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SPC56AP54L5BEFAY

STMicroelectronics

SPC56AP54L5BEFAY by STMicroelectronics

SPC56AP54L5BEFAY by STMicroelectronics is a 32-bit microcontroller with 32-bit external data bus width and max clock frequency of 40 MHz. It features ADC and DMA channels, suitable for applications requiring high-speed processing and precise analog-to-digital conversion. Ideal for automotive control systems due to its robust design and advanced peripheral integration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,389 parts In-Stock

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6,389

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Digiode

USA . 3,584 parts In-Stock

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3,584

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Anansix

USA . 277 parts In-Stock

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277

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 1,650 parts In-Stock

1+ parts

$12.013

100+ parts

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1,650

$12.013

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AZTECH Wire

Italy . 254 parts In-Stock

1+ parts

$19.440

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254

$19.440

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IDEA Electronic Components Group

UK . 354 parts In-Stock

1+ parts

$42.464

100+ parts

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$38.218

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354

$42.464

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$38.218

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MKK Technologies

India . 1,107 parts In-Stock

1+ parts

$79.852

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1,107

$79.852

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DigiPath Technology Company

USA . 1,107 parts In-Stock

1+ parts

$79.852

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1,107

$79.852

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Vigor

Singapore . 5,813 parts In-Stock

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5,813

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Corphita

USA . 3,777 parts In-Stock

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3,777

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Parana Technologies

USA . 1,846 parts In-Stock

1+ parts

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$50.773

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1,846

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$50.773

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Overview

Upgrade your projects with the SPC56AP54L5BEFAY microcontroller by STMicroelectronics. This high-quality device offers unmatched performance and reliability for a wide range of applications. With advanced features like ADC and DMA channels, PWM capabilities, and a fast clock frequency, this microcontroller is perfect for demanding projects that require precision and speed. Trust in STMicroelectronics' reputation for excellence in the industry and experience the value and benefits that the SPC56AP54L5BEFAY can bring to your designs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving space and reducing production costs.

Maximum Supply Voltage: 5.5 V

Ability to handle a maximum supply voltage of 5.5V provides flexibility in power supply options and compatibility with a wide range of applications.

Address Bus Width: 32

A wider address bus width of 32 enables the microcontroller to access a larger memory space, supporting more complex algorithms and data processing tasks.

Package Shape: SQUARE

A square package shape helps in efficient utilization of space on the PCB, allowing for compact and streamlined circuit designs.

Bit Size: 32

With a bit size of 32, the microcontroller can perform operations on 32-bit data at once, improving processing speed and efficiency.

No. of Terminals: 144

Having a higher number of terminals provides more connectivity options for interfacing with external components and peripherals, enhancing versatility.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

The package style of flatpack, low profile, and fine pitch ensures a compact form factor, making it suitable for space-constrained applications.

Minimum Supply Voltage: 4.5 V

Support for a minimum supply voltage of 4.5V ensures reliable operation even in low power scenarios, enhancing overall reliability.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to convert analog signals into digital data, expanding its capabilities for sensor interfacing and signal processing.

DMA Channels: YES

DMA channels facilitate direct memory access, reducing the workload on the CPU and improving overall system performance during data transfers.

Terminal Position: QUAD

Quad terminal positioning offers convenient access for connecting external devices, making integration and troubleshooting easier.

Width: 20 mm

A compact width of 20mm allows for space-efficient PCB layout and integration in small form factor devices.

External Data Bus Width: 32

Having an external data bus width of 32 enables high-speed data transfer between the microcontroller and external memory devices, enhancing overall performance.

Maximum Clock Frequency: 40 MHz

The high maximum clock frequency of 40MHz supports rapid data processing and real-time operation, making it suitable for applications requiring quick response times.

Length: 20 mm

A length of 20mm complements the compact width, ensuring a space-efficient overall footprint for the microcontroller.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers improved performance and power efficiency compared to CISC architectures, suiting applications with resource constraints.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and enhanced reliability, making it ideal for battery-operated and portable devices.

Terminal Form: GULL WING

Gull wing terminal form simplifies soldering during assembly, ensuring secure connections and reliable operation in challenging environmental conditions.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5V offers a standard power level for compatibility with a wide range of components and power sources.

PWM Channels: YES

PWM channels support pulse-width modulation, allowing precise control over output signals such as motor speed, LED brightness, and sound generation.

Terminal Pitch: 0.5 mm

A fine terminal pitch of 0.5mm enables high-density mounting on PCBs, optimizing space usage and allowing for more features in a compact design.

Speed: 64 rpm

With a speed of 64 revolutions per minute, the microcontroller can accurately control motors and actuators, enhancing motion control applications.

No. of I/O Lines: 106

Having 106 I/O lines provides ample connectivity options for interfacing with external sensors, displays, and communication modules, enhancing versatility and expandability.

Technical Specifications

Microcontrollers SPC56AP54L5BEFAY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

32

Length:

20 mm

No. of I/O Lines:

106

No. of Terminals:

144

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Speed:

64 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

SPC56AP54L5BEFAY Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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