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SPC560P50L5BEFAY

STMicroelectronics

SPC560P50L5BEFAY by STMicroelectronics

STMicroelectronics SPC560P50L5BEFAY is a 32-bit microcontroller with 3.465V max supply voltage, 144 terminals, and 16MHz clock frequency. Ideal for applications requiring ADC and DMA channels, it features a CMOS technology, GULL WING terminal form, and supports PWM channels.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,554 parts In-Stock

1+ parts

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4,554

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Digiode

USA . 2,795 parts In-Stock

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2,795

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Anansix

USA . 1,364 parts In-Stock

1+ parts

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1,364

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,000 parts In-Stock

1+ parts

$6.770

100+ parts

-

1k+ parts

-

10k+ parts

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2,000

$6.770

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AZTECH Wire

Italy . 886 parts In-Stock

1+ parts

$14.080

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-

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886

$14.080

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IDEA Electronic Components Group

UK . 1,599 parts In-Stock

1+ parts

$20.049

100+ parts

-

1k+ parts

$18.044

10k+ parts

-

1,599

$20.049

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$18.044

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Microchip USA

USA . 2,269 parts In-Stock

1+ parts

$23.211

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2,269

$23.211

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MKK Technologies

India . 708 parts In-Stock

1+ parts

$37.700

100+ parts

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708

$37.700

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DigiPath Technology Company

USA . 708 parts In-Stock

1+ parts

$37.700

100+ parts

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708

$37.700

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Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$44.574

100+ parts

$44.128

1k+ parts

$42.345

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50

$44.574

$44.128

$42.345

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Corphita

USA . 2,267 parts In-Stock

1+ parts

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2,267

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Parana Technologies

USA . 1,009 parts In-Stock

1+ parts

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$23.971

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1,009

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$23.971

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Overview

Unlock the full potential of your next project with the SPC560P50L5BEFAY microcontroller by STMicroelectronics. Boasting top-tier quality and reliability from a trusted manufacturer, this cutting-edge device is perfect for a wide range of applications. With advanced features like ADC and DMA channels, as well as PWM capabilities, this microcontroller offers unmatched value and performance. Say goodbye to limitations and hello to endless possibilities with the SPC560P50L5BEFAY microcontroller.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and compact integration of the microcontroller onto circuit boards, making it suitable for small and dense designs.

Maximum Supply Voltage: 3.465 V

The higher maximum supply voltage allows for greater flexibility in power supply options while ensuring the stability and reliability of the microcontroller.

Address Bus Width: 32

A wide address bus width of 32 bits enables the microcontroller to access a larger memory space and handle more complex data processing tasks efficiently.

Package Shape: SQUARE

The square package shape helps optimize board space utilization and facilitates easier placement and routing of the microcontroller within the circuit layout.

Bit Size: 32

With a bit size of 32, the microcontroller can handle operations with larger data sizes and perform calculations more effectively, suitable for demanding applications.

No. of Terminals: 144

Having a high number of terminals allows for more connectivity options and interfacing capabilities, making it versatile for diverse input and output configurations.

Package Style (Meter): FLATPACK

The flatpack package style offers a low profile and compact form factor, which is beneficial for applications where space-saving is a key requirement.

Minimum Supply Voltage: 2.97 V

The lower minimum supply voltage ensures that the microcontroller can operate reliably even with lower power sources, increasing its compatibility with various systems.

ADC Channels: YES

The presence of Analog-to-Digital Converter (ADC) channels allows the microcontroller to interface with analog sensors and signals, expanding its capabilities for monitoring and control.

DMA Channels: YES

Direct Memory Access (DMA) channels enable efficient data transfer between peripherals and memory without CPU intervention, enhancing the microcontroller's performance in data-intensive tasks.

Terminal Position: QUAD

The quad terminal position provides convenient access to multiple pins for connectivity, simplifying board layout and enabling easier soldering and assembly processes.

Width: 22 mm

The compact width of 22 mm allows for space-efficient integration of the microcontroller into tight designs, ideal for applications with size constraints.

External Data Bus Width: 32

A wide external data bus width of 32 bits facilitates faster data transfer rates between the microcontroller and external peripherals, enhancing overall system performance.

Maximum Clock Frequency: 16 MHz

The high maximum clock frequency of 16 MHz enables the microcontroller to execute instructions at a faster rate, enhancing real-time processing capabilities and system responsiveness.

Length: 22 mm

The length of 22 mm complements the width, providing a compact and symmetrical form factor that aids in uniform placement and alignment within the circuit board.

Peripheral IC Type: MICROCONTROLLER, RISC

Having a microcontroller based on Reduced Instruction Set Computing (RISC) architecture ensures streamlined and efficient execution of instructions, leading to better overall performance.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption, high noise immunity, and compatibility with a wide range of operating voltages, making the microcontroller energy-efficient and versatile.

Terminal Form: GULL WING

The gull wing terminal form provides robust mechanical support and reliable electrical connections, enhancing the durability and stability of the microcontroller during operation and handling.

Nominal Supply Voltage: 3.3 V

The standard nominal supply voltage of 3.3 V ensures compatibility with common voltage levels in electronic systems, simplifying integration and power management considerations.

PWM Channels: YES

The availability of Pulse-Width Modulation (PWM) channels allows the microcontroller to generate precise analog output signals with variable duty cycles, enabling accurate control of motors, LEDs, and other devices.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm enables high-density packaging of terminals on the microcontroller, facilitating close proximity integration and efficient signal routing for space-constrained designs.

Speed: 64 rpm

The speed of 64 revolutions per minute (rpm) likely refers to a specific application or motor control capability of the microcontroller, indicating its suitability for tasks requiring precise speed control and feedback.

No. of I/O Lines: 108

Having a high number of Input/Output (I/O) lines provides ample connectivity options for interfacing with external devices and peripherals, making the microcontroller versatile for a wide range of applications and expansion possibilities.

Technical Specifications

Microcontrollers SPC560P50L5BEFAY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

32

Length:

22 mm

No. of I/O Lines:

108

No. of Terminals:

144

PWM Channels:

YES

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

64 rpm

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

22 mm

Peripheral IC Type:

Trade Compliance

SPC560P50L5BEFAY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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