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SPC560P50L5BEAAY

STMicroelectronics

SPC560P50L5BEAAY by STMicroelectronics

STMicroelectronics SPC560P50L5BEAAY microcontroller features 32-bit address and external data bus width, with 144 terminals in a square package. Operating at up to 16 MHz, it offers 524288 ROM words and 40960 RAM bytes. Ideal for industrial applications requiring a RISC-based microcontroller with ADC and PWM channels.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,784 parts In-Stock

1+ parts

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2,784

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Anansix

USA . 2,597 parts In-Stock

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2,597

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Digiode

USA . 1,541 parts In-Stock

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1,541

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 7,000 parts In-Stock

1+ parts

$6.490

100+ parts

-

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-

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7,000

$6.490

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AZTECH Wire

Italy . 1,059 parts In-Stock

1+ parts

$18.050

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-

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1,059

$18.050

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Microchip USA

USA . 2,176 parts In-Stock

1+ parts

$22.232

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2,176

$22.232

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IDEA Electronic Components Group

UK . 839 parts In-Stock

1+ parts

$59.334

100+ parts

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$53.401

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839

$59.334

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$53.401

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Component Stockers USA

USA . 1,396 parts In-Stock

1+ parts

$68.210

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1,396

$68.210

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MKK Technologies

India . 1,896 parts In-Stock

1+ parts

$111.575

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1,896

$111.575

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DigiPath Technology Company

USA . 1,896 parts In-Stock

1+ parts

$111.575

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1,896

$111.575

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Corphita

USA . 3,664 parts In-Stock

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3,664

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Parana Technologies

USA . 725 parts In-Stock

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$70.943

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725

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$70.943

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Overview

Experience unmatched quality and reliability with the SPC560P50L5BEAAY microcontroller by STMicroelectronics. This cutting-edge device offers exceptional performance and versatility in a compact package, making it ideal for a wide range of applications. Whether you're developing automotive systems, industrial controls, or consumer electronics, this microcontroller delivers the power and efficiency you need. Trust in STMicroelectronics' reputation for innovation and excellence, and unlock the full potential of your projects with the SPC560P50L5BEAAY.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body makes the microcontroller durable and resistant to external elements, ensuring a longer lifespan.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto PCBs, enabling a compact and space-saving design for products that use this microcontroller.

Maximum Supply Voltage: 3.465 V

The maximum supply voltage of 3.465V provides flexibility in power supply options while ensuring that the microcontroller operates within safe voltage limits.

Address Bus Width: 32

With a wide address bus width of 32, the microcontroller can efficiently handle large amounts of memory and data, making it suitable for applications that require high processing capabilities.

Bit Size: 32

Having a 32-bit architecture allows for complex calculations and operations to be carried out quickly and accurately, making the microcontroller suitable for advanced tasks.

Power Supplies (V): 5

Support for 5 power supplies (V) provides flexibility in power management, allowing for various power configurations depending on the application requirements.

No. of Terminals: 144

A high number of terminals (144) allow for a wide range of input/output connections, enabling connectivity with various external devices and peripherals for versatile functionality.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105 °C ensures reliable performance even in harsh environmental conditions, making it suitable for industrial applications.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to convert analog signals to digital data, expanding its capability to interface with analog sensors and devices.

DMA Channels: YES

DMA channels allow for direct memory access, optimizing data transfer between peripherals and memory without CPU intervention, enhancing overall system performance.

ROM Words: 524288

The large ROM capacity of 524288 words provides ample space for program storage, allowing for complex algorithms and applications to be implemented on the microcontroller.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller efficient and reliable in various power-sensitive applications.

RAM Bytes: 40960

The generous RAM size of 40960 bytes allows for efficient data storage and manipulation during program execution, enhancing the overall performance of the microcontroller.

PWM Channels: YES

PWM channels enable the generation of precise analog output signals, essential for controlling motors, lights, and other electronic components in a wide range of applications.

ROM Programmability: FLASH

The ROM programmability using FLASH technology allows for easy updates and modifications to the program code, enabling flexibility and future-proofing for the microcontroller.

Technical Specifications

Microcontrollers SPC560P50L5BEAAY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

22 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

108

No. of Terminals:

144

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

40960

ROM Words:

524288

ROM Programmability:

FLASH

Speed:

64 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

88 mA

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

22 mm

Peripheral IC Type:

Trade Compliance

SPC560P50L5BEAAY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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