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SPC560P54L5BEABY

STMicroelectronics

SPC560P54L5BEABY by STMicroelectronics

SPC560P54L5BEABY microcontroller by STMicroelectronics features a 32-bit address and external data bus width, with a clock frequency of up to 40 MHz. With 106 I/O lines, it is ideal for applications requiring high-speed processing and control, such as automotive engine management systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,885 parts In-Stock

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3,885

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Vyrian

USA . 2,241 parts In-Stock

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2,241

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Anansix

USA . 1,443 parts In-Stock

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1,443

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 406 parts In-Stock

1+ parts

$18.210

100+ parts

-

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-

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406

$18.210

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Microchip USA

USA . 2,619 parts In-Stock

1+ parts

$25.019

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2,619

$25.019

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IDEA Electronic Components Group

UK . 1,007 parts In-Stock

1+ parts

$30.305

100+ parts

-

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$27.274

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1,007

$30.305

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$27.274

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$48.627

100+ parts

$44.251

1k+ parts

$39.874

10k+ parts

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500

$48.627

$44.251

$39.874

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MKK Technologies

India . 424 parts In-Stock

1+ parts

$56.986

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424

$56.986

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DigiPath Technology Company

USA . 424 parts In-Stock

1+ parts

$56.986

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424

$56.986

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Corphita

USA . 3,250 parts In-Stock

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3,250

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Vigor

Singapore . 2,668 parts In-Stock

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2,668

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Parana Technologies

USA . 280 parts In-Stock

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$36.234

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280

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$36.234

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Overview

Experience the power of innovation with the SPC560P54L5BEABY microcontroller by STMicroelectronics. Designed with cutting-edge technology and precision craftsmanship, this device offers unmatched performance and reliability for a wide range of applications. Whether you're developing automotive systems, industrial controls, or consumer electronics, this microcontroller delivers exceptional value, flexibility, and efficiency. Trust STMicroelectronics to provide you with the tools you need to bring your ideas to life. Elevate your projects with the SPC560P54L5BEABY and unlock endless possibilities.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology makes the product easier to assemble onto a printed circuit board, saving time and reducing the overall size of the final product.

Maximum Supply Voltage: 3.6 V

Having a relatively high maximum supply voltage allows for flexibility in power supply options and compatibility with a wider range of applications.

Address Bus Width: 32

A wide address bus width allows for efficient memory access and handling of large data sets, making the microcontroller suitable for complex tasks.

Package Shape: SQUARE

The square package shape can provide better thermal and electrical performance compared to other shapes, ensuring reliability and stability in operation.

Bit Size: 32

A 32-bit microcontroller offers enhanced processing power and memory capabilities, making it suitable for demanding applications that require fast and efficient data processing.

No. of Terminals: 144

Having a high number of terminals allows for versatile connectivity options and integration with various external components, enhancing the functionality of the microcontroller.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

This package style ensures a compact design, efficient heat dissipation, and precise alignment during assembly, contributing to better performance and reliability of the product.

Minimum Supply Voltage: 1.8 V

With a low minimum supply voltage, the microcontroller can operate efficiently even in low-power applications, conserving energy and extending battery life.

ADC Channels: YES

The presence of Analog-to-Digital Converter (ADC) channels allows the microcontroller to interface with analog sensors and signals, broadening its applicability in diverse sensing and control tasks.

DMA Channels: YES

Direct Memory Access (DMA) channels enable high-speed data transfers without CPU intervention, improving efficiency and performance in data-intensive operations.

Terminal Position: QUAD

Quad terminal position offers a balanced layout for efficient signal routing and reduced electromagnetic interference, ensuring optimal performance in noise-sensitive applications.

Width: 20 mm

A compact width dimension saves space on the PCB layout, allowing for denser integration of components and enabling smaller form factor designs.

External Data Bus Width: 32

A wide external data bus width enhances data transfer speed and efficiency, facilitating seamless communication with external memory devices and peripherals.

Maximum Clock Frequency: 40 MHz

A high maximum clock frequency enables fast execution of instructions and real-time processing, making the microcontroller suitable for applications requiring rapid data handling and response times.

Length: 20 mm

A compact length dimension complements the width dimension in saving space and facilitating compact, space-efficient PCB designs.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller's Reduced Instruction Set Computing (RISC) architecture offers streamlined instruction execution and improved performance efficiency, enhancing the overall processing capabilities of the product.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology provides low power consumption, high noise immunity, and reliable operation, making the microcontroller energy-efficient and robust in various operating conditions.

Terminal Form: GULL WING

Gull wing terminal form offers secure soldering connections and mechanical stability, ensuring reliable electrical contact and durability in demanding environmental conditions.

Nominal Supply Voltage: 3 V

A stable nominal supply voltage simplifies power management and ensures consistent performance, enhancing the reliability and longevity of the microcontroller in operation.

PWM Channels: YES

Pulse Width Modulation (PWM) channels enable precise control of motor speed and analog output voltage, expanding the microcontroller's capabilities for motor control and analog signal processing applications.

Terminal Pitch: 0.5 mm

With a fine terminal pitch, the microcontroller allows for high-density packaging and efficient signal routing, enabling compact PCB layouts and miniaturized product designs.

Speed: 64 rpm

The specified speed may correspond to a specific feature of the microcontroller related to its internal processing speed or data handling capabilities, providing a performance reference for certain applications.

No. of I/O Lines: 106

With a high number of Input/Output (I/O) lines, the microcontroller offers versatile connectivity options for interfacing with external devices, sensors, and peripherals, enhancing the flexibility and functionality of the product.

Technical Specifications

Microcontrollers SPC560P54L5BEABY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

32

Length:

20 mm

No. of I/O Lines:

106

No. of Terminals:

144

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Speed:

64 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

SPC560P54L5BEABY Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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