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SPC564B64L7B8ECX

STMicroelectronics

SPC564B64L7B8ECX by STMicroelectronics

STMicroelectronics SPC564B64L7B8ECX microcontroller features 32-bit architecture, 176 terminals, and 40 MHz clock frequency. Ideal for industrial applications requiring CAN, Ethernet, I2C connectivity with low power mode and extensive peripheral support.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,417 parts In-Stock

1+ parts

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3,417

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Anansix

USA . 2,258 parts In-Stock

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2,258

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Digiode

USA . 1,782 parts In-Stock

1+ parts

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1,782

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 368 parts In-Stock

1+ parts

$7.000

100+ parts

-

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-

10k+ parts

-

368

$7.000

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AZTECH Wire

Italy . 780 parts In-Stock

1+ parts

$10.680

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-

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780

$10.680

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Microchip USA

USA . 1,212 parts In-Stock

1+ parts

$24.221

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1,212

$24.221

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IDEA Electronic Components Group

UK . 384 parts In-Stock

1+ parts

$51.389

100+ parts

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$46.250

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384

$51.389

-

$46.250

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MKK Technologies

India . 1,651 parts In-Stock

1+ parts

$96.634

100+ parts

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1,651

$96.634

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DigiPath Technology Company

USA . 1,651 parts In-Stock

1+ parts

$96.634

100+ parts

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1,651

$96.634

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Component Stockers USA

USA . 402 parts In-Stock

1+ parts

$99.990

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402

$99.990

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Corphita

USA . 4,353 parts In-Stock

1+ parts

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4,353

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Vigor

Singapore . 3,000 parts In-Stock

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3,000

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Parana Technologies

USA . 162 parts In-Stock

1+ parts

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100+ parts

$61.444

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162

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$61.444

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Overview

Unlock the power of innovation with the SPC564B64L7B8ECX microcontroller by STMicroelectronics. Crafted with precision and expertise, this cutting-edge device offers unparalleled performance for a wide range of applications. From automotive systems to industrial automation, this microcontroller delivers exceptional value, reliability, and efficiency. Experience seamless connectivity, precise control, and advanced features that set you apart from the competition. Embrace the future of technology with the SPC564B64L7B8ECX and unleash endless possibilities for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring long-term reliability.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of supply voltages, making it versatile for various applications.

Bit Size: 32

Offers a high bit size, enabling complex data processing and calculations.

No. of Terminals: 176

Provides a large number of terminals for connectivity and interfacing with other components.

ADC Channels: YES

Integrated Analog to Digital Converters enable the microcontroller to interface with analog sensors and signals.

Maximum Clock Frequency: 40 MHz

High clock frequency allows for fast processing and response times.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications where extreme temperature conditions may be encountered.

Connectivity: CAN(6), ETHERNET, I2C, SCI(10), SPI(8)

Offers multiple connectivity options, making it compatible with various communication protocols and networks.

RAM Bytes: 1310172

Large RAM size allows for efficient data storage and processing capabilities.

Technical Specifications

Microcontrollers SPC564B64L7B8ECX attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 5V NOMINAL SUPPLY, ALSO HAVING SHARED 19-CHANNELS OF ADC

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

Low Power Mode:

YES

No. of DMA Channels:

32

No. of External Interrupts:

24

No. of I/O Lines:

147

No. of Terminals:

176

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

1310172

ROM Words:

1572864

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Current:

300 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

65536

Connectivity:

CAN(6), ETHERNET, I2C, SCI(10), SPI(8)

Peripherals:

DMA(32), RTC, TIMER(12), WDT

Analog To Digital Convertors:

27-Ch 10-Bit, 5-Ch 12-Bit

Trade Compliance

SPC564B64L7B8ECX Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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