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SPC560P50L5CEFBY

STMicroelectronics

SPC560P50L5CEFBY by STMicroelectronics

SPC560P50L5CEFBY from STMicroelectronics is a 32-bit automotive microcontroller with a max temp of 125 °C and 144 terminals. It features 16 DMA channels, 13 ADCs, and supports CAN/LIN connectivity. Ideal for automotive applications requiring robust performance and reliability.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 12,301 parts In-Stock

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Digiode

USA . 4,012 parts In-Stock

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4,012

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ComSIT Distribution GmbH

Germany . 510 parts In-Stock

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510

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Anansix

USA . 91 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 283 parts In-Stock

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$9.300

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283

$9.300

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IDEA Electronic Components Group

UK . 216 parts In-Stock

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$29.404

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$26.464

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216

$29.404

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$26.464

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MKK Technologies

India . 835 parts In-Stock

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$55.293

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835

$55.293

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DigiPath Technology Company

USA . 835 parts In-Stock

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$55.293

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835

$55.293

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QUARKTWIN TECHNOLOGY LTD

USA . 19,245 parts In-Stock

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Microchip USA

USA . 10,894 parts In-Stock

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Vigor

Singapore . 5,845 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 4,517 parts In-Stock

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Parana Technologies

USA . 1,322 parts In-Stock

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$35.157

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Perfect Parts

USA . 538 parts In-Stock

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Overview

Unlock the potential of your automotive innovations with the SPC560P50L5CEFBY microcontroller from STMicroelectronics. Renowned for excellence, STMicroelectronics delivers superior quality and reliability in every product. This advanced microcontroller features robust functionality tailored for automotive applications, ensuring seamless performance under extreme conditions. Elevate your projects with this high-performance solution, designed to enhance efficiency, reduce development time, and drive your success forward.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy packaging provides a durable and lightweight solution, enhancing reliability and performance in various environments.

Surface Mount: YES

Surface mount technology allows for compact designs, making the microcontroller suitable for space-constrained applications.

Address Bus Width: 32

A 32-bit address bus width offers greater memory access, enhancing overall processing capability for complex applications.

Package Shape: SQUARE

The square package shape allows for efficient space utilization on PCBs, facilitating easier design and layout.

Bit Size: 32

A 32-bit architecture enhances performance and allows for handling larger data types more efficiently, ideal for advanced processing applications.

No. of Terminals: 144

With 144 terminals, this microcontroller supports numerous peripheral connections, providing extensive I/O and functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low profile and fine pitch design reduces PCB space usage while enabling high-density connections.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature rating ensures the microcontroller can function reliably in demanding environments.

CPU Family: SPC56

Part of the SPC56 family, this microcontroller is optimized for automotive applications, providing enhanced performance.

No. of External Interrupts: 32

A high number of external interrupts allows the microcontroller to respond quickly to multiple events, improving responsiveness.

Minimum Operating Temperature: -40 °C

The ability to operate in extreme cold conditions makes it suitable for automotive and industrial applications.

ADC Channels: YES

Integrated ADC channels facilitate real-time data acquisition, essential for applications requiring analog signal processing.

DMA Channels: YES

Direct Memory Access capability enhances data transfer efficiency, freeing up CPU resources for other tasks.

Terminal Position: QUAD

Quad terminal positioning simplifies circuit board mounting and improves connectivity stability.

ROM Words: 524288

A substantial ROM capacity allows for extensive firmware storage, supporting complex applications and functionalities.

Width: 20 mm

A width of 20 mm makes it compatible with various PCB designs, providing flexibility in product size.

Data EEPROM Size: 64K

A generous EEPROM size enables storage for configuration settings and other important non-volatile data.

Boundary Scan: YES

Boundary scan capability allows for easier debugging and testing of the microcontroller in production.

External Data Bus Width: 32

A 32-bit external data bus width enables high-speed data transfers between the microcontroller and other components.

Peripherals: DMA(16), PWM(8), TEMPERATURE SENSOR, TIMER(14), WDT

An extensive range of integrated peripherals enhances versatility and performance in various applications.

Maximum Clock Frequency: 40 MHz

A maximum clock frequency of 40 MHz ensures efficient data processing speeds for demanding applications.

Length: 20 mm

A compact length of 20 mm aids in designing smaller, more efficient electronic devices.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, ensuring durability and reliability under rigorous operating conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture optimizes processing efficiency, making it suitable for high-performance applications.

RAM Bytes: 40960

A respectable RAM size supports complex calculations and efficient multitasking capabilities in applications.

Technology: CMOS

CMOS technology provides low power consumption, enhancing energy efficiency for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals offer better mechanical stability and solder joint integrity, improving reliability.

Analog To Digital Converters: 13-Ch 10-Bit (2)

Multiple ADC channels enable precise analog input processing, crucial for sensor applications.

Nominal Supply Voltage: 5 V

A standard supply voltage of 5V simplifies power integration into existing electronic systems.

No. of DMA Channels: 16

With 16 DMA channels, the microcontroller can efficiently manage multiple data streams, optimizing performance.

PWM Channels: YES

Integrated PWM channels enable advanced control over motors and other actuators, enhancing application functionality.

Connectivity: CAN, LIN(2), SPI(4)

Diverse connectivity options make this microcontroller versatile for interfacing with various protocols in automotive projects.

ROM Programmability: FLASH

The use of flash technology for ROM programmability allows for easy updates and modifications of firmware.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch is ideal for high-density layouts, accommodating the growing demands for smaller devices.

Format: FIXED POINT

Fixed point format supports efficient mathematical computations, optimizing performance in real-time processing.

Speed: 60 rpm

A speed rating of 60 rpm allows for adequate control in applications requiring precise timing and operations.

On Chip Program ROM Width: 8

An 8-bit ROM width supports lightweight operations, making it suitable for applications with lower data requirements.

No. of I/O Lines: 108

With 108 I/O lines, this microcontroller supports extensive interfacing possibilities, catering to a diverse range of application needs.

Technical Specifications

Microcontrollers SPC560P50L5CEFBY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

CPU Family:

SPC56

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

Low Power Mode:

NO

No. of DMA Channels:

16

No. of External Interrupts:

32

No. of I/O Lines:

108

No. of Serial I/Os:

0

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144(UNSPEC)

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

RAM Bytes:

40960

ROM Words:

524288

ROM Programmability:

FLASH

Speed:

60 rpm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN, LIN(2), SPI(4)

Peripherals:

DMA(16), PWM(8), TEMPERATURE SENSOR, TIMER(14), WDT

Analog To Digital Convertors:

13-Ch 10-Bit (2)

Trade Compliance

SPC560P50L5CEFBY Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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