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SPC560P60L5CEFAR

STMicroelectronics

SPC560P60L5CEFAR by STMicroelectronics

SPC560P60L5CEFAR microcontroller by STMicroelectronics features a 32-bit address and external data bus width, with a max clock frequency of 40 MHz. It is suitable for applications requiring ADC and DMA channels, offering 106 I/O lines in a compact FLATPACK package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,427 parts In-Stock

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2,427

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Digiode

USA . 798 parts In-Stock

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798

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Anansix

USA . 499 parts In-Stock

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499

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Distributors (Availability)

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Vigor

Singapore . 7,844 parts In-Stock

1+ parts

$7.310

100+ parts

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7,844

$7.310

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AZTECH Wire

Italy . 374 parts In-Stock

1+ parts

$17.720

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374

$17.720

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Microchip USA

USA . 1,656 parts In-Stock

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$23.384

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1,656

$23.384

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Advanced Electronics

New Zealand . 800 parts In-Stock

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$43.971

100+ parts

$43.531

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$41.773

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800

$43.971

$43.531

$41.773

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IDEA Electronic Components Group

UK . 2,097 parts In-Stock

1+ parts

$47.707

100+ parts

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$42.936

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2,097

$47.707

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$42.936

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MKK Technologies

India . 767 parts In-Stock

1+ parts

$89.709

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767

$89.709

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DigiPath Technology Company

USA . 767 parts In-Stock

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$89.709

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767

$89.709

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Parana Technologies

USA . 825 parts In-Stock

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$57.040

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825

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$57.040

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Corphita

USA . 376 parts In-Stock

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376

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Overview

Elevate your projects with the SPC560P60L5CEFAR microcontroller by STMicroelectronics, a leading manufacturer known for quality and innovation. Ideal for a wide range of applications, this powerful device offers unparalleled value, benefits, and advantages to customers. With advanced features like ADC and DMA channels, PWM capabilities, and a high clock frequency, this microcontroller is a game-changer in the industry. Trust STMicroelectronics to deliver cutting-edge technology that will take your projects to the next level.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for compact and efficient PCB design, making the product ideal for space-constrained applications.

Maximum Supply Voltage: 5.5 V

Ability to handle higher supply voltages provides flexibility and robustness in different operating conditions.

Address Bus Width: 32

Wide address bus width allows for large memory addressing capabilities, suitable for complex algorithms and data processing.

Package Shape: SQUARE

Square package shape simplifies PCB layout and component placement.

Bit Size: 32

32-bit architecture offers higher processing power and data handling capability compared to lower bit size microcontrollers.

No. of Terminals: 144

Higher number of terminals provide ample connectivity options for interfacing with external devices and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The package style offers a compact form factor, making it suitable for portable and miniaturized designs.

Minimum Supply Voltage: 4.5 V

Ability to operate at lower supply voltages increases energy efficiency and extends battery life in battery-powered applications.

ADC Channels: YES

Integrated analog-to-digital converters simplify analog sensor interfacing and data acquisition tasks.

DMA Channels: YES

Direct Memory Access channels reduce CPU load and enhance data transfer speed, improving overall system performance.

Terminal Position: QUAD

Quad terminal position offers efficient PCB routing and reduces signal interference between terminals.

Width: 20 mm

Compact width dimension saves PCB space and enables integration in size-constrained designs.

External Data Bus Width: 32

Wide external data bus width enables high-speed data transfer between the microcontroller and external memory or peripherals.

Maximum Clock Frequency: 40 MHz

High maximum clock frequency allows for fast data processing and execution of instructions, enhancing system performance.

Length: 20 mm

Compact length dimension complements the square package shape for space-efficient overall design.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient instruction execution, leading to high performance and low power consumption.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and compatibility with a wide range of operating voltages.

Terminal Form: GULL WING

Gull wing terminal form simplifies SMT assembly process and improves overall mechanical reliability.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage ensures reliable operation and compatibility with standard power sources.

PWM Channels: YES

Pulse Width Modulation channels enable precise control of motor speed, LED brightness, and other analog output devices.

Terminal Pitch: 0.5 mm

Fine terminal pitch enhances PCB routing density, allowing for more compact layouts and smaller product size.

Speed: 64 rpm

High processing speed of 64 rotations per minute ensures quick response times and efficient task execution.

No. of I/O Lines: 106

Abundance of input/output lines facilitates versatile interfacing with external components, sensors, and peripherals for diverse applications.

Technical Specifications

Microcontrollers SPC560P60L5CEFAR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

32

Length:

20 mm

No. of I/O Lines:

106

No. of Terminals:

144

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

64 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Trade Compliance

SPC560P60L5CEFAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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