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SPC564A80B4CFBY

STMicroelectronics

SPC564A80B4CFBY by STMicroelectronics

SPC564A80B4CFBY by STMicroelectronics is a 32-bit microcontroller with 1048576 ROM words and 196608 RAM bytes. It features 40 ADC channels, 64 DMA peripherals, and operates at a max frequency of 40 MHz. Ideal for automotive applications requiring CAN, FLEXRAY, LIN connectivity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,840 parts In-Stock

1+ parts

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4,840

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Anansix

USA . 1,590 parts In-Stock

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1,590

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Digiode

USA . 89 parts In-Stock

1+ parts

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89

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 301 parts In-Stock

1+ parts

$17.860

100+ parts

-

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301

$17.860

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IDEA Electronic Components Group

UK . 162 parts In-Stock

1+ parts

$25.628

100+ parts

-

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$23.065

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162

$25.628

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$23.065

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Microchip USA

USA . 2,342 parts In-Stock

1+ parts

$26.357

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2,342

$26.357

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MKK Technologies

India . 1,682 parts In-Stock

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$48.191

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1,682

$48.191

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DigiPath Technology Company

USA . 1,682 parts In-Stock

1+ parts

$48.191

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1,682

$48.191

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Component Stockers USA

USA . 536 parts In-Stock

1+ parts

$99.990

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536

$99.990

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Vigor

Singapore . 4,093 parts In-Stock

1+ parts

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4,093

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Corphita

USA . 1,783 parts In-Stock

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1,783

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Parana Technologies

USA . 867 parts In-Stock

1+ parts

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$30.642

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867

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$30.642

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Overview

Elevate your automotive electronic designs with the SPC564A80B4CFBY by STMicroelectronics, a high-quality microcontroller that offers unparalleled performance and reliability. Manufactured by industry leader STMicroelectronics, this product boasts advanced features such as 40MHz maximum clock frequency, 40-channel ADC, and 10 timers. Ideal for automotive applications, this microcontroller provides 120 I/O lines and connectivity options including CAN, LIN, and SPI. With its robust design and cutting-edge technology, the SPC564A80B4CFBY delivers exceptional value and benefits to customers seeking top-tier performance in their electronic systems.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material that is cost-effective for mass production.

Maximum Supply Voltage: 1.32 V

Allows for flexibility in power supply options and efficient operation.

Address Bus Width: 32

Allows for efficient memory addressing and data transfer capabilities.

Peripheral IC Type: MICROCONTROLLER

Specifically designed for embedded systems, providing integrated peripherals for various applications.

Maximum Clock Frequency: 40 MHz

High clock frequency for fast processing and real-time operation.

RAM Bytes: 196608

Sufficient memory for storing and processing data in complex applications.

Analog To Digital Convertors: 40-Ch 12-Bit

Provides high-resolution analog to digital conversion for accurate sensor data acquisition.

Connectivity: CAN(3), FLEXRAY, LIN, SCI(3), SPI(3)

Diverse connectivity options for interfacing with different communication protocols and devices.

Technical Specifications

Microcontrollers SPC564A80B4CFBY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e0

Length:

23 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

120

No. of Terminals:

324

On Chip Program ROM Width:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA324,22X22,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.2,3.3,5

Qualification:

Not Qualified

RAM Bytes:

196608

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.77 mm

Speed:

120 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

445 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(3), FLEXRAY, LIN, SCI(3), SPI(3)

Peripherals:

DMA(64), POR, TIMER(10)

Analog To Digital Convertors:

40-Ch 12-Bit

Trade Compliance

SPC564A80B4CFBY Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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