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SPC564A80L7CFAY

STMicroelectronics

SPC564A80L7CFAY by STMicroelectronics

SPC564A80L7CFAY by STMicroelectronics is a 32-bit microcontroller with 1048576 ROM words, 196608 RAM bytes, and 34-Ch 12-Bit ADC channels. Ideal for automotive applications due to its FLASH ROM programmability, CAN(3) connectivity, and operating temperature range of -40 to 125 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,702 parts In-Stock

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6,702

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Digiode

USA . 2,430 parts In-Stock

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2,430

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Anansix

USA . 498 parts In-Stock

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498

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Distributors (Availability)

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AZTECH Wire

Italy . 254 parts In-Stock

1+ parts

$14.070

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-

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254

$14.070

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Vigor

Singapore . 2,411 parts In-Stock

1+ parts

$20.560

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2,411

$20.560

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Microchip USA

USA . 2,020 parts In-Stock

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$57.423

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2,020

$57.423

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IDEA Electronic Components Group

UK . 1,147 parts In-Stock

1+ parts

$75.147

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$67.632

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1,147

$75.147

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$67.632

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MKK Technologies

India . 1,268 parts In-Stock

1+ parts

$141.308

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1,268

$141.308

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DigiPath Technology Company

USA . 1,268 parts In-Stock

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$141.308

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1,268

$141.308

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Parana Technologies

USA . 723 parts In-Stock

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$89.849

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723

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$89.849

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Corphita

USA . 409 parts In-Stock

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Overview

Experience excellence with the SPC564A80L7CFAY microcontroller from STMicroelectronics. Known for their superior quality and innovation, STMicroelectronics delivers cutting-edge technology in a compact and versatile package. This automotive-grade microcontroller offers a wide range of peripherals, including ADC channels, PWM channels, and multiple connectivity options like CAN and LIN. With its impressive RAM capacity and high clock frequency, this microcontroller is perfect for a variety of applications in the automotive industry, providing unmatched performance and reliability. Upgrade your projects today with the SPC564A80L7CFAY and discover the power of STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 1.32 V

Provides a safe operating range for the microcontroller, preventing damage from overvoltage conditions.

Address Bus Width: 32

Allows the microcontroller to access a larger memory space and handle complex data processing tasks efficiently.

Bit Size: 32

Provides high processing power and capability for running advanced algorithms and calculations.

Power Supplies (V): 1.2, 3.3, 5

Supports a wide range of supply voltages, allowing flexibility in design and compatibility with different power sources.

No. of Terminals: 176

Offers a large number of connection points for interfacing with other components and peripherals in a system.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold environments, making it suitable for outdoor and industrial applications.

ADC Channels: YES

Integrated Analog to Digital Converters allow for accurate conversion of analog signals, enabling sensor interfacing and data acquisition.

DMA Channels: YES

Direct Memory Access channels enable efficient data transfers between peripherals and memory, improving system performance.

ROM Words: 1048576

Large on-chip memory capacity for storing program code and data, enabling complex applications and multitasking.

Temperature Grade: AUTOMOTIVE

Designed to meet the stringent requirements of automotive applications, ensuring reliability and durability in harsh operating conditions.

RAM Bytes: 196608

Generous amount of Random Access Memory for storing data and variables during program execution, supporting multitasking and data processing.

Analog To Digital Convertors: 34-Ch 12-Bit

Multiple ADC channels with high resolution for accurate and precise conversion of analog signals, suitable for sensor interface applications.

Connectivity: CAN(3), FLEXRAY, LIN, SCI(3), SPI(3)

Offers a variety of communication interfaces for connecting with external devices and networks, enabling seamless integration in diverse systems.

PWM Channels: YES

Pulse Width Modulation channels for generating analog-like signals for motor control, lighting, and other applications requiring precise control.

Technical Specifications

Microcontrollers SPC564A80L7CFAY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G176

JESD-609 Code:

e3

Length:

24 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

120

No. of Terminals:

176

On Chip Program ROM Width:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3,5

Qualification:

Not Qualified

RAM Bytes:

196608

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

150 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

445 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(3), FLEXRAY, LIN, SCI(3), SPI(3)

Peripherals:

DMA(64), POR, TIMER(10)

Analog To Digital Convertors:

34-Ch 12-Bit

Trade Compliance

SPC564A80L7CFAY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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