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SPC564L54L3CBOQR

STMicroelectronics

SPC564L54L3CBOQR by STMicroelectronics

SPC564L54L3CBOQR by STMicroelectronics is a 32-bit microcontroller with 64-bit external data bus width, operating at up to 40 MHz. Designed for automotive applications, it features 98304 bytes of RAM, ADC and DMA channels, and flash ROM programmability.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,004 parts In-Stock

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5,004

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Digiode

USA . 3,023 parts In-Stock

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3,023

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Anansix

USA . 1,785 parts In-Stock

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1,785

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ComSIT Distribution GmbH

Germany . 124 parts In-Stock

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124

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ComSIT USA

USA . 124 parts In-Stock

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124

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Distributors (Availability)

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AZTECH Wire

Italy . 338 parts In-Stock

1+ parts

$18.710

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338

$18.710

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IDEA Electronic Components Group

UK . 219 parts In-Stock

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$48.029

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-

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$43.226

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219

$48.029

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$43.226

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MKK Technologies

India . 790 parts In-Stock

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$90.315

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790

$90.315

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DigiPath Technology Company

USA . 790 parts In-Stock

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$90.315

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790

$90.315

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Component Stockers USA

USA . 493 parts In-Stock

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$99.990

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493

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 14,342 parts In-Stock

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14,342

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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Vigor

Singapore . 6,800 parts In-Stock

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6,800

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Microchip USA

USA . 4,609 parts In-Stock

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4,609

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Parana Technologies

USA . 1,581 parts In-Stock

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$57.426

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Corphita

USA . 1,119 parts In-Stock

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Overview

Discover the unmatched quality and reliability of the SPC564L54L3CBOQR microcontroller by STMicroelectronics. As a leader in the industry, STMicroelectronics delivers cutting-edge solutions for a wide range of applications. This powerful microcontroller offers customers exceptional value, with advanced features like high-speed processing, versatile input/output options, and efficient power management. Whether you're designing automotive systems or industrial automation solutions, the SPC564L54L3CBOQR provides the performance and flexibility you need to bring your projects to life. Trust STMicroelectronics to deliver innovative technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the microcontroller easy to handle and suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing production costs.

Maximum Supply Voltage: 3.63 V

The high maximum supply voltage ensures reliable operation and flexibility in power supply options.

Address Bus Width: 32

With a wide address bus width, the microcontroller can access a large memory space and handle complex data processing tasks efficiently.

Package Shape: SQUARE

The square shape of the package allows for easy mounting and integration into various electronic devices and systems.

Bit Size: 32

The 32-bit architecture provides high processing power and supports advanced computing tasks and algorithms.

Power Supplies (V): 3.3

The 3.3V power supply ensures compatibility with standard voltage levels and efficient power consumption.

No. of Terminals: 100

The large number of terminals allows for versatile connectivity and interfacing with external components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers a compact design, low profile for space-constrained applications, and fine pitch for high-density PCB layouts.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures the microcontroller can operate in a wide range of power supply conditions.

Maximum Operating Temperature: 125 °C

The high operating temperature range makes the microcontroller suitable for industrial and automotive applications where temperature variations are common.

CPU Family: SPC56

The SPC56 CPU family offers high performance, low power consumption, and a rich set of peripherals, making it ideal for embedded system designs.

Minimum Operating Temperature: -40 °C

The wide temperature range allows the microcontroller to operate reliably in harsh environments with extreme cold conditions.

ADC Channels: YES

The presence of Analog-to-Digital Converter (ADC) channels enables the microcontroller to interface with analog sensors and signals for data acquisition.

DMA Channels: YES

Direct Memory Access (DMA) channels improve data transfer efficiency and offload the CPU for faster and more responsive system performance.

Terminal Position: QUAD

Quad terminal position simplifies PCB layout and routing and offers ease of soldering and assembly during manufacturing.

ROM Words: 786432

The large ROM capacity allows for storing firmware, code, and data, making the microcontroller suitable for complex applications and software requirements.

Width: 14 mm

The compact width of 14mm enables the microcontroller to be used in space-constrained designs and applications.

External Data Bus Width: 64

The wide external data bus width of 64 bits enables efficient data transfer between the microcontroller and external memory or peripheral devices.

Maximum Clock Frequency: 40 MHz

The high clock frequency of 40 MHz allows for fast processing speed and real-time responsiveness in computing tasks.

Length: 14 mm

The compact length of 14mm complements the width and square shape, making the microcontroller suitable for small form factor designs.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade certifies the microcontroller for use in automotive applications, ensuring reliability and performance in harsh operating conditions.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it integrates various peripherals and components on a single chip, reducing external components and simplifying system design.

RAM Bytes: 98304

The generous RAM size of 98304 bytes provides ample memory for data storage, variable allocation, and temporary workspace for processing tasks.

Technology: CMOS

The CMOS technology offers low power consumption, high noise immunity, and reliable operation, making the microcontroller suitable for battery-powered and sensitive applications.

Terminal Form: GULL WING

The gull wing terminal form ensures secure and reliable connections during soldering and assembly, reducing the risk of disconnections or faulty connections.

Maximum Supply Current: 311.6 mA

The maximum supply current of 311.6 mA indicates the power consumption requirements of the microcontroller, helping in selecting appropriate power supply and circuit design.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures stable and consistent power input, supporting reliable operation and compatibility with standard voltage levels.

PWM Channels: YES

The Pulse Width Modulation (PWM) channels enable precise control of motor speed, LED brightness, and other applications requiring variable output signals.

ROM Programmability: FLASH

The Flash ROM programmability allows for easy and quick updates of firmware and code, enabling flexibility and adaptability in software development.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm enables high-density packaging and PCB designs, reducing space requirements and allowing for compact system integration.

Speed: 120 rpm

The speed of 120 rpm indicates the microcontroller's processing capability in executing instructions and tasks, ensuring efficient performance in real-time applications.

No. of I/O Lines: 16

The 16 I/O lines allow for versatile input and output connections, enabling communication with external devices, sensors, and peripherals for system control and data exchange.

Technical Specifications

Microcontrollers SPC564L54L3CBOQR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

CPU Family:

SPC56

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

64

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

16

No. of Terminals:

100

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

786432

ROM Programmability:

FLASH

Speed:

120 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

311.6 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SPC564L54L3CBOQR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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