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SPC564L70L3CBFSY

STMicroelectronics

SPC564L70L3CBFSY by STMicroelectronics

SPC564L70L3CBFSY by STMicroelectronics is a 32-bit microcontroller with 16-bit address bus, 40 MHz clock frequency, and 524288 ROM words. It features ADC and DMA channels, suitable for applications requiring high-speed processing and precise data acquisition. Ideal for automotive systems, industrial control, and IoT devices due to its low profile package style and versatile I/O capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 11,580 parts In-Stock

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11,580

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Anansix

USA . 1,644 parts In-Stock

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1,644

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Digiode

USA . 493 parts In-Stock

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493

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Distributors (Availability)

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Ampacity Inc.

Singapore . 213 parts In-Stock

1+ parts

$9.000

100+ parts

-

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213

$9.000

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AZTECH Wire

Italy . 435 parts In-Stock

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$21.020

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435

$21.020

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Microchip USA

USA . 1,982 parts In-Stock

1+ parts

$48.905

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1,982

$48.905

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IDEA Electronic Components Group

UK . 2,017 parts In-Stock

1+ parts

$65.166

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$58.650

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2,017

$65.166

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$58.650

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MKK Technologies

India . 705 parts In-Stock

1+ parts

$122.541

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705

$122.541

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DigiPath Technology Company

USA . 705 parts In-Stock

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$122.541

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705

$122.541

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Corphita

USA . 3,921 parts In-Stock

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3,921

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Parana Technologies

USA . 1,781 parts In-Stock

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$77.916

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1,781

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$77.916

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Perfect Parts

USA . 202 parts In-Stock

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Overview

Experience the next level of performance and reliability with the SPC564L70L3CBFSY microcontroller by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers cutting-edge technology that exceeds expectations. This versatile microcontroller is ideal for various applications, offering seamless integration and advanced features such as ADC and DMA channels. Unlock endless possibilities with the SPC564L70L3CBFSY and elevate your projects to new heights. Discover the value and benefits of choosing STMicroelectronics for all your microcontroller needs.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient mounting on circuit boards, saving space and simplifying the overall design.

Maximum Supply Voltage: 3.63 V

Provides a wide range of operating voltage, making it compatible with various power sources and applications.

Address Bus Width: 16

Enables efficient handling of memory addressing and data transfer within the microcontroller.

Package Shape: SQUARE

Square package shape offers good balance between space utilization and ease of handling during assembly.

Bit Size: 32

Higher bit size allows for more complex calculations and processing capabilities.

No. of Terminals: 100

Sufficient number of terminals for connecting various components and peripherals, increasing versatility.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers compact size, low profile for space-constrained designs, and fine pitch for high-density mounting.

Minimum Supply Voltage: 3.3 V

Ensures reliable operation even at lower voltage levels, enhancing the overall performance and stability.

ADC Channels: YES

Integrated ADC channels allow for analog input capabilities, enabling the microcontroller to interface with various sensors and external signals.

DMA Channels: YES

Support for Direct Memory Access channels enhances data transfer efficiency and frees up the CPU for other tasks.

Terminal Position: QUAD

Quad terminal position provides a balance between compactness and ease of soldering during assembly.

ROM Words: 524288

Large ROM capacity allows for storing a significant amount of program data, enhancing flexibility in application development.

Width: 14 mm

Compact width dimension facilitates integration into space-constrained designs.

External Data Bus Width: 8

Efficient handling of external data transfer with 8-bit bus width, suitable for a variety of input/output operations.

Maximum Clock Frequency: 40 MHz

High clock frequency enables fast processing and throughput, suitable for applications requiring real-time data handling.

Length: 14 mm

Compact length dimension facilitates space-saving integration in electronic devices.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilization of RISC architecture in peripheral IC type enhances instruction execution speed and efficiency.

Technology: CMOS

CMOS technology provides low power consumption and reliable operation, ideal for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminal form offers mechanical robustness and ease of soldering during assembly.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage ensures consistent performance and reliability in various operating conditions.

PWM Channels: YES

Integrated PWM channels enable precise control of analog outputs, suitable for applications requiring variable voltage or current control.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting and compact PCB layout.

Speed: 120 rpm

The specified speed of 120 rpm indicates the rotation speed capabilities, suitable for motor control applications.

No. of I/O Lines: 83

Sufficient number of input/output lines for connecting external devices and peripherals, enhancing the microcontroller's connectivity and versatility.

Technical Specifications

Microcontrollers SPC564L70L3CBFSY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

8

Length:

14 mm

No. of I/O Lines:

83

No. of Terminals:

100

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Words:

524288

Speed:

120 rpm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SPC564L70L3CBFSY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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