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SPC56AP54L5CEFAY

STMicroelectronics

SPC56AP54L5CEFAY by STMicroelectronics

SPC56AP54L5CEFAY by STMicroelectronics is a 32-bit microcontroller with 32-bit external data bus width and max clock frequency of 40 MHz. It features ADC and DMA channels, suitable for applications requiring high-speed processing and precise analog-to-digital conversion. Ideal for automotive control systems due to its robust design and advanced peripheral integration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,312 parts In-Stock

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Digiode

USA . 2,513 parts In-Stock

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2,513

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Anansix

USA . 1,772 parts In-Stock

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1,772

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Distributors (Availability)

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Microchip USA

USA . 1,219 parts In-Stock

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$13.161

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1,219

$13.161

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AZTECH Wire

Italy . 783 parts In-Stock

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$14.990

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783

$14.990

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IDEA Electronic Components Group

UK . 1,088 parts In-Stock

1+ parts

$57.475

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$51.728

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1,088

$57.475

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$51.728

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Component Stockers USA

USA . 564 parts In-Stock

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$99.990

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564

$99.990

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MKK Technologies

India . 1,685 parts In-Stock

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$108.078

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1,685

$108.078

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DigiPath Technology Company

USA . 1,685 parts In-Stock

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$108.078

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$108.078

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Vigor

Singapore . 1,354 parts In-Stock

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Parana Technologies

USA . 649 parts In-Stock

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$68.720

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649

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$68.720

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Corphita

USA . 573 parts In-Stock

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Overview

Unlock the potential of your projects with the SPC56AP54L5CEFAY microcontroller by STMicroelectronics. Crafted with precision and expertise, this device is designed to deliver unparalleled performance and reliability. Ideal for a wide range of applications, this microcontroller boasts advanced features such as ADC and DMA channels, PWM capabilities, and a maximum clock frequency of 40 MHz. With its compact design and exceptional functionality, the SPC56AP54L5CEFAY offers customers unmatched value and benefits. Experience superior quality and innovation with STMicroelectronics' cutting-edge microcontrollers.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy assembly onto PCBs, saving time and effort in manufacturing process.

Maximum Supply Voltage: 5.5 V

Can handle higher voltage inputs, providing flexibility in power supply options.

Address Bus Width: 32

Provides a larger address space, enabling the microcontroller to access more memory locations.

Package Shape: SQUARE

Square package shape facilitates easier placement and alignment on the PCB layout.

Bit Size: 32

32-bit architecture enables faster processing and greater computational capabilities.

No. of Terminals: 144

High number of terminals allows for more connectivity options and peripherals to be interfaced.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack style with low profile and fine pitch makes it suitable for space-constrained designs.

Minimum Supply Voltage: 4.5 V

Can operate at lower voltage levels, conserving power and extending battery life.

ADC Channels: YES

Integrated ADC channels enable analog signal sampling and conversion for sensor interfacing.

DMA Channels: YES

Support for Direct Memory Access (DMA) channels allows for efficient data transfers without CPU intervention.

Terminal Position: QUAD

Quad terminal position facilitates easier soldering and connection to external components.

Width: 20 mm

Compact width size makes it suitable for space-constrained designs and portable devices.

External Data Bus Width: 32

Wide external data bus width enables faster data transfer rates and better performance.

Maximum Clock Frequency: 40 MHz

High clock frequency allows for faster processing and execution of instructions.

Length: 20 mm

Compact length size makes it suitable for small form factor designs and applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient instruction execution and better performance in embedded applications.

Technology: CMOS

CMOS technology provides low power consumption and higher noise immunity for reliable operation.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical stability and ease of soldering during assembly process.

Nominal Supply Voltage: 5 V

Stable 5V supply voltage ensures consistent and reliable operation of the microcontroller.

PWM Channels: YES

Support for Pulse Width Modulation (PWM) channels enables precise control of motor speed and power output.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high density mounting and compact footprint on the PCB.

Speed: 64 rpm

Operating at a speed of 64 rotations per minute, suitable for various motor control applications.

No. of I/O Lines: 106

Large number of I/O lines provide versatile input and output options for connecting external devices and peripherals.

Technical Specifications

Microcontrollers SPC56AP54L5CEFAY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

32

Length:

20 mm

No. of I/O Lines:

106

No. of Terminals:

144

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Speed:

64 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

SPC56AP54L5CEFAY Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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