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SPC564B74L7B8E0X

STMicroelectronics

SPC564B74L7B8E0X by STMicroelectronics

SPC564B74L7B8E0X by STMicroelectronics is a 32-bit microcontroller with 176 terminals, operating at up to 40 MHz. It features 27-Ch 10-Bit ADCs and offers connectivity options like CAN, I2C, SPI, and UART. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 13,227 parts In-Stock

1+ parts

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13,227

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ComSIT Distribution GmbH

Germany . 3,269 parts In-Stock

1+ parts

-

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-

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3,269

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Chip Stock

USA . 1,085 parts In-Stock

1+ parts

-

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1,085

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Anansix

USA . 373 parts In-Stock

1+ parts

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-

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373

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Digiode

USA . 332 parts In-Stock

1+ parts

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332

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,092 parts In-Stock

1+ parts

$10.990

100+ parts

-

1k+ parts

-

10k+ parts

-

1,092

$10.990

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-

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Ampacity Inc.

Singapore . 1,222 parts In-Stock

1+ parts

$11.000

100+ parts

-

1k+ parts

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10k+ parts

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1,222

$11.000

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Vigor

Singapore . 1,462 parts In-Stock

1+ parts

$13.790

100+ parts

-

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1,462

$13.790

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-

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IDEA Electronic Components Group

UK . 2,045 parts In-Stock

1+ parts

$42.112

100+ parts

-

1k+ parts

$37.901

10k+ parts

-

2,045

$42.112

-

$37.901

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Microchip USA

USA . 2,422 parts In-Stock

1+ parts

$44.557

100+ parts

-

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2,422

$44.557

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MKK Technologies

India . 418 parts In-Stock

1+ parts

$79.189

100+ parts

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418

$79.189

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DigiPath Technology Company

USA . 418 parts In-Stock

1+ parts

$79.189

100+ parts

-

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418

$79.189

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Component Stockers USA

USA . 589 parts In-Stock

1+ parts

$167.460

100+ parts

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589

$167.460

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Corphita

USA . 4,308 parts In-Stock

1+ parts

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4,308

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Parana Technologies

USA . 1,973 parts In-Stock

1+ parts

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100+ parts

$50.351

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1,973

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$50.351

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Overview

Discover the SPC564B74L7B8E0X by STMicroelectronics, a top-of-the-line microcontroller that offers unparalleled quality and performance. With STMicroelectronics as the manufacturer, you can trust in the reliability and innovation of this product. This high-tech microcontroller is perfect for a wide range of applications, providing customers with exceptional value and benefits. Experience seamless connectivity, advanced peripherals, and low power mode all in one compact package. Upgrade your projects with the SPC564B74L7B8E0X and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, suitable for a variety of applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient mounting on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Operating at a maximum supply voltage of 3.6V provides flexibility in power supply options while ensuring stable performance.

Package Shape: SQUARE

Square package shape helps in optimizing board space and allows for efficient arrangement of components.

Bit Size: 32

32-bit architecture provides higher processing power and precision for complex applications.

No. of Terminals: 176

With 176 terminals, the microcontroller offers ample connectivity options for interfacing with various external devices and components.

Minimum Supply Voltage: 3 V

Operational at a minimum supply voltage of 3V ensures efficient power consumption and compatibility with lower voltage sources.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105 °C enables reliable performance in demanding industrial environments.

CPU Family: E200Z4

Belonging to the E200Z4 CPU family indicates a robust and efficient processing architecture suitable for a wide range of applications.

No. of External Interrupts: 24

Having 24 external interrupts allows for efficient handling of external events and real-time response in various applications.

ADC Channels: YES

Having Analog to Digital Converters (ADC) channels enables the microcontroller to interface with analog sensors and signals accurately.

DMA Channels: YES

Direct Memory Access (DMA) channels enhance data transfer efficiency and offload the CPU for improved performance in data-intensive tasks.

Terminal Position: QUAD

Quad terminal position facilitates easy integration and soldering on PCBs, ensuring reliable connections and ease of assembly.

ROM Words: 3145728

Large ROM capacity of 3145728 words allows for extensive program storage and flexibility in firmware development.

Maximum Seated Height: 1.6 mm

Low profile maximum seated height of 1.6mm enables compact design and efficient space utilization in electronic devices.

Width: 24 mm

24mm width provides a compact form factor, suitable for space-constrained applications while ensuring efficient board layout.

Data EEPROM Size: 64K

64K Data EEPROM size offers ample non-volatile storage for data retention and parameter settings in embedded applications.

Technical Specifications

Microcontrollers SPC564B74L7B8E0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES AT 5 V

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

Low Power Mode:

YES

No. of DMA Channels:

32

No. of External Interrupts:

24

No. of I/O Lines:

147

No. of Terminals:

176

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

196608

ROM Words:

3145728

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

120 rpm

Maximum Supply Current:

300 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(6); I2C; SPI(8); UART(10)

Peripherals:

DMA(32), PWM, RTC, TIMER(12), WDT

Analog To Digital Convertors:

27-Ch 10-Bit, 5-Ch 12-Bit

Trade Compliance

SPC564B74L7B8E0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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