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SPC564B70L7C9E0X

STMicroelectronics

SPC564B70L7C9E0X by STMicroelectronics

STMicroelectronics SPC564B70L7C9E0X is a 32-bit microcontroller with 176 terminals, operating at up to 40 MHz. Ideal for automotive applications, it features 27-Ch 10-Bit ADCs, 32 DMA channels, and connectivity options like CAN, I2C, SCI, and SPI.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,521 parts In-Stock

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7,521

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Digiode

USA . 3,516 parts In-Stock

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3,516

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Anansix

USA . 196 parts In-Stock

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196

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,439 parts In-Stock

1+ parts

$13.600

100+ parts

-

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-

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2,439

$13.600

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AZTECH Wire

Italy . 888 parts In-Stock

1+ parts

$21.580

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-

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888

$21.580

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IDEA Electronic Components Group

UK . 553 parts In-Stock

1+ parts

$24.751

100+ parts

-

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$22.276

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553

$24.751

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$22.276

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Microchip USA

USA . 1,201 parts In-Stock

1+ parts

$33.732

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1,201

$33.732

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$34.096

100+ parts

$31.027

1k+ parts

$27.959

10k+ parts

-

5,000

$34.096

$31.027

$27.959

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MKK Technologies

India . 1,278 parts In-Stock

1+ parts

$46.542

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1,278

$46.542

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DigiPath Technology Company

USA . 1,278 parts In-Stock

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$46.542

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1,278

$46.542

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Corphita

USA . 1,883 parts In-Stock

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1,883

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Parana Technologies

USA . 656 parts In-Stock

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$29.593

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656

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$29.593

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Perfect Parts

USA . 560 parts In-Stock

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560

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Overview

Unleash the power of innovation with the SPC564B70L7C9E0X microcontroller from STMicroelectronics. Designed with cutting-edge technology and precision engineering, this automotive-grade device offers unparalleled performance and reliability. With a wide range of peripherals including DMA, RTC, and timers, this microcontroller is ideal for automotive applications. The value of this product lies in its low power mode, high-speed processing capabilities, and extensive connectivity options such as CAN and SPI. Elevate your projects to new heights with the SPC564B70L7C9E0X and experience the difference that quality and innovation can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for compact and portable devices.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with various power sources.

No. of Terminals: 176

With a high number of terminals, this microcontroller offers extensive connectivity options for interfacing with other components and peripherals.

ADC Channels: YES

The presence of Analog to Digital Convertor channels enables the microcontroller to accurately interface with analog sensors and signals.

RAM Bytes: 163840

Large RAM capacity allows for efficient data processing and storage, enabling the microcontroller to handle complex tasks and applications.

Maximum Clock Frequency: 40 MHz

A high maximum clock frequency ensures fast processing speed, making the microcontroller suitable for applications requiring quick response times.

Connectivity: CAN(6), I2C, SCI(10), SPI(8)

Multiple connectivity options such as CAN, I2C, SCI, and SPI enable versatile communication with other devices and systems, expanding the range of possible applications.

Technical Specifications

Microcontrollers SPC564B70L7C9E0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 5V NOMINAL SUPPLY, ALSO HAVING SHARED 19-CHANNELS OF ADC

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

Low Power Mode:

YES

No. of DMA Channels:

32

No. of External Interrupts:

24

No. of I/O Lines:

147

No. of Terminals:

176

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

163840

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

120 rpm

Maximum Supply Current:

300 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(6), I2C, SCI(10), SPI(8)

Peripherals:

DMA(32), RTC, TIMER(12), WDT

Analog To Digital Convertors:

27-Ch 10-Bit; 5-Ch 12-Bit

Trade Compliance

SPC564B70L7C9E0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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