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SPC560P60L5CEAAY

STMicroelectronics

SPC560P60L5CEAAY by STMicroelectronics

SPC560P60L5CEAAY by STMicroelectronics is a 32-bit microcontroller with 144 terminals, operating at a max clock frequency of 40 MHz. It features ADC and DMA channels, suitable for applications requiring high-speed data processing and control systems. With a supply voltage range of 4.5V to 5.5V, it is commonly used in automotive electronics and industrial automation due to its robust performance capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,591 parts In-Stock

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4,591

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Anansix

USA . 956 parts In-Stock

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956

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Digiode

USA . 51 parts In-Stock

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51

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Distributors (Availability)

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Vigor

Singapore . 4,000 parts In-Stock

1+ parts

$7.710

100+ parts

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4,000

$7.710

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AZTECH Wire

Italy . 1,121 parts In-Stock

1+ parts

$12.860

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1,121

$12.860

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Microchip USA

USA . 1,873 parts In-Stock

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$24.051

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1,873

$24.051

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IDEA Electronic Components Group

UK . 2,130 parts In-Stock

1+ parts

$58.176

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$52.359

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2,130

$58.176

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$52.359

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Component Stockers USA

USA . 244 parts In-Stock

1+ parts

$107.340

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244

$107.340

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MKK Technologies

India . 979 parts In-Stock

1+ parts

$109.397

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979

$109.397

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DigiPath Technology Company

USA . 979 parts In-Stock

1+ parts

$109.397

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979

$109.397

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Corphita

USA . 4,324 parts In-Stock

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4,324

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Parana Technologies

USA . 2,236 parts In-Stock

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$69.558

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2,236

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$69.558

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Overview

The SPC560P60L5CEAAY by STMicroelectronics is a top-of-the-line microcontroller that sets the bar high for performance and reliability. With its cutting-edge technology and innovative design, this product is perfect for a wide range of applications. Whether you're looking to enhance your automation systems or improve your IoT devices, this microcontroller has got you covered. Trust in STMicroelectronics' reputation for quality and excellence, and unlock the full potential of your projects with the SPC560P60L5CEAAY. Elevate your creations and experience seamless operation like never before with this superior microcontroller.

Feature Benefit Bullets

Surface Mount: YES

Surface mount option allows for easy and convenient PCB assembly, saving time and effort during manufacturing.

Maximum Supply Voltage: 5.5 V

Allows for flexibility in power supply options and ensures compatibility with a wide range of applications.

Address Bus Width: 32

A wider address bus allows for more memory addressing capability, enabling the microcontroller to handle larger programs and data sets.

Package Shape: SQUARE

Square package shape can help optimize space on the PCB and facilitate efficient layout design.

Bit Size: 32

A 32-bit architecture offers enhanced performance and processing capability compared to lower bit sizes, making it suitable for more complex tasks.

No. of Terminals: 144

Having a high number of terminals provides a wide range of I/O options and connectivity possibilities, making the microcontroller versatile and adaptable to various scenarios.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers space-saving benefits, low profile for compact designs, and fine pitch for high-density integration, making it ideal for applications with size constraints.

Minimum Supply Voltage: 4.5 V

A low minimum supply voltage allows for operation in a wider range of power conditions and can be beneficial for energy-efficient applications.

ADC Channels: YES

Integrated ADC channels enable analog input functionality, allowing the microcontroller to interface with sensors and other analog devices.

DMA Channels: YES

DMA (Direct Memory Access) channels help in efficient data transfer between peripherals and memory without CPU intervention, improving system performance and responsiveness.

Terminal Position: QUAD

Quad terminal positioning can simplify PCB routing and layout, enhancing signal integrity and reducing interference.

Width: 20 mm

Compact width dimension enables space-efficient PCB design and integration into small form factor devices.

External Data Bus Width: 32

A wide external data bus width facilitates faster data transfer and processing capabilities, enhancing overall system performance.

Maximum Clock Frequency: 40 MHz

High clock frequency allows for quick execution of instructions and tasks, improving overall system speed and responsiveness.

Length: 20 mm

Compact length dimension complements the width and overall size considerations for efficient PCB design and space utilization.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC (Reduced Instruction Set Computing) architecture offers efficient instruction execution, making the microcontroller suitable for high-performance applications.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and compatibility with a wide range of voltages, enhancing the overall efficiency and reliability of the microcontroller.

Terminal Form: GULL WING

Gull wing terminal form allows for easy handling and soldering during PCB assembly, ensuring reliable and secure connections.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage ensures consistent performance and reliability of the microcontroller under normal operating conditions.

PWM Channels: YES

PWM (Pulse Width Modulation) channels enable precise control of digital signals, making the microcontroller suitable for tasks such as motor control, power management, and LED dimming.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density integration, enabling the microcontroller to pack more functionality and features in a limited space.

Speed: 64 rpm

High speed capability enables fast data processing and execution of tasks, contributing to enhanced system performance and efficiency.

No. of I/O Lines: 106

Abundance of I/O lines provides flexibility in interfacing with external devices, sensors, and peripherals, making the microcontroller versatile and suitable for diverse applications.

Technical Specifications

Microcontrollers SPC560P60L5CEAAY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

32

Length:

20 mm

No. of I/O Lines:

106

No. of Terminals:

144

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

64 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Trade Compliance

SPC560P60L5CEAAY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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