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SPC56AP54L5BEFAR

STMicroelectronics

SPC56AP54L5BEFAR by STMicroelectronics

SPC56AP54L5BEFAR microcontroller by STMicroelectronics features a 32-bit address bus width, 40 MHz max clock frequency, and 106 I/O lines. It is suitable for applications requiring high-speed data processing, such as automotive engine control units and industrial automation systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,681 parts In-Stock

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4,681

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Digiode

USA . 2,343 parts In-Stock

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2,343

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Anansix

USA . 907 parts In-Stock

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907

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Distributors (Availability)

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Microchip USA

USA . 978 parts In-Stock

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$13.021

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978

$13.021

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IDEA Electronic Components Group

UK . 191 parts In-Stock

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$18.600

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$16.740

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191

$18.600

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$16.740

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AZTECH Wire

Italy . 843 parts In-Stock

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$19.970

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843

$19.970

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MKK Technologies

India . 596 parts In-Stock

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$34.975

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596

$34.975

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DigiPath Technology Company

USA . 596 parts In-Stock

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$34.975

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596

$34.975

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Component Stockers USA

USA . 204 parts In-Stock

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$99.990

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204

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 5,630 parts In-Stock

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5,630

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Corphita

USA . 4,200 parts In-Stock

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Vigor

Singapore . 3,000 parts In-Stock

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Parana Technologies

USA . 418 parts In-Stock

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$22.239

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418

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$22.239

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Overview

Unleash the power of innovation with the SPC56AP54L5BEFAR by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-notch quality microcontrollers that are perfect for a wide range of applications. From automotive to consumer electronics, this product offers unparalleled value, benefits, and advantages to customers seeking reliable performance and advanced features. Elevate your projects with the cutting-edge technology and superior engineering of STMicroelectronics microcontrollers.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient soldering onto a PCB, making the product suitable for automated assembly processes.

Maximum Supply Voltage: 5.5 V

Higher maximum supply voltage provides flexibility in power supply options and can handle a wide range of input voltages.

Address Bus Width: 32

A wider address bus allows for accessing a larger memory space and handling more complex data processing tasks.

Bit Size: 32

A larger bit size allows for processing larger data chunks at a time, improving overall performance and efficiency.

No. of Terminals: 144

Having a higher number of terminals provides more connectivity options for peripherals and external devices, making the product versatile.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The package style allows for compact and space-saving designs, ideal for applications where size constraints are a concern.

Maximum Clock Frequency: 40 MHz

Higher clock frequency enables faster processing speeds, making the product suitable for real-time applications and high-performance tasks.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a microcontroller with RISC architecture allows for efficient and streamlined execution of instructions, improving overall system performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Technical Specifications

Microcontrollers SPC56AP54L5BEFAR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

32

Length:

20 mm

No. of I/O Lines:

106

No. of Terminals:

144

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Speed:

64 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

SPC56AP54L5BEFAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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