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SPC560P50L3BEFAY

STMicroelectronics

SPC560P50L3BEFAY by STMicroelectronics

SPC560P50L3BEFAY by STMicroelectronics is a 32-bit microcontroller with 32-bit external data bus width and max clock frequency of 16 MHz. It features ADC and DMA channels, suitable for applications requiring high-speed processing and precise analog-to-digital conversion. Ideal for automotive control systems due to its robust design and advanced peripheral integration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,196 parts In-Stock

1+ parts

-

100+ parts

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3,196

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Digiode

USA . 972 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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972

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Anansix

USA . 713 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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713

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 4,790 parts In-Stock

1+ parts

$5.120

100+ parts

-

1k+ parts

-

10k+ parts

-

4,790

$5.120

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-

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AZTECH Wire

Italy . 860 parts In-Stock

1+ parts

$13.760

100+ parts

-

1k+ parts

-

10k+ parts

-

860

$13.760

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-

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Microchip USA

USA . 1,728 parts In-Stock

1+ parts

$17.487

100+ parts

-

1k+ parts

-

10k+ parts

-

1,728

$17.487

-

-

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Advanced Electronics

New Zealand . 1,500 parts In-Stock

1+ parts

$25.006

100+ parts

$24.756

1k+ parts

$23.756

10k+ parts

-

1,500

$25.006

$24.756

$23.756

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IDEA Electronic Components Group

UK . 1,310 parts In-Stock

1+ parts

$60.754

100+ parts

-

1k+ parts

$54.679

10k+ parts

-

1,310

$60.754

-

$54.679

-

MKK Technologies

India . 686 parts In-Stock

1+ parts

$114.244

100+ parts

-

1k+ parts

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10k+ parts

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686

$114.244

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DigiPath Technology Company

USA . 686 parts In-Stock

1+ parts

$114.244

100+ parts

-

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686

$114.244

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Corphita

USA . 4,402 parts In-Stock

1+ parts

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4,402

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Parana Technologies

USA . 504 parts In-Stock

1+ parts

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100+ parts

$72.641

1k+ parts

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10k+ parts

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504

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$72.641

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Overview

Discover the cutting-edge SPC560P50L3BEFAY microcontroller by STMicroelectronics, delivering top-notch quality and reliability. Ideal for a wide range of applications, this advanced product offers customers unparalleled value and benefits. With its high-performance features and innovative design, this microcontroller sets itself apart from the competition, providing users with seamless functionality and efficiency. Trust in STMicroelectronics to deliver excellence in technology with the SPC560P50L3BEFAY.

Feature Benefit Bullets

Surface Mount - YES

Surface mount technology makes it easy to mount the microcontroller on a circuit board, saving space and allowing for automated assembly, which is efficient for mass production.

Maximum Supply Voltage - 3.465 V

A higher maximum supply voltage provides flexibility in powering the microcontroller and allows for compatibility with various power sources.

Address Bus Width - 32

A wider address bus width allows for accessing a larger memory space, which is beneficial for applications requiring extensive data storage and processing capabilities.

Package Shape - SQUARE

The square package shape ensures uniformity in size and facilitates placement on the circuit board, contributing to a neat and organized layout.

Bit Size - 32

A 32-bit architecture enables efficient data handling and processing, making the microcontroller suitable for tasks that involve complex computations and operations.

No. of Terminals - 100

Having a higher number of terminals provides ample connectivity options for interfacing with external components, sensors, and peripherals, making the microcontroller versatile and adaptable to various applications.

Package Style (Meter) - FLATPACK

The flatpack package style offers a low profile and compact design, ideal for space-constrained applications where height limitations are a concern.

Minimum Supply Voltage - 2.97 V

A lower minimum supply voltage allows for operation in energy-constrained environments and enhances power efficiency, making the microcontroller suitable for battery-powered devices.

ADC Channels - YES

Analog-to-digital converter (ADC) channels enable the microcontroller to interface with analog sensors and convert real-world signals into digital data, expanding its capability to interact with the physical environment.

DMA Channels - YES

Direct Memory Access (DMA) channels facilitate efficient data transfer between memory and peripherals without CPU intervention, improving overall system performance and responsiveness.

Terminal Position - QUAD

The quad terminal position allows for easy connection and soldering of the microcontroller, ensuring secure and reliable electrical connections in the circuit.

Width - 14 mm

A compact width dimension enables the microcontroller to fit within tight layouts and small form factor designs, making it suitable for space-limited applications.

External Data Bus Width - 32

A wider external data bus width enhances data throughput and communication speed between the microcontroller and external devices, improving overall system performance.

Maximum Clock Frequency - 16 MHz

A higher maximum clock frequency allows for faster execution of instructions and tasks, increasing the processing speed and efficiency of the microcontroller in demanding applications.

Length - 14 mm

With a compact length dimension, the microcontroller can be accommodated in tight spaces and compact designs, enabling its use in applications with size constraints.

Peripheral IC Type - MICROCONTROLLER, RISC

Based on Reduced Instruction Set Computing (RISC) architecture, this microcontroller offers streamlined and efficient instruction execution, enhancing performance and speed in processing tasks.

Technology - CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology provides low power consumption, high noise immunity, and compatibility with a wide range of voltages, making the microcontroller energy-efficient and versatile.

Terminal Form - GULL WING

The gull wing terminal form allows for easy soldering and handling during assembly, ensuring robust electrical connections and mechanical stability in the circuit.

Nominal Supply Voltage - 3.3 V

The nominal supply voltage of 3.3 V ensures consistent and reliable operation of the microcontroller within the specified voltage range, promoting stable performance in diverse operating conditions.

PWM Channels - YES

Pulse Width Modulation (PWM) channels enable precise control of output signals, such as motor speed and LED brightness, adding versatility and flexibility to the microcontroller for applications requiring modulation techniques.

Terminal Pitch - 0.5 mm

With a fine terminal pitch of 0.5 mm, the microcontroller offers high-density packaging and increased connectivity options, allowing for intricate circuit designs and miniaturization.

Speed - 64 rpm

The speed of 64 revolutions per minute (rpm) indicates the rotational speed or performance capability of the microcontroller in executing tasks and processing data, highlighting its operational efficiency.

No. of I/O Lines - 67

Having a significant number of input/output (I/O) lines offers extensive interfacing options for connecting to external devices, sensors, and communication interfaces, enhancing the microcontroller's versatility and compatibility with diverse peripherals.

Technical Specifications

Microcontrollers SPC560P50L3BEFAY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

32

Length:

14 mm

No. of I/O Lines:

67

No. of Terminals:

100

PWM Channels:

YES

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

64 rpm

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SPC560P50L3BEFAY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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