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SPC56AP54L3BEFBY

STMicroelectronics

SPC56AP54L3BEFBY by STMicroelectronics

SPC56AP54L3BEFBY microcontroller by STMicroelectronics features a 32-bit address and external data bus width, with a max clock frequency of 40 MHz. It is suitable for applications requiring ADC and DMA channels, offering 65 I/O lines in a compact square package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,778 parts In-Stock

1+ parts

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8,778

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Digiode

USA . 4,815 parts In-Stock

1+ parts

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4,815

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Anansix

USA . 410 parts In-Stock

1+ parts

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410

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,264 parts In-Stock

1+ parts

$6.720

100+ parts

-

1k+ parts

-

10k+ parts

-

2,264

$6.720

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-

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AZTECH Wire

Italy . 1,093 parts In-Stock

1+ parts

$17.920

100+ parts

-

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10k+ parts

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1,093

$17.920

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Microchip USA

USA . 2,509 parts In-Stock

1+ parts

$23.264

100+ parts

-

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2,509

$23.264

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IDEA Electronic Components Group

UK . 210 parts In-Stock

1+ parts

$64.526

100+ parts

-

1k+ parts

$58.073

10k+ parts

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210

$64.526

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$58.073

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MKK Technologies

India . 1,907 parts In-Stock

1+ parts

$121.337

100+ parts

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1,907

$121.337

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DigiPath Technology Company

USA . 1,907 parts In-Stock

1+ parts

$121.337

100+ parts

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1,907

$121.337

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Parana Technologies

USA . 1,630 parts In-Stock

1+ parts

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100+ parts

$77.151

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1,630

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$77.151

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Corphita

USA . 407 parts In-Stock

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407

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Overview

Unlock a world of possibilities with the SPC56AP54L3BEFBY by STMicroelectronics. This high-quality microcontroller offers unparalleled performance and reliability, making it the ideal choice for a wide range of applications. From automotive to industrial automation, this versatile device delivers exceptional value and benefits to customers looking for cutting-edge technology. Trust STMicroelectronics to provide innovative solutions that exceed expectations. Choose the SPC56AP54L3BEFBY and experience the difference today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the microcontroller on PCBs, reducing overall production costs.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6V provides flexibility in power input requirements for various applications.

Address Bus Width: 32

A wider address bus width of 32 bits enables the microcontroller to access a larger memory space, enhancing processing capabilities.

Package Shape: SQUARE

Square package shape allows for efficient use of PCB real estate and easy integration into compact electronic devices.

Bit Size: 32

A 32-bit architecture provides higher computational capabilities and precision, making the microcontroller suitable for complex tasks.

No. of Terminals: 100

Having 100 terminals ensures sufficient connectivity options for interfacing with external components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, and fine pitch package style allows for easy integration into space-constrained designs while ensuring good thermal performance.

Minimum Supply Voltage: 1.8 V

Support for a minimum supply voltage of 1.8V provides energy-efficient operation and compatibility with low-power applications.

ADC Channels: YES

Built-in ADC channels enable analog signal acquisition and processing, enhancing the microcontroller's versatility in sensing and measurement applications.

DMA Channels: YES

Integrated DMA channels facilitate direct data transfer between memory and peripherals, improving overall system performance and efficiency.

Terminal Position: QUAD

Quad terminal position provides a stable and reliable connection to the PCB, ensuring robustness in operating conditions.

Width: 14 mm

A compact width of 14mm allows for space-efficient placement on the PCB, ideal for miniaturized electronic devices.

External Data Bus Width: 32

A wide external data bus width of 32 bits enables fast data transfer between the microcontroller and external memory, enhancing overall system performance.

Maximum Clock Frequency: 40 MHz

Support for a maximum clock frequency of 40 MHz ensures high-speed operation and real-time processing capabilities for demanding applications.

Length: 14 mm

A compact length of 14mm allows for space-efficient placement on the PCB, suitable for compact and portable electronic devices.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller allows for efficient instruction execution and reduced power consumption, making it ideal for embedded applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of voltages, making the microcontroller energy-efficient and versatile.

Terminal Form: GULL WING

Gull wing terminal form provides reliable solder connections and mechanical strength, ensuring durability and longevity in operation.

Nominal Supply Voltage: 3 V

Having a nominal supply voltage of 3V simplifies power supply requirements and offers compatibility with common voltage sources.

PWM Channels: YES

Support for PWM channels enables precise control of digital signals, making the microcontroller suitable for applications requiring accurate modulation and control.

Terminal Pitch: 0.5 mm

A small terminal pitch of 0.5mm allows for high-density mounting on the PCB, enabling compact and space-efficient designs.

Speed: 64 rpm

Operating at a speed of 64 rpm, the microcontroller offers efficient processing capabilities for a wide range of applications.

No. of I/O Lines: 65

Having 65 I/O lines provides ample connectivity options for interfacing with external devices and peripherals, enhancing the microcontroller's versatility.

Technical Specifications

Microcontrollers SPC56AP54L3BEFBY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

32

Length:

14 mm

No. of I/O Lines:

65

No. of Terminals:

100

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

64 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SPC56AP54L3BEFBY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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