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SPC560P50L5BEAAR

STMicroelectronics

SPC560P50L5BEAAR by STMicroelectronics

SPC560P50L5BEAAR by STMicroelectronics is a 32-bit microcontroller with 144 terminals, operating at up to 16 MHz. It features 40960 bytes of RAM, Flash ROM programmability, and ADC/DMA channels. Ideal for industrial applications requiring high-speed processing and extensive I/O capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,716 parts In-Stock

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8,716

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Digiode

USA . 3,932 parts In-Stock

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3,932

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Anansix

USA . 2,211 parts In-Stock

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2,211

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,331 parts In-Stock

1+ parts

$5.910

100+ parts

-

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-

10k+ parts

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1,331

$5.910

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AZTECH Wire

Italy . 1,178 parts In-Stock

1+ parts

$15.650

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-

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1,178

$15.650

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Microchip USA

USA . 2,510 parts In-Stock

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$20.270

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2,510

$20.270

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IDEA Electronic Components Group

UK . 659 parts In-Stock

1+ parts

$79.484

100+ parts

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$71.536

10k+ parts

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659

$79.484

-

$71.536

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MKK Technologies

India . 776 parts In-Stock

1+ parts

$149.465

100+ parts

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776

$149.465

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DigiPath Technology Company

USA . 776 parts In-Stock

1+ parts

$149.465

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776

$149.465

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QUARKTWIN TECHNOLOGY LTD

USA . 19,809 parts In-Stock

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Corphita

USA . 3,417 parts In-Stock

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3,417

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Parana Technologies

USA . 2,280 parts In-Stock

1+ parts

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$95.036

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2,280

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$95.036

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Overview

Unleash the power of innovation with the SPC560P50L5BEAAR by STMicroelectronics. This cutting-edge microcontroller offers unparalleled quality and reliability, backed by the trusted reputation of its manufacturer. Ideal for a wide range of applications, this product provides customers with superior performance, efficiency, and flexibility. Embrace the future of technology with the SPC560P50L5BEAAR and experience the value and advantages it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Enables easy and efficient integration onto circuit boards for streamlined manufacturing processes.

Maximum Supply Voltage: 3.465 V

Allows for a stable power supply within the specified range to ensure proper functionality.

Address Bus Width: 32

Offers a wide address bus width for efficient memory access and data transfer.

Bit Size: 32

Provides a high-performance microcontroller with a 32-bit architecture for enhanced processing capabilities.

Power Supplies (V): 5

Supports multiple power supplies to meet various voltage requirements in electronic systems.

No. of Terminals: 144

Provides a sufficient number of terminals for connecting external components and peripherals.

Package Style (Meter): FLATPACK

Offers a compact package style for space-saving and efficient PCB layout designs.

Minimum Supply Voltage: 2.97 V

Ensures reliable operation even at lower supply voltage levels to prevent system malfunctions.

Maximum Operating Temperature: 105 °C

Allows the microcontroller to function optimally in high-temperature environments without overheating.

Minimum Operating Temperature: -40 °C

Maintains performance in extreme cold conditions, making it suitable for a wide range of applications.

ADC Channels: YES

Includes Analog-to-Digital Converter channels for accurate and precise measurement of analog signals.

DMA Channels: YES

Supports Direct Memory Access channels for efficient data transfer without CPU intervention.

Terminal Finish: Matte Tin (Sn) - annealed

Provides a durable and corrosion-resistant terminal finish for long-term reliability.

ROM Words: 524288

Offers a large ROM capacity for storing program instructions and data efficiently.

Width: 22 mm

Compact width size for easy integration into various electronic devices.

External Data Bus Width: 32

Efficient data transfer with a wide external data bus width for fast communication speeds.

Maximum Clock Frequency: 16 MHz

High clock frequency for rapid processing and execution of instructions.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes RISC architecture for efficient and streamlined processing performance.

RAM Bytes: 40960

Provides ample memory space for data storage and manipulation during program execution.

Technology: CMOS

Utilizes CMOS technology for low power consumption and reliable operation.

Terminal Form: GULL WING

Gull wing terminal form for secure and reliable solder connections on PCBs.

Maximum Supply Current: 88 mA

Efficient power consumption with a low supply current rating for energy-efficient operation.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage to ensure consistent and reliable performance.

PWM Channels: YES

Supports Pulse Width Modulation channels for precise control of analog outputs.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and modifications to the program code.

Terminal Pitch: 0.5 mm

Fine terminal pitch for compact design integration and high-density PCB layouts.

Moisture Sensitivity Level (MSL): 3

Moisture-resistant design with MSL rating of 3 for enhanced reliability in humid environments.

Speed: 64 rpm

Fast processing speed at 64 rpm for efficient execution of program instructions.

No. of I/O Lines: 108

Provides a high number of I/O lines for connectivity with external devices and peripherals.

Technical Specifications

Microcontrollers SPC560P50L5BEAAR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

22 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

108

No. of Terminals:

144

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

40960

ROM Words:

524288

ROM Programmability:

FLASH

Speed:

64 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

88 mA

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

22 mm

Peripheral IC Type:

Trade Compliance

SPC560P50L5BEAAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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