197

$19.681

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-

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Ampacity Inc.

Singapore . 346 parts In-Stock

1+ parts

$28.000

100+ parts

-

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346

$28.000

-

-

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IDEA Electronic Components Group

UK . 2,180 parts In-Stock

1+ parts

$34.754

100+ parts

-

1k+ parts

$31.279

10k+ parts

-

2,180

$34.754

-

$31.279

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Aztec Data Supply Inc.

USA . 2,725 parts In-Stock

1+ parts

$52.908

100+ parts

-

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2,725

$52.908

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MKK Technologies

India . 765 parts In-Stock

1+ parts

$65.352

100+ parts

-

1k+ parts

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10k+ parts

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765

$65.352

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DigiPath Technology Company

USA . 765 parts In-Stock

1+ parts

$65.352

100+ parts

-

1k+ parts

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765

$65.352

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Corohmni

South Africa . 269 parts In-Stock

1+ parts

$82.056

100+ parts

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269

$82.056

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Corphita

USA . 3,159 parts In-Stock

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3,159

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Argo Parts USA

USA . 2,140 parts In-Stock

1+ parts

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2,140

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Parana Technologies

USA . 860 parts In-Stock

1+ parts

-

100+ parts

$41.554

1k+ parts

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10k+ parts

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860

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$41.554

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Overview

Elevate your projects with the SPC56AP60L3BEABR microcontroller by STMicroelectronics. Designed with precision and reliability in mind, this high-quality device offers a wide range of applications in various industries. Benefit from its advanced features, including ADC channels, DMA channels, and PWM channels, to enhance your designs and streamline your processes. Trust in STMicroelectronics' reputation for excellence and innovation as you unleash the full potential of your creations with the SPC56AP60L3BEABR. Upgrade your projects today and experience the value that only STMicroelectronics can provide.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for compact and efficient placement on circuit boards, saving space and enabling high-density designs.

Maximum Supply Voltage: 3.6 V

Capable of operating at a maximum voltage of 3.6V, providing flexibility in power supply options.

Address Bus Width: 32

Wide address bus width of 32 bits allows for larger memory addressing capabilities, crucial for handling complex and data-intensive tasks.

Package Shape: SQUARE

Square-shaped package ensures uniformity in design and facilitates easier integration into circuit layouts.

Bit Size: 32

32-bit architecture enables the microcontroller to process data in larger chunks, improving performance and efficiency.

No. of Terminals: 100

Ample terminals provide sufficient connectivity options for interfacing with external components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile package style with fine pitch enhances the overall compactness and sleekness of the design, ideal for space-constrained applications.

Minimum Supply Voltage: 1.8 V

Can operate at a minimum voltage of 1.8V, offering energy-efficient operation and the ability to work with lower power sources.

ADC Channels: YES

Built-in ADC channels enable analog-to-digital conversion without the need for external components, simplifying system design.

DMA Channels: YES

Support for DMA channels facilitates efficient data transfer and processing, enhancing overall system performance.

Terminal Position: QUAD

Quad-terminal position simplifies connections and improves the overall reliability of the connections.

Width: 14 mm

Compact width of 14mm makes it suitable for applications where space is limited while ensuring ease of integration and layout.

External Data Bus Width: 32

Large external data bus width of 32 bits allows for seamless communication with external memory and peripherals, enhancing system capabilities.

Maximum Clock Frequency: 40 MHz

Capable of operating at a maximum clock frequency of 40MHz, providing high-speed processing capabilities for demanding applications.

Length: 14 mm

Compact length of 14mm complements the width, making it an ideal choice for compact and space-efficient designs.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes RISC architecture for efficient instruction execution and control, enhancing performance and power efficiency.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller reliable and energy-efficient.

Terminal Form: GULL WING

Gull-wing terminal form provides secure solder connections and ease of soldering, ensuring reliable electrical connections.

Nominal Supply Voltage: 3 V

Operating at a nominal voltage of 3V ensures compatibility with standard power sources and simplifies power management.

PWM Channels: YES

Presence of PWM channels allows for precise control of analog signals, essential for a wide range of applications including motor control and LED dimming.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density packaging and finer routing, contributing to compact and efficient system design.

Speed: 64 rpm

Operating speed of 64rpm ensures fast and responsive performance, making it suitable for real-time applications and time-critical tasks.

No. of I/O Lines: 65

Abundance of I/O lines allows for versatile connectivity options and facilitates communication with external devices, expanding the functionality of the microcontroller.

Technical Specifications

Microcontrollers SPC56AP60L3BEABR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

32

Length:

14 mm

No. of I/O Lines:

65

No. of Terminals:

100

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

64 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SPC56AP60L3BEABR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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