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SPC564L70L3CBFSR

STMicroelectronics

SPC564L70L3CBFSR by STMicroelectronics

SPC564L70L3CBFSR microcontroller by STMicroelectronics features a 32-bit architecture, 16-bit address bus width, and 40 MHz max clock frequency. Ideal for applications requiring high-speed processing and control, such as automotive engine management systems or industrial automation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,488 parts In-Stock

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8,488

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Digiode

USA . 1,916 parts In-Stock

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1,916

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Anansix

USA . 1,303 parts In-Stock

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1,303

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,282 parts In-Stock

1+ parts

$16.612

100+ parts

-

1k+ parts

$14.951

10k+ parts

-

1,282

$16.612

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$14.951

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AZTECH Wire

Italy . 482 parts In-Stock

1+ parts

$18.930

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482

$18.930

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MKK Technologies

India . 349 parts In-Stock

1+ parts

$31.239

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349

$31.239

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DigiPath Technology Company

USA . 349 parts In-Stock

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$31.239

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349

$31.239

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Microchip USA

USA . 3,336 parts In-Stock

1+ parts

$48.325

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3,336

$48.325

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QUARKTWIN TECHNOLOGY LTD

USA . 12,327 parts In-Stock

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12,327

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Corphita

USA . 2,207 parts In-Stock

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2,207

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Parana Technologies

USA . 1,797 parts In-Stock

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$19.863

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1,797

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$19.863

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Overview

Unleash the power of innovation with the SPC564L70L3CBFSR by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers unmatched quality and reliability in their microcontrollers. Ideal for a wide range of applications, this microcontroller offers customers exceptional value with its advanced features and high performance. Experience the benefits of seamless integration, efficient operation, and cutting-edge technology that the SPC564L70L3CBFSR brings to your projects. Elevate your designs with this superior product and stay ahead of the competition.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy installation on a circuit board, making it suitable for compact designs and automated assembly processes.

Maximum Supply Voltage: 3.63 V

Provides a high voltage tolerance, allowing the microcontroller to operate effectively and reliably within a wide range of power supply conditions.

Address Bus Width: 16

Enables the microcontroller to access a larger memory space, facilitating complex data processing and multitasking capabilities.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board and enhances thermal performance.

Bit Size: 32

With a 32-bit architecture, the microcontroller can handle larger data sets and perform more complex calculations, improving overall performance.

No. of Terminals: 100

Provides a sufficient number of connections for interfacing with various external components, expanding the capabilities of the microcontroller.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low-profile, fine pitch package style enhances the overall compactness and durability of the microcontroller, making it suitable for space-constrained applications.

Minimum Supply Voltage: 3.3 V

Offers a low minimum supply voltage requirement, allowing for efficient power consumption and operation in low-power applications.

ADC Channels: YES

The presence of analog-to-digital converter channels enables the microcontroller to interface with analog sensors and signals, enabling a wider range of applications.

DMA Channels: YES

Supports direct memory access channels, allowing for efficient data transfer between peripherals and memory without CPU intervention, improving overall system performance.

Terminal Position: QUAD

The quad terminal position offers a secure and stable electrical connection, reducing the risk of signal interference and ensuring reliable operation.

ROM Words: 524288

With a large ROM size of 524288 words, the microcontroller can store a significant amount of program and data, enabling complex applications and firmware updates.

Width: 14 mm

The compact width of 14 mm allows for easy integration into tight spaces and small form factor designs.

External Data Bus Width: 8

An 8-bit external data bus width enables efficient data transfer between the microcontroller and external memory or peripherals, enhancing system performance.

Maximum Clock Frequency: 40 MHz

With a maximum clock frequency of 40 MHz, the microcontroller can execute instructions at a high speed, improving overall system responsiveness.

Length: 14 mm

The compact length of 14 mm complements the width dimensions, allowing for flexible placement and space-efficient designs.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a Reduced Instruction Set Computing (RISC) architecture, which enhances processing speed and efficiency, making it ideal for embedded applications.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of voltages, enhancing overall reliability and flexibility.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and robustness, ensuring secure mounting and reliable electrical connections.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3 V ensures stable and reliable operation within the specified voltage range, enhancing overall system performance and longevity.

PWM Channels: YES

The presence of Pulse Width Modulation (PWM) channels enables the microcontroller to generate precise analog signals, facilitating motor control and power management applications.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm allows for high-density mounting and enables compact PCB designs, making it suitable for space-constrained applications.

Speed: 120 rpm

With a speed rating of 120 rpm, the microcontroller is capable of fast and efficient data processing and execution, meeting the requirements of high-speed applications.

No. of I/O Lines: 83

The substantial number of input/output lines provides ample connectivity options for interfacing with external devices and peripherals, enhancing the versatility of the microcontroller.

Technical Specifications

Microcontrollers SPC564L70L3CBFSR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

8

Length:

14 mm

No. of I/O Lines:

83

No. of Terminals:

100

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Words:

524288

Speed:

120 rpm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SPC564L70L3CBFSR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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