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SPC560P50L3CEFAY

STMicroelectronics

SPC560P50L3CEFAY by STMicroelectronics

SPC560P50L3CEFAY from STMicroelectronics is a 32-bit automotive microcontroller with a max supply voltage of 3.465V and operates b/w -40 °C to 125 °C. It features 100 terminals, 25 external interrupts, and supports CAN/SPI connectivity. Ideal for automotive applications requiring robust performance and reliability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,811 parts In-Stock

1+ parts

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4,811

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Digiode

USA . 2,970 parts In-Stock

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2,970

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Anansix

USA . 2,479 parts In-Stock

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2,479

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LIBRA Elektronik GmbH

Germany . 10 parts In-Stock

1+ parts

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 8,000 parts In-Stock

1+ parts

$5.375

100+ parts

-

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8,000

$5.375

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AZTECH Wire

Italy . 1,036 parts In-Stock

1+ parts

$13.690

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-

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1,036

$13.690

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IDEA Electronic Components Group

UK . 444 parts In-Stock

1+ parts

$34.430

100+ parts

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$30.987

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444

$34.430

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$30.987

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MKK Technologies

India . 1,429 parts In-Stock

1+ parts

$64.744

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1,429

$64.744

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DigiPath Technology Company

USA . 1,429 parts In-Stock

1+ parts

$64.744

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1,429

$64.744

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Kepictronics

USA . 15,000 parts In-Stock

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15,000

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Corphita

USA . 3,520 parts In-Stock

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3,520

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Microchip USA

USA . 2,880 parts In-Stock

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2,880

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Parana Technologies

USA . 1,273 parts In-Stock

1+ parts

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100+ parts

$41.166

1k+ parts

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1,273

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$41.166

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Overview

Unlock the power of innovation with the SPC560P50L3CEFAY microcontroller from STMicroelectronics, a trusted leader in cutting-edge technology. Designed for automotive applications, this robust microcontroller ensures high performance and reliability, even in extreme conditions. With advanced features like multiple ADC channels and extensive connectivity options, it empowers your projects with unmatched efficiency and precision. Elevate your designs today and experience the STMicroelectronics advantage!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy construction ensures reliable protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

The surface mount feature allows for efficient use of PCB space and simplifies the manufacturing process.

Maximum Supply Voltage: 3.465 V

A maximum supply voltage of 3.465 V provides a good balance between performance and power consumption for embedded systems.

Address Bus Width: 32

A 32-bit address bus width enables access to a larger memory space, enhancing the capabilities for complex applications.

Package Shape: SQUARE

The square package shape optimizes space on PCBs and enhances thermal performance.

Bit Size: 32

A 32-bit architecture allows for processing of larger data types and improves overall computational efficiency.

No. of Terminals: 100

With 100 terminals, this microcontroller offers extensive connectivity options for peripherals and external devices.

Package Style (Meter): FLATPACK

The flatpack style aids in easy integration and efficient heat dissipation in compact designs.

Minimum Supply Voltage: 2.97 V

A low minimum supply voltage extends the operational flexibility in battery-powered applications.

Maximum Operating Temperature: 125 °C

The capability to operate at high temperatures makes it suitable for demanding automotive environments.

CPU Family: SPC56

The SPC56 family is designed specifically for automotive applications, ensuring robust performance and reliability.

No. of External Interrupts: 25

A higher number of external interrupts allows for responsive control and real-time processing in complex systems.

Minimum Operating Temperature: -40 °C

The broad temperature range ensures functionality in harsh environments, making it ideal for automotive and industrial applications.

ADC Channels: YES

Integrated ADC channels facilitate immediate analog signal processing, enhancing the microcontroller's versatility.

DMA Channels: YES

Direct Memory Access (DMA) support increases data transfer efficiency, freeing the CPU for other tasks.

Terminal Position: QUAD

Quad terminal positioning contributes to improved signal integrity and reduces parasitic effects.

ROM Words: 524288

A high ROM capacity supports larger applications and complex firmware without the need for additional memory.

Width: 14 mm

A compact width facilitates the design of space-efficient circuits within smaller enclosures.

Data EEPROM Size: 64K

The substantial EEPROM size allows for data storage without sacrificing speed, beneficial for applications needing persistent data.

Boundary Scan: YES

Boundary scan capabilities provide easier testing and debugging processes during product development.

External Data Bus Width: 32

A 32-bit external data bus width enables high-speed communication with external devices.

Peripherals: DMA(16), PWM(8), TEMPERATURE SENSOR, TIMER(14), WDT

A rich array of built-in peripherals enhances functionality, enabling sophisticated control and monitoring applications.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz provides sufficient speed for a variety of real-time applications.

Length: 14 mm

The compact length allows for tight packing in multi-component assemblies.

Temperature Grade: AUTOMOTIVE

Certification for automotive use guarantees reliability in critical applications subjected to extreme conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture optimizes execution speed and efficiency, making it ideal for performance-critical tasks.

RAM Bytes: 40960

Ample RAM size supports complex applications and multitasking capabilities.

Technology: CMOS

CMOS technology enables lower power consumption and higher integration, making it suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and manufacturing, improving production efficiency.

Analog To Digital Convertors: 13-Ch 10-Bit (2)

The presence of multiple ADC channels enhances the microcontroller's ability to handle diverse sensor inputs.

Nominal Supply Voltage: 3.3 V

Operating at a nominal voltage of 3.3 V aligns with standard logic levels in many modern systems, promoting compatibility.

No. of DMA Channels: 16

Having 16 DMA channels allows for efficient data handling and processing, ideal for high-throughput applications.

PWM Channels: YES

Including PWM channels enables precise control over motor speed and brightness in lighting applications.

Connectivity: CAN, LIN(2), SPI(4)

Diverse connectivity options ensure interoperability in automotive and industrial networks, enhancing system integration.

ROM Programmability: FLASH

Flash programmability allows for easy updates and reconfiguration of firmware, enhancing long-term device utility.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch is ideal for modern compact designs, allowing for more terminals in a given area.

Format: FIXED POINT

The fixed-point format can simplify calculations and processing in applications requiring constant numerical precision.

Speed: 64 rpm

A speed rating of 64 rpm suggests suitability for control applications requiring reliable and consistent operation.

On Chip Program ROM Width: 8

The 8-bit width for on-chip ROM supports a variety of microcontroller programming models and optimizations.

No. of I/O Lines: 67

With 67 I/O lines, the microcontroller offers extensive interfacing options, making it suitable for complex applications.

Technical Specifications

Microcontrollers SPC560P50L3CEFAY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

CPU Family:

SPC56

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

NO

No. of DMA Channels:

16

No. of External Interrupts:

25

No. of I/O Lines:

67

No. of Serial I/Os:

0

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100(UNSPEC)

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

RAM Bytes:

40960

ROM Words:

524288

ROM Programmability:

FLASH

Speed:

64 rpm

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN, LIN(2), SPI(4)

Peripherals:

DMA(16), PWM(8), TEMPERATURE SENSOR, TIMER(14), WDT

Analog To Digital Convertors:

13-Ch 10-Bit (2)

Trade Compliance

SPC560P50L3CEFAY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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