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SPC564A80B4COBY

STMicroelectronics

SPC564A80B4COBY by STMicroelectronics

SPC564A80B4COBY by STMicroelectronics is a 32-bit microcontroller with 1048576 ROM words and 196608 RAM bytes. It features 40-Ch 12-Bit ADC channels, DMA(64), and TIMER(34) peripherals. Ideal for automotive applications, it offers CAN(3), FLEXRAY, LIN connectivity at a max clock frequency of 80 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,441 parts In-Stock

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8,441

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Digiode

USA . 1,318 parts In-Stock

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1,318

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Anansix

USA . 1,071 parts In-Stock

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1,071

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 822 parts In-Stock

1+ parts

$14.160

100+ parts

-

1k+ parts

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822

$14.160

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IDEA Electronic Components Group

UK . 118 parts In-Stock

1+ parts

$23.515

100+ parts

-

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$21.164

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118

$23.515

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$21.164

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Microchip USA

USA . 1,892 parts In-Stock

1+ parts

$26.776

100+ parts

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1,892

$26.776

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MKK Technologies

India . 1,828 parts In-Stock

1+ parts

$44.219

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1,828

$44.219

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DigiPath Technology Company

USA . 1,828 parts In-Stock

1+ parts

$44.219

100+ parts

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1,828

$44.219

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Corphita

USA . 3,369 parts In-Stock

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3,369

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Vigor

Singapore . 3,096 parts In-Stock

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3,096

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Parana Technologies

USA . 528 parts In-Stock

1+ parts

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$28.116

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528

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$28.116

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Overview

Unleash the power of innovation with the SPC564A80B4COBY microcontroller by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-quality products designed to meet and exceed customer expectations. Ideal for automotive applications, this microcontroller boasts advanced features such as ADC channels, DMA support, and PWM channels. With its high-speed performance, versatile connectivity options, and vast array of peripherals, the SPC564A80B4COBY offers unmatched value and benefits to customers seeking cutting-edge solutions for their projects. Choose STMicroelectronics for reliability, efficiency, and unparalleled performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material offers good durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and labor costs during manufacturing.

Maximum Supply Voltage: 1.32 V

Provides a safe operating range and flexibility for power supply options.

Address Bus Width: 32

Wide address bus width allows for efficient memory address access and data transfer.

Package Shape: SQUARE

Square shape helps in efficient space utilization on the circuit board.

Bit Size: 32

32-bit architecture allows for faster processing and handling of data.

No. of Terminals: 324

Provides ample connectivity options for interfacing with external components and peripherals.

Package Style (Meter): GRID ARRAY

Grid array package style offers good thermal performance and reliability.

Minimum Supply Voltage: 1.14 V

Allows for operation at lower voltage levels, which can be beneficial for power-saving applications.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures, making it suitable for automotive and industrial environments.

Minimum Operating Temperature: -40 °C

Capable of operating in low-temperature conditions, expanding its usability in various environments.

ADC Channels: YES

Integrated ADC channels enable analog signal conversion for sensor interfacing and data acquisition.

DMA Channels: YES

DMA channels allow for efficient data transfer between peripherals and memory without CPU intervention.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure placement on the PCB.

ROM Words: 1048576

Large ROM capacity for storing program instructions and data, offering versatility in application development.

Width: 23 mm

Compact width size allows for space-efficient PCB design.

External Data Bus Width: 32

Wide external data bus width enables high-speed data transfer between the microcontroller and external devices.

Peripherals: DMA(64), POR, TIMER(34)

Rich set of peripherals including DMA, POR, and timers enhance the functionality and performance of the microcontroller.

Maximum Clock Frequency: 80 MHz

High clock frequency enables quick execution of instructions, improving overall processing speed.

Length: 23 mm

Compact length size for space-efficient PCB layout and design.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature tolerance ensures reliability and durability in harsh operating conditions.

Peripheral IC Type: MICROCONTROLLER

Dedicated microcontroller functionality offers advanced processing capabilities for various applications.

RAM Bytes: 196608

Ample RAM capacity for data storage and manipulation, enabling efficient program execution and multitasking.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Terminal Form: BALL

Ball terminal form enables reliable electrical connections and solder joints for secure mounting on the PCB.

Analog To Digital Convertors: 40-Ch 12-Bit

Integrated high-resolution ADCs provide accurate analog signal conversion for precise sensor interfacing and measurement.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage ensures consistent and reliable operation of the microcontroller.

PWM Channels: YES

PWM channels enable precise control of analog outputs for applications such as motor control and LED dimming.

Connectivity: CAN(3), FLEXRAY, LIN, SCI(3), SPI(3)

Multiple connectivity options including CAN, FLEXRAY, LIN, SCI, and SPI facilitate communication with a wide range of devices and peripherals.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick updates of firmware and software, enhancing flexibility in application development.

Terminal Pitch: 1 mm

Narrow terminal pitch enables high-density mounting on the PCB, saving space and improving overall design efficiency.

Speed: 120 rpm

High speed capability supports fast data processing and execution of tasks, making the microcontroller suitable for real-time applications.

On Chip Program ROM Width: 32

On-chip program ROM width of 32 bits allows for efficient storage and retrieval of program instructions.

No. of I/O Lines: 120

Abundant I/O lines offer versatile connectivity options for interfacing with external devices, sensors, and peripherals.

Technical Specifications

Microcontrollers SPC564A80B4COBY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B324

Length:

23 mm

No. of I/O Lines:

120

No. of Terminals:

324

On Chip Program ROM Width:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

196608

ROM Words:

1048576

ROM Programmability:

FLASH

Speed:

120 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(3), FLEXRAY, LIN, SCI(3), SPI(3)

Peripherals:

DMA(64), POR, TIMER(34)

Analog To Digital Convertors:

40-Ch 12-Bit

Trade Compliance

SPC564A80B4COBY Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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