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SPC564A80L7COBY

STMicroelectronics

SPC564A80L7COBY by STMicroelectronics

SPC564A80L7COBY by STMicroelectronics is a 32-bit microcontroller with 176 terminals, operating at up to 80 MHz. Ideal for automotive applications, it features 34 ADC channels, DMA support, and connectivity options like CAN, FLEXRAY, LIN, SCI, and SPI. With a wide temperature range from -40 °C to 125°C and low profile package style, it offers high performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,104 parts In-Stock

1+ parts

-

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6,104

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Anansix

USA . 1,361 parts In-Stock

1+ parts

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1,361

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Digiode

USA . 819 parts In-Stock

1+ parts

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819

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 749 parts In-Stock

1+ parts

$9.670

100+ parts

-

1k+ parts

-

10k+ parts

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749

$9.670

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Vigor

Singapore . 5,724 parts In-Stock

1+ parts

$18.710

100+ parts

-

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10k+ parts

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5,724

$18.710

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Microchip USA

USA . 1,203 parts In-Stock

1+ parts

$25.215

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1,203

$25.215

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IDEA Electronic Components Group

UK . 812 parts In-Stock

1+ parts

$69.121

100+ parts

-

1k+ parts

$62.208

10k+ parts

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812

$69.121

-

$62.208

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MKK Technologies

India . 1,373 parts In-Stock

1+ parts

$129.977

100+ parts

-

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1,373

$129.977

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DigiPath Technology Company

USA . 1,373 parts In-Stock

1+ parts

$129.977

100+ parts

-

1k+ parts

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1,373

$129.977

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

1+ parts

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8,000

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Corphita

USA . 2,803 parts In-Stock

1+ parts

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2,803

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Parana Technologies

USA . 725 parts In-Stock

1+ parts

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100+ parts

$82.644

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725

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$82.644

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Overview

Designed by the reputable manufacturer STMicroelectronics, the SPC564A80L7COBY microcontroller offers unparalleled quality and reliability in a compact package. With a wide range of applications in industries such as automotive and industrial automation, this advanced microcontroller provides customers with superior performance, high-speed processing capabilities, and efficient power management. Experience the value and benefits of this innovative product, from its versatile connectivity options to its extensive peripheral features, making it the ideal choice for your next project. Trust STMicroelectronics to deliver cutting-edge technology that meets your every need.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability of the microcontroller package.

Surface Mount: YES

Surface mount feature allows for easier and more efficient assembly of electronic circuits.

Maximum Supply Voltage: 1.32 V

Higher maximum supply voltage allows for flexibility in power supply options.

Address Bus Width: 32

32-bit address bus width enables large memory addressing capability, suitable for complex applications.

Package Shape: SQUARE

Square package shape can optimize space utilization on circuit boards.

Bit Size: 32

32-bit architecture provides higher computational power and efficiency.

No. of Terminals: 176

The large number of terminals allows for versatile connectivity options.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers compact size and high performance suitable for various applications.

Minimum Supply Voltage: 1.14 V

Lower minimum supply voltage helps in power efficiency and extends battery life in portable devices.

Maximum Operating Temperature: 125 °C

Higher maximum operating temperature range ensures reliable operation even in extreme conditions.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for usage in diverse environmental conditions.

ADC Channels: YES

Presence of ADC channels enables analog signal conversion for sensor interfacing and data acquisition.

DMA Channels: YES

DMA channels support efficient data transfer and offload CPU for multitasking applications.

Terminal Position: QUAD

Quad terminal position provides stable and secure connections on the circuit board.

ROM Words: 1048576

Large ROM capacity allows for storing complex program instructions and data.

Maximum Seated Height: 1.6 mm

Low seated height helps in compact design and space-saving in electronic devices.

Width: 24 mm

Optimal width size for fitting in standard PCB layouts and designs.

External Data Bus Width: 32

32-bit external data bus width supports high-speed data transfer and processing capabilities.

Peripherals: DMA(64), POR, TIMER(34)

Abundance of peripherals like DMA, POR, and TIMER enhance the functionality and performance of the microcontroller.

Maximum Clock Frequency: 80 MHz

High clock frequency enables faster execution of instructions and tasks.

Length: 24 mm

Optimal length size for fitting in standard PCB layouts and designs.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures reliability and performance in automotive applications.

Peripheral IC Type: MICROCONTROLLER

Microcontroller type ensures integration of various functions in a single chip for compact and efficient designs.

RAM Bytes: 196608

Abundant RAM memory size allows for efficient data storage and processing.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation for energy-efficient applications.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable soldering connections on PCBs.

Analog To Digital Convertors: 34-Ch 12-Bit

High-resolution ADCs with 34 channels enable accurate analog signal conversion for precise measurement applications.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage ensures consistent performance and reliability of the microcontroller.

PWM Channels: YES

Presence of PWM channels enables precise control of analog components like motors and LEDs.

Connectivity: CAN(3), FLEXRAY, LIN, SCI(3), SPI(3)

Versatile connectivity options with multiple communication interfaces enhance compatibility and flexibility in system integration.

ROM Programmability: FLASH

Flash programmable ROM allows for convenient and quick updates of program code in the microcontroller.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm enables high-density mounting and compact PCB designs.

Speed: 120 rpm

High-speed operation at 120 revolutions per minute enables rapid data processing and control functions.

On Chip Program ROM Width: 32

On-chip program ROM width of 32 bits provides ample storage capacity for program code and data.

No. of I/O Lines: 120

Abundance of I/O lines allows for versatile connectivity and interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers SPC564A80L7COBY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

No. of I/O Lines:

120

No. of Terminals:

176

On Chip Program ROM Width:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

196608

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

120 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(3), FLEXRAY, LIN, SCI(3), SPI(3)

Peripherals:

DMA(64), POR, TIMER(34)

Analog To Digital Convertors:

34-Ch 12-Bit

Trade Compliance

SPC564A80L7COBY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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