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SPC564L70L5BBOSR

STMicroelectronics

SPC564L70L5BBOSR by STMicroelectronics

SPC564L70L5BBOSR by STMicroelectronics is a 32-bit microcontroller with 144 terminals, 16-bit address bus, and 3.3-3.63 V supply voltage range. It features ADC and DMA channels, suitable for applications requiring high-speed processing and precision analog-to-digital conversion in automotive systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,842 parts In-Stock

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4,842

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Digiode

USA . 3,011 parts In-Stock

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3,011

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Anansix

USA . 777 parts In-Stock

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777

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Distributors (Availability)

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AZTECH Wire

Italy . 58 parts In-Stock

1+ parts

$13.570

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58

$13.570

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Vigor

Singapore . 1,201 parts In-Stock

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$14.250

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1,201

$14.250

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IDEA Electronic Components Group

UK . 728 parts In-Stock

1+ parts

$24.826

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$22.344

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728

$24.826

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$22.344

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Microchip USA

USA . 2,922 parts In-Stock

1+ parts

$46.053

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2,922

$46.053

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MKK Technologies

India . 157 parts In-Stock

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$46.684

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157

$46.684

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DigiPath Technology Company

USA . 157 parts In-Stock

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$46.684

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157

$46.684

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Advanced Electronics

New Zealand . 750 parts In-Stock

1+ parts

$50.441

100+ parts

$45.901

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$41.362

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750

$50.441

$45.901

$41.362

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Component Stockers USA

USA . 247 parts In-Stock

1+ parts

$259.950

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247

$259.950

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Parana Technologies

USA . 1,898 parts In-Stock

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$29.684

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1,898

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$29.684

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Corphita

USA . 1,741 parts In-Stock

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Overview

Experience the cutting-edge technology and exceptional quality of the SPC564L70L5BBOSR microcontroller by STMicroelectronics. With a maximum clock frequency of 40 MHz and 32-bit bit size, this device offers unparalleled performance and reliability for a wide range of applications. Whether you are designing automotive systems, industrial control units, or consumer electronics, this microcontroller’s advanced features like ADC and DMA channels ensure seamless integration and efficient operation. Trust STMicroelectronics to deliver superior products that exceed your expectations and elevate your projects to new heights. Upgrade your designs with the SPC564L70L5BBOSR and unlock endless possibilities.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and compact mounting on PCBs, saving space and making the product suitable for small and compact electronic devices.

Maximum Supply Voltage: 3.63 V

A high maximum supply voltage provides flexibility in power supply options, allowing the product to be used in a variety of applications where higher voltages may be required.

Address Bus Width: 16

A wider address bus width allows for increased memory addressing capabilities, enabling the product to handle larger data sets and more complex algorithms efficiently.

Package Shape: SQUARE

The square package shape is convenient for PCB layout and space utilization, making it easy to integrate the product into electronic designs.

Bit Size: 32

A 32-bit architecture provides enhanced processing power and efficiency, allowing the product to execute complex instructions and handle data-intensive tasks with speed and precision.

No. of Terminals: 144

With a large number of terminals, the product offers ample connectivity options, enabling interfacing with various external devices and peripherals for versatile functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style enhances thermal performance, reduces signal interference, and facilitates high-density PCB designs, making the product suitable for advanced applications.

Minimum Supply Voltage: 3.3 V

A low minimum supply voltage ensures energy efficiency and compatibility with low-power applications, ensuring optimal performance and power consumption in various usage scenarios.

ADC Channels: YES

The presence of ADC channels allows the product to interface with analog sensors and signals, enabling precise analog-to-digital conversion and measurement capabilities for diverse sensing applications.

DMA Channels: YES

DMA channels enable direct memory access, improving data transfer speeds and efficiency, reducing CPU overhead, and enhancing overall system performance in data-intensive operations.

Terminal Position: QUAD

Quad terminal position arrangement simplifies PCB footprint design, enhances soldering and assembly efficiency, and ensures stable electrical connections, contributing to product reliability and ease of integration.

ROM Words: 524288

The large ROM capacity of 524288 words allows the product to store and execute extensive program code and data, enabling complex software applications and firmware to run smoothly on the device.

Width: 19.8 mm

The compact width of 19.8 mm makes the product suitable for space-constrained designs, offering flexibility in placement and integration in electronic devices where size is a critical consideration.

External Data Bus Width: 8

An external data bus width of 8 bits allows for efficient data transfer between the microcontroller and external devices, improving overall system performance in handling data-intensive tasks and communications.

Maximum Clock Frequency: 40 MHz

A high maximum clock frequency of 40 MHz provides fast processing speeds, enabling swift execution of instructions, rapid data processing, and real-time responsiveness in applications requiring quick computational tasks.

Length: 19.8 mm

The length of 19.8 mm complements the compact width of the product, ensuring uniform dimensions for seamless integration into electronic designs with limited space, maintaining a sleek and efficient form factor.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a microcontroller with Reduced Instruction Set Computing (RISC) architecture, the product offers efficient and streamlined instruction execution, minimizing power consumption and maximizing performance for embedded control applications.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology provides low power consumption, high noise immunity, and reliable operation, making the product energy-efficient, robust, and suitable for battery-powered or portable devices.

Terminal Form: GULL WING

Gull wing terminal form aids in easy surface mounting on PCBs, ensuring strong solder joints, reliable electrical connections, and efficient heat dissipation, enhancing product durability, performance, and manufacturability.

Nominal Supply Voltage: 3 V

A stable nominal supply voltage of 3 V ensures consistent and reliable operation of the product, offering compatibility with various power sources and maintaining optimal performance in diverse operating conditions.

PWM Channels: YES

Pulse Width Modulation (PWM) channels facilitate precise control of digital signals with variable pulse widths, enabling efficient motor control, LED dimming, and power management, enhancing the product's versatility and functionality.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm enables high-density PCB designs, minimizing signal crosstalk, reducing PCB footprint, and enhancing overall system performance, making the product ideal for compact and high-performance applications.

Speed: 120 rpm

With a speed of 120 revolutions per minute (rpm), the product is suitable for motor control applications, robotics, and other motion-based systems requiring adjustable and precise speed control for efficient operation.

No. of I/O Lines: 115

The large number of input/output (I/O) lines offers ample connectivity options for interfacing with external devices, sensors, and peripherals, enabling versatile and expandable functionality in a wide range of electronic applications.

Technical Specifications

Microcontrollers SPC564L70L5BBOSR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

8

Length:

19.8 mm

No. of I/O Lines:

115

No. of Terminals:

144

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Words:

524288

Speed:

120 rpm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

19.8 mm

Peripheral IC Type:

Trade Compliance

SPC564L70L5BBOSR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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