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SPC564B64L7B9ECX

STMicroelectronics

SPC564B64L7B9ECX by STMicroelectronics

SPC564B64L7B9ECX by STMicroelectronics is a 32-bit microcontroller with 176 terminals, operating at max 40 MHz clock frequency. It features ADC and DMA channels, PWM support, and 147 I/O lines. Ideal for applications requiring high-speed processing and precise control in automotive systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,079 parts In-Stock

1+ parts

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2,079

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Digiode

USA . 699 parts In-Stock

1+ parts

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699

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Anansix

USA . 418 parts In-Stock

1+ parts

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418

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 559 parts In-Stock

1+ parts

$10.120

100+ parts

-

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-

559

$10.120

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Microchip USA

USA . 2,328 parts In-Stock

1+ parts

$22.167

100+ parts

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2,328

$22.167

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IDEA Electronic Components Group

UK . 1,177 parts In-Stock

1+ parts

$72.633

100+ parts

-

1k+ parts

$65.370

10k+ parts

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1,177

$72.633

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$65.370

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MKK Technologies

India . 1,381 parts In-Stock

1+ parts

$136.582

100+ parts

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1,381

$136.582

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DigiPath Technology Company

USA . 1,381 parts In-Stock

1+ parts

$136.582

100+ parts

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1,381

$136.582

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Corphita

USA . 3,245 parts In-Stock

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3,245

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Parana Technologies

USA . 2,280 parts In-Stock

1+ parts

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100+ parts

$86.844

1k+ parts

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2,280

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$86.844

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Vigor

Singapore . 2,120 parts In-Stock

1+ parts

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2,120

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Overview

Elevate your projects to new heights with the SPC564B64L7B9ECX microcontroller by STMicroelectronics. Designed with precision and reliability in mind, this microcontroller offers unparalleled performance for a wide range of applications. Whether you're working on automotive, industrial, or consumer electronics projects, this versatile device is sure to meet your needs. With its advanced features and cutting-edge technology, the SPC564B64L7B9ECX provides exceptional value, efficiency, and ease of use for customers looking to elevate their designs to the next level. Choose quality, choose STMicroelectronics.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the microcontroller onto a PCB, saving space and making it suitable for compact designs.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage tolerance of 5.5 V provides flexibility and reliability in various power supply applications.

Package Shape: SQUARE

The square package shape offers a good balance between space utilization and easy PCB layout implementation.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle complex computations and processes efficiently.

No. of Terminals: 176

The high number of terminals allows for versatile connectivity options and interfacing with other components in the system.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

This package style ensures a compact form factor, low profile height, and fine pitch for dense component placement on the PCB.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage requirement of 4.5 V enhances power efficiency and extends battery life in portable applications.

ADC Channels: YES

The integrated ADC channels enable analog input signal conversion, making the microcontroller suitable for sensor interfacing and data acquisition.

DMA Channels: YES

The presence of DMA channels allows for efficient data transfers between peripherals and memory, reducing CPU load and improving overall system performance.

Terminal Position: QUAD

The quad terminal position provides a secure and stable connection while simplifying assembly and maintenance processes.

Width: 24 mm

The compact width of 24 mm makes this microcontroller ideal for space-constrained designs without compromising on performance.

Maximum Clock Frequency: 40 MHz

The high maximum clock frequency of 40 MHz allows for fast data processing and real-time operation in demanding applications.

Length: 24 mm

The matching length of 24 mm complements the width, creating a square form factor that is optimal for efficient PCB layout and component placement.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product integrates various peripherals and features on a single chip, simplifying system design and reducing external component count.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with various digital systems, making the microcontroller energy-efficient and versatile.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability, ease of soldering, and secure PCB mounting, ensuring reliable connectivity in challenging environments.

Nominal Supply Voltage: 5 V

The 5 V nominal supply voltage simplifies power requirements and compatibility with commonly used voltage levels in electronic systems.

PWM Channels: YES

The presence of PWM channels enables precise control of analog outputs, such as motor speed, LED brightness, and audio volume, enhancing system functionality.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm allows for high-density mounting of the microcontroller on the PCB, saving space and facilitating intricate circuit designs.

Speed: 120 rpm

With a speed rating of 120 rpm, this microcontroller is capable of handling fast computational tasks and real-time processing requirements in dynamic applications.

No. of I/O Lines: 147

The 147 I/O lines provide abundant input and output options for connecting external devices, sensors, and peripherals, making the microcontroller suitable for diverse applications.

Technical Specifications

Microcontrollers SPC564B64L7B9ECX attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

24 mm

No. of I/O Lines:

147

No. of Terminals:

176

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Speed:

120 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

24 mm

Peripheral IC Type:

Trade Compliance

SPC564B64L7B9ECX Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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