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SPC560P60L3BEABR

STMicroelectronics

SPC560P60L3BEABR by STMicroelectronics

STMicroelectronics SPC560P60L3BEABR microcontroller features 32-bit address and external data bus width, with 40 MHz clock frequency. Ideal for applications requiring ADC and DMA channels, it operates at a speed of 64 rpm with a supply voltage range of 1.8V to 3.6V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,827 parts In-Stock

1+ parts

-

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7,827

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Digiode

USA . 3,559 parts In-Stock

1+ parts

-

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-

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3,559

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Cyclops Electronics Ltd

UK . 2,000 parts In-Stock

1+ parts

-

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2,000

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Anansix

USA . 257 parts In-Stock

1+ parts

-

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257

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Distributors (Availability)

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Vigor

Singapore . 5,000 parts In-Stock

1+ parts

$5.690

100+ parts

-

1k+ parts

-

10k+ parts

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5,000

$5.690

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-

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IDEA Electronic Components Group

UK . 1,952 parts In-Stock

1+ parts

$14.316

100+ parts

-

1k+ parts

$12.885

10k+ parts

-

1,952

$14.316

-

$12.885

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AZTECH Wire

Italy . 1,127 parts In-Stock

1+ parts

$17.310

100+ parts

-

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1,127

$17.310

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Microchip USA

USA . 2,978 parts In-Stock

1+ parts

$26.040

100+ parts

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2,978

$26.040

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MKK Technologies

India . 1,940 parts In-Stock

1+ parts

$26.921

100+ parts

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1,940

$26.921

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DigiPath Technology Company

USA . 1,940 parts In-Stock

1+ parts

$26.921

100+ parts

-

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1,940

$26.921

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Corphita

USA . 4,127 parts In-Stock

1+ parts

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4,127

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RC Electronics

USA . 3,854 parts In-Stock

1+ parts

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100+ parts

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3,854

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Futuretech Components

Singapore . 1,000 parts In-Stock

1+ parts

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1,000

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Parana Technologies

USA . 250 parts In-Stock

1+ parts

-

100+ parts

$17.117

1k+ parts

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250

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$17.117

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Overview

Experience the next level of performance and reliability with the SPC560P60L3BEABR microcontroller by STMicroelectronics. As a trusted industry leader, STMicroelectronics delivers cutting-edge technology to power a wide range of applications. This high-quality microcontroller offers unparalleled value with its advanced features, including ADC and DMA channels, PWM capabilities, and a maximum clock frequency of 40 MHz. Elevate your projects with the SPC560P60L3BEABR and unlock limitless possibilities for innovation.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and compact mounting on a PCB, making it suitable for small, space-constrained applications.

Maximum Supply Voltage: 3.6 V

Supports a wide range of potential power sources, providing flexibility in design and compatibility with various power systems.

Address Bus Width: 32

A 32-bit address bus allows for access to a large memory space, enabling the microcontroller to handle complex tasks efficiently.

Package Shape: SQUARE

Square packages are generally more space-efficient and easier to layout on a PCB, optimizing use of board real estate.

Bit Size: 32

A 32-bit architecture allows for handling of larger data sets and more complex calculations, enhancing overall performance.

No. of Terminals: 100

Having a high number of terminals provides flexibility in interfacing with external components and peripherals, expanding the microcontroller's capabilities.

Width: 14 mm

A compact width enables the microcontroller to be used in small form factor designs or applications with space constraints.

Maximum Clock Frequency: 40 MHz

With a high clock frequency, the microcontroller can execute instructions quickly, leading to fast response times and overall system performance.

Peripheral IC Type: MICROCONTROLLER, RISC

A RISC-based architecture offers efficient processing of instructions, optimized for performance and power efficiency in embedded applications.

Nominal Supply Voltage: 3 V

A stable 3V supply voltage ensures reliable operation of the microcontroller and connected peripherals, reducing the risk of voltage-related issues.

No. of I/O Lines: 65

A high number of I/O lines offer extensive connectivity options for interfacing with sensors, actuators, and other external devices, enhancing versatility.

Technical Specifications

Microcontrollers SPC560P60L3BEABR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

32

Length:

14 mm

No. of I/O Lines:

65

No. of Terminals:

100

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

64 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SPC560P60L3BEABR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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